Technical Program

Friday, June 04, 2010

Session 28: Adhesives, Underfill and Encapsulants
8:00 a.m. - 11:40 a.m.
Committee: Materials & Processing
Champagne 2

Session Co-Chairs:

Mark Poliks
Endicott Interconnect Technologies, Inc.
T +1-607-755-2064
F +1-607-755-1187
Mark.Poliks@eitny.com

Don Frye
Henkel Corporation
T +1-310-605-2784
F +1-310-638-0128
donald.frye@us.henkel.com

Papers:

1. 8:00 AM - Novel PDMS(Silicone)-in-PDMS(Silicone): Low Cost Flexible Electronics without Metallization
Joshua C. Agar- Georgia Institute of Technology
Katy J. Lin- Georgia Institute of Technology
Rongwei Zhang- Georgia Institute of Technology
Jessica Durden- Georgia Institute of Technology
Kyoung-Sik Moon- Georgia Institute of Technology
C.P. Wong- Georgia Institute of Technology

2. 8:25 AM - Nanofluids, Nanogels and Nanopastes for Electronic Packaging
Rabindra N. Das- Endicott Interconnect Technologies, Inc.
Varaprasad Calmidi- Endicott Interconnect Technologies, Inc.
Mark D. Poliks- Endicott Interconnect Technologies, Inc.
Voya R. Markovich- Endicott Interconnect Technologies, Inc.

3. 8:50 AM - Novel Adhesive Development for CMOS-Compatible Thin Wafer Handling
K. Tamura- Tokyo Ohka Kogyo Co., Ltd.
K. Nakada- Tokyo Ohka Kogyo Co., Ltd.
N. Taneichi- Tokyo Ohka Kogyo Co., Ltd.
P. Andry- IBM Corporation
J. Knickerbocker- IBM Corporation
C. Rosenthal- Tokyo Ohka Kogyo Co., Ltd.

4. 10:00 AM - Thiol Based Self Assembly Molecular Layer for Reliable Cu-Epoxy Interface
Cell K.Y. Wong- Hong Kong University of Science and Technology
Peng He- Hong Kong University of Science and Technology
Matthew M.F. Yuen- Hong Kong University of Science and Technology

5. 10:25 AM - Molded Underfill (MUF) Technology for Flip Chip Packages in Mobile Applications
M. Joshi- STATS ChipPAC, Inc.
R. Pendse- STATS ChipPAC, Inc.
V. Pandey- STATS ChipPAC, Inc.
T.K. Lee- STATS ChipPAC, Inc.
I.S. Yoon- STATS ChipPAC, Inc.
J.S. Yun- STATS ChipPAC, Inc.
Y.C. Kim- STATS ChipPAC, Inc.
H.R. Lee- STATS ChipPAC, Inc.

6. 10:50 AM - Photo-Patternable Non-Conductive Adhesives (NCAs) for Electronic Packaging Applications
Il Kim- KAIST
Young Ook Cho- KAIST
Jin-Baek Kim- KAIST
Kyung-Wook Paik- KAIST

7. 11:15 AM - Generalized Hybrid Modeling to Estimate Chemical Shrinkage and Modulus Evolution at Arbitrary Temperatures
Yong Wang- University of Maryland
Bongtae Han- University of Maryland