Technical Program

Wednesday, June 02, 2010

Session 1: Advances in Flip Chip Packaging
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Concorde A

Session Co-Chairs:

Raj N. Master
Microsoft Corporation
T +1-650-693-0849
F
rajm@microsoft.com

Paul M. Harvey
IBM Corporation
T +1-512-286-6554
F +1-512-838-1272
PMHarvey@us.ibm.com

Papers:

1. 8:00 AM - Low Cost Flip Chip (LCFC): An Innovative Approach for Breakthrough Reduction in Flip Chip Package Cost
R. Pendse- STATS ChipPAC, Inc.
C.H. Cho- STATS ChipPAC, Inc.
M. Joshi- STATS ChipPAC, Inc.
K.M. Kim- STATS ChipPAC, Inc.
P. Kim- STATS ChipPAC, Inc.
S.H. Kim- STATS ChipPAC, Inc.
S.S. Kim- STATS ChipPAC, Inc.
H.T. Lee- STATS ChipPAC, Inc.
K. Lee- STATS ChipPAC, Inc.
R. Martin- STATS ChipPAC, Inc.
A. Murphy- STATS ChipPAC, Inc.
V. Pandey- STATS ChipPAC, Inc.

2. 8:25 AM - Cost Comparison for Flip Chip, Gold Wire Bond, and Copper Wire Bond Packaging
Chet A. Palesko- SavanSys Solutions, LLC
E. Jan Vardaman- TechSearch International, Inc

3. 8:50 AM - Impact of Usage Conditions on Solder Joint Fatigue Life
Zhen Zhang- Microsoft Corporation
S.B. Park- Binghamton University
Krishna Darbha- Microsoft Corporation
Raj N. Master- Microsoft Corporation

4. 10:00 AM - Fine-Pitch, Cost Effective Flip Chip Package Development: TAB-BGA
Soojeoung Park- Samsung Electronics
Sanggui Jo- Samsung Electronics
Jiyong Park- Samsung Electronics
Hyonchol Kim- Samsung Electronics
Kawngjin Bae- Samsung Electronics
Chulwoo Kim- Samsung Electronics
Kyoungsei Choi- Samsung Electronics
Sayoon Kang- Samsung Electronics

5. 10:25 AM - Flip-Chip Process Improvements for Low Warpage
Robert L. Hubbard- Lambda Technologies, Inc.
Pierino Zappella- Henkel Corporation
Pukun Zhu- Henkel Corporation

6. 10:50 AM - Comparison of Lidless and Overmold Flip Chip Package with 40nm Ultra Low-k Silicon Technology
Aparna Prasad- Altera Corporation
Teck Gyu Kang- Altera Corporation
Yuan Li- Altera Corporation
Dale Robinson- Amkor Technology, Inc.
Rodel Pasia- Amkor Technology, Inc.
Bosun Yoo- Amkor Technology, Inc.

7. 11:15 AM - Reliability of Thin Seamless Package with Embedded High-Pin-Count LSI Chip
Kentaro Mori- NEC Corporation
Katsumi Kikuchi- NEC Corporation
Daisuke Ohshima- NEC Corporation
Yoshiki Nakashima- NEC Corporation
Shintaro Yamamichi- NEC Corporation