Technical Program
Friday, June 04, 2010
Session 29: Innovations in Reliability Characterization
8:00 a.m. - 11:40 a.m.
Committee: Applied Reliability
Champagne 1
Session Co-Chairs:
|
Keith Newman Sun Microsystems T +1-408-404-6886 F +1-408-404-6886 keith.newman@sun.com |
Sridhar Canumalla Microsoft Corporation T +1-425-538-4060 F scanuma@microsoft.com |
Papers:
1. 8:00 AM - Direct Measurement of Local Stress in First-Level Flip-Chip Organic Packages
Ijeoma Nnebe- IBM Corporation
Soojae Park- IBM Corporation
Claudius Feger- IBM Corporation
2. 8:25 AM - TSV Stress Testing and Modeling
Masazumi Amagai- Texas Instruments, Japan
Yutaka Suzuki- Texas Instruments, Japan
3. 8:50 AM - Characterization of Microprocessor Chip Stress Distributions During Component Packaging and Thermal Cycling
Jordan Roberts- Auburn University
Safina Hussain- Auburn University
M. Kaysar Rahim- Auburn University
Mohammad Motalab- Auburn University
Jeffrey C. Suhling- Auburn University
Richard C. Jaeger- Auburn University
Pradeep Lall- Auburn University
Ron Zhang- Oracle
4. 10:00 AM - Micro Structure Analysis for System in Package Components - Novel Tools for Fault Isolation, Target Preparation, and High-Resolution Material Diagnostics
M. Petzold- Fraunhofer Institute for Mechanics of Materials
F. Altmann- Fraunhofer Institute for Mechanics of Materials
M. Krause- Fraunhofer Institute for Mechanics of Materials
R. Salzer- Fraunhofer Institute for Mechanics of Materials
C. Schmidt- Fraunhofer Institute for Mechanics of Materials
S. Martens- Infineon Technologies AG
W. Mack- Infineon Technologies AG
H. Dömer- Carl Zeiss NTS GmbH
A. Nowodzinski- CEA-LETI Minatec
5. 10:25 AM - Micromechanics and Damage Processes in Interconnect Structures
A.W. Hsing- Stanford University
A.V. Kearney- Cisco Systems
L. Li- Cisco Systems
J. Xue- Cisco Systems
M. Brillhart- Cisco Systems
R.H. Dauskardt- Stanford University
6. 10:50 AM - Electro Optical Terahertz Pulse Reflectometry - An Innovative Fault Isolation Tool
Yongming Cai- Intel Corporation
Zhiyong Wang- Intel Corporation
Rajen Dias- Intel Corporation
Deepak Goyal- Intel Corporation
7. 11:15 AM - Multi-Terminal Low Inductance Capacitor Delamination Failure
Steve Ostrander- IBM Corporation
Jennifer Muncy- IBM Corporation
Joseph Ross- IBM Corporation
Sylvain Ouimet- IBM Corporation
Lauren Pfeifer- Alfred University