Technical Program
Friday, June 04, 2010
Session 26: Assembly Challenges and Solutions
8:00 a.m. - 11:40 a.m.
Committee: Assembly & Manufacturing Technology
Versailles 1 & 2
Session Co-Chairs:
|
Sylvain Ouimet IBM Corporation T +1-450-534-6690 F +1-450-534-6800 souimet@ca.ibm.com |
Jie Xue Cisco Systems, Inc. T +1-408-853-0199 F +1-408-527-1298 jixue@cisco.com |
Papers:
1. 8:00 AM - Methodology for Predicting C4 Non-Wets During the Chip Attach Process
Vijay D. Khanna- IBM Corporation
Sri M. Sri-Jayantha- IBM Corporation
2. 8:25 AM - Studies on Various 2-Metal Chip-on-Flex (COF) Packaging Methods
Kyoung-Lim Suk- KAIST
Jong-Soo Kim- STEMCO, Ltd.
Kyung-Wook Paik- KAIST
3. 8:50 AM - Sensitivity Analysis of Pb Free Reflow Profile Parameters Toward Flip Chip on Silicon Assembly Yield, Reliability and Intermetallic Compound Characteristics
Zhaozhi Li- Auburn University
Sangil Lee- Georgia Institute of Technology
Brian J. Lewis- Engent, Inc.
Paul N. Houston- Engent, Inc.
Daniel F. Baldwin- Georgia Institute of Technology
Gene Stout- Flip Chip International, LLC
Ted Tessier- Flip Chip International, LLC
John L. Evans- Auburn University
4. 10:00 AM - Assembly and Reliability of Advanced Packaging Technologies in High Speed Networking Applications
John Savic- Cisco Systems, Inc.
Percy Aria- Cisco Systems, Inc.
Judy Priest- Cisco Systems, Inc.
Mudasir Ahmad- Cisco Systems, Inc.
Ken Hubbard- Cisco Systems, Inc.
Real Pomerleau- Cisco Systems, Inc.
Sue Teng- Cisco Systems, Inc.
Mohan Nagar- Cisco Systems, Inc.
Jie Xue- Cisco Systems, Inc.
5. 10:25 AM - Non-Wet Solder Joint Detection in Processor Sockets and BGA Assemblies
Asaad F. Said- Arizona State University
Bonnie L. Bennett- Intel Corporation
Francis Toth- Intel Corporation
Lina J. Karam- Arizona State University
Jeff Pettinato- Intel Corporation
6. 10:50 AM - Cu Wire Bonding for Fine Pitch 65nm Silicon Integrated Circuits
Qwai Low- LSI Corporation
John Osenbach- LSI Corporation
Yong Seok Yang- Amkor Technology, Korea
Kyeong Sool Seong- Amkor Technology, Korea
Seok Ho Na- Amkor Technology, Korea
7. 11:15 AM - Study of a Practicable Wire Bonding Method for Applying Copper Wire Bond to Large-Scale Integrated Circuits
Yingwei Jiang- Tianjin Polytechnic University; Freescale Semiconductor, Inc.
Ronglu Sun- Tianjin Polytechnic University
Sonder Wang- Freescale Semiconductor, Inc.
Ding Min- Freescale Semiconductor, Inc.
Weimin Chen- Freescale Semiconductor, Inc.