Technical Program
Wednesday, June 02, 2010
Session 3: Interface and Warpage
8:00 a.m. - 11:40 a.m.
Committee: Modeling & Simulation
Versailles 3 & 4
Session Co-Chairs:
|
Yong Liu Fairchild Semiconductor Corporation T +1-207-761-3155 F +1-207-761-6339 yong.liu@fairchildsemi.com |
Tony Mak Middlesex Comm. College T +1-334-625-8669 F +1-781-275-2254 t.mak@ieee.org |
Papers:
1. 8:00 AM - A Novel Method for Strip Level Warpage Simulation of PoP Package During Assembly Processes
Wei Lin- Amkor Technology, Inc.
J.H. Na- Amkor Technology, Inc.
2. 8:25 AM - Digital-Image Correlation and XFEM Based Shock-Reliability Models for Leadfree and Advanced Interconnects
Pradeep Lall- Auburn University
Mandar Kulkarni- Auburn University
Arjun Angral- Auburn University
Dhananjay Panchagade- Auburn University
Jeff Suhling- Auburn University
3. 8:50 AM - Thermomechanical Modeling and Evaluation of the Impacts of BGA Warpage on Low-Cycle Solder Fatigue
Karl J.L. Geisler- General Dynamics Advanced Information Systems
Michael M. Holahan- General Dynamics Advanced Information Systems
4. 10:00 AM - Delamination and Combined Compound Cracking of EMC-Copper Interfaces
A. Xiao- Delft University of Technology
G. Schlottig- Infineon Technologies AG
H. Pape- Infineon Technologies AG
B. Wunderle- Fraunhofer IZM
K.M.B. Jansen- Delft University of Technology
L.J. Ernst- Delft University of Technology
5. 10:25 AM - Effect of the Die Edge and Multiple Delaminations on the Mechanics of Delamination in a PQFP
Siow Ling Ho- National University of Singapore
Jiyin Yu- National University of Singapore
Andrew A.O. Tay- National University of Singapore
6. 10:50 AM - A Study of Highly Crosslinked Epoxy Molding Compound and Its Interface with Copper Substrate by Molecular Dynamic Simulations
Shaorui Yang- Northwestern University
Feng Gao- Northwestern University
Jianmin Qu- Northwestern University
7. 11:15 AM - Molecular Modeling of a 3D-Crosslinked Epoxy Resin and Its Interface to native SiO2 – Property Prediction in Microelectronic Packaging
O. Hölck- Fraunhofer IZM
E. Dermitzaki- Fraunhofer IZM
B. Wunderle- Fraunhofer IZM, TU Chemnitz
J. Bauer- Fraunhofer IZM
B. Michel- Fraunhofer IZM
H. Reichl- Technische Universität Berlin