Technical Program
Friday, June 04, 2010
Session 27: Modeling Time-Dependent Phenomena
8:00 a.m. - 11:40 a.m.
Committee: Modeling & Simulation
Versailles 3 & 4
Session Co-Chairs:
|
Xuejun Fan Lamar University T +1-409-880-7792 F +1-409-880-8121 xuejun.fan@lamar.edu |
L. J. Ernst Delft University of Technology T +31-15-278-6519 F +31-15-278-2150 l.j.ernst_tudelft@xs4all.nl |
Papers:
1. 8:00 AM - Novel Sequential Electro-Chemical and Thermo-Mechanical Simulation Methodology for Annular Through-Silicon-Via (TSV) Design
B. Xie- ASTRI
X.Q. Shi- ASTRI
C.H. Chung- ASTRI
S.W.R. Lee- ASTRI
2. 8:25 AM - A Multidisciplinary Approach for Effective Packaging of MEMS Accelerometer
Jian Wen- Freescale Semiconductor
Vijay Sarihan- Freescale Semiconductor
Bill Myers- Freescale Semiconductor
Gary Li- Freescale Semiconductor
3. 8:50 AM - Predicting Crack Initiation and Propagation Using XFEM, CZM and Peridynamics: A Comparative Study
Abigail Agwai- University of Arizona
Ibrahim Guven- University of Arizona
Erdogan Madenci- University of Arizona
4. 10:00 AM - Board Level Drop Impact Simulation and Test for Development of Wafer Level Chip Scale Package
Yong Liu- Fairchild Semiconductor Corporation
Qiuxiao Qian- Fairchild Semiconductor Corporation
Jihwan Kim- Fairchild Semiconductor Corporation
Stephen Martin- Fairchild Semiconductor Corporation
5. 10:25 AM - Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock
Pradeep Lall- Auburn University
Prashant Gupta- Auburn University
Dhananjay Panchagade- Auburn University
6. 10:50 AM - Investigation of the Solder Joint Fatigue Life in Combined Vibration and Thermal Cycling Tests
Tilman Eckert- Technische Universität Berlin
Michael Krüger- Technische Universität Berlin
Wolfgang H. Müller- Technische Universität Berlin
Nils F. Nissen- Fraunhofer IZM
Herbert Reichl- Technische Universität Berlin
7. 11:15 AM - The Effect of Copper Trace Routing on the Drop Test Reliability of BGA Modules
Frank Kraemer- Fraunhofer CSP
Sven Rzepka- Fraunhofer ENAS
Steffen Wiese- Fraunhofer CSP
Jens Lienig- Technische Universität Dresden