Technical Program

58th ECTC Advance Program (PDF)

Advanced Packaging
Session 1: 3D Integration
Session 7: Wafer Level Packaging
Session 13: 3D and Through Silicon Via
Session 19: MEMS Packaging
Session 25: Package-on-Package Advanced Assembly
Session 31: Flip-Chip Packaging
Components & RF
Session 4: RF Components
Session 16: Integrated Passives
Session 28: Modeling and RF Characterization
Emerging Technologies
Session 10: Nano Technology
Session 30: Biomedical and Emerging Technologies
Interconnections
Session 2: Flip-Chip Interconnections
Session 8: Bump Electromigration and Reliability
Session 20: 3D and Through Silicon Via Interconnects
Session 26: Interconnect Technologies for Electrical Performance
Session 32: Non-Solder First Level Interconnect
Manufacturing Technology
Session 9: Packaging, Stacking and Planarity
Session 22: Manufacturing Technology of Advanced Packages
Session 34: Sn Whisker Challenges and Wafer Level Processing
Materials & Processing
Session 5: Adhesives
Session 11: Pb-Free Solders
Session 17: Advanced Substrates
Session 29: Advanced Materials for Interconnect
Session 35: Materials for 3D Integration
Modeling & Simulation
Session 12: Systems and Technology
Session 15: Signal and Power Integrity
Session 24: Shock and Thermo-Mechanics
Session 36: Warpage and Delamination
Optoelectronics
Session 6: Optical Interconnections
Session 18: LEDs for Lighting and Display Applications
Session 23: High Power Devices and Manufacturing Techniques
Posters
Session 37: Posters
Session 38: Posters
Session 39: Student Posters
Quality & Reliability
Session 3: Lead Free Solder Joint Reliability
Session 14: Innovative Test Methods for Package reliability I
Session 21: Innovative Test Methods for Package Reliability II
Session 27: Drop Impact Reliability
Session 33: Characterization and Reliability of Area Array Packages