Home
About
ECTC
Calendar
Technical
Program
Technology
Corner Exhibits
Author
Information
Location
Professional
Dev. Courses
Registration
Sponsors
Electronic Components and Technology Conference
Technical Program
58th ECTC Final Program (PDF)
Advanced Packaging
Session 1: Advances in Flip Chip Packaging
Session 7: Wafer Level Packaging and Processing
Session 13: Advanced Packaging Technologies
Session 19: Embedded Device and MEMS Technology
Session 25: TSV Processing, Characterization and Integration
Session 31: Processes for 3D Integration
Electronic Components & RF
Session 12: Filters and TSV-based RF Devices
Session 17: RF Packaging, Material, and Charaterization
Session 35: Embedded RF Devices and Modules
Emerging Technologies
Session 23: Organic and Bio Electronics
Session 30: Nano and Green Electronics
Interconnections
Session 2: 3D/TSV Innovation and Characterization
Session 8: Wirebond and Alternative Interconnect
Session 14: 2nd-Level Interconnect
Session 20: Interconnection and Bonding for 3D/TSV
Session 32: Fine Pitch Flip Chip
Assembly & Manufacturing Technology
Session 24: Manufacturing Aspects of 3D
Session 26: Assembly Challenges and Solutions
Session 36: Chip Package Interaction: Low-k, ULK, BGA
Materials & Processing
Session 4: Pb-Free Solder and Intermetallic Compounds
Session 10: Bonding Interconnects
Session 18: Materials and Processing for 3D Packaging
Session 22: Nanotechnology and Advanced Packaging
Session 28: Adhesives, Underfill and Encapsulants
Modeling & Simulation
Session 3: Interface and Warpage
Session 9: Electrical, Thermal and Reliability Modeling
Session 15: High-Speed, Circuit, and 3D Simulation
Session 27: Modeling Time-Dependent Phenomena
Session 33: High-Speed Characterization and Signaling
Optoelectronics
Session 6: Optical Interconnects/Fiber Optics to the Board
Session 16: High-Power Lasers and LEDs
Posters
Session 37: Posters
Session 38: Posters
Session 39: Student Posters
Applied Reliability
Session 5: Advances in Predictive Reliability
Session 11: Thermal Mechanical Characterization of Solders
Session 21: Solder Joint Reliability Characterization
Session 29: Innovations in Reliability Characterization
Session 34: Solder and Interconnect Enhancement