Technical Program
Thursday, June 03, 2010
Session 13: Advanced Packaging Technologies
8:00 a.m. - 11:40 a.m.
Committee: Advanced Packaging
Concorde A
Session Co-Chairs:
|
Sam Karikalan Broadcom Corporation T +1-949-926-7296 F +1-949-926-9261 samk@broadcom.com |
Jeffrey A. Knight Endicott Interconnect Technologies, Inc. T +1-607-755-1105 F +1-607-755-6400 jeff.knight@eitny.com |
Papers:
1. 8:00 AM - Chip-Package-Board Co-Design of a 45nm 8-Core Enterprise Xeon Processor
Arun Chandrasekhar- Intel Corporation
David Ayers- Intel Corporation
Farzaneh Yahyaei-Moayyed- Intel Corporation
Chung-Chi Huang- Intel Corporation
2. 8:25 AM - Advanced Surface Laminar Circuit Using New Composite Materials
Katsura Hayashi- Kyocera SLC Technologies Corporation
Kimihiro Yamanaka- Kyocera SLC Technologies Corporation
Kaoru Kobayashi- Kyocera SLC Technologies Corporation
Yoshihiro Hosoi- Kyocera SLC Technologies Corporation
Masahiro Fukui- Kyocera SLC Technologies Corporation
3. 8:50 AM - Large Area Embedding for Heterogeneous System Integration
T. Braun- Fraunhofer IZM
K.-F. Becker- Fraunhofer IZM
L. Boettcher- Fraunhofer IZM
J. Bauer- Fraunhofer IZM
T. Thomas- Technische Universität Berlin
M. Koch- Fraunhofer IZM
R. Kahle- Fraunhofer IZM
A. Ostmann- Fraunhofer IZM
R. Aschenbrenner- Fraunhofer IZM
H. Reichl- Technische Universität Berlin
M. Bründel- Robert Bosch GmbH
J.F. Haag- Robert Bosch GmbH
4. 10:00 AM - Through-Package-Via Formation and Metallization of Glass Interposers
Vijay Sukumaran- Georgia Institute of Technology
Qiao Chen- Georgia Institute of Technology
Fuhan Liu- Georgia Institute of Technology
Nitesh Kumbhat- Georgia Institute of Technology
Tapobrata Bandyopadyay- Georgia Institute of Technology
Hunter Chan- Georgia Institute of Technology
Sunghwan Min- Georgia Institute of Technology
Christian Nopper- STMicroelectronics
Venky Sundaram- Georgia Institute of Technology
Rao Tummala- Georgia Institute of Technology
5. 10:25 AM - Solid-State Bonding of Silicon Chips to Silver Layer Plated on Copper Substrate
Chu-Hsuan Sha- University of California, Irvine
Chin C. Lee- University of California, Irvine
6. 10:50 AM - Development of Rigid-Flex and Multilayer Flex for Electronic Packaging
Rabindra N. Das- Endicott Interconnect Technologies, Inc.
Frank D. Egitto- Endicott Interconnect Technologies, Inc.
Bill Wilson- Endicott Interconnect Technologies, Inc.
Mark D. Poliks- Endicott Interconnect Technologies, Inc.
Voya R. Markovich- Endicott Interconnect Technologies, Inc.
7. 11:15 AM - Development and Reliability of Ultra-Thin Chip on Plastic Bonding for Flexible Liquid Crystal Displays
Yu-Wei Huang- Industrial Technology Research Institute (ITRI)
Su-Tsai Lu- Industrial Technology Research Institute (ITRI)