Technical Program
Wednesday, June 02, 2010
Session 12: Filters and TSV-based RF Devices
1:30 PM - 5:10 PM
Committee: Electronic Components & RF
Champagne 4
Session Co-Chairs:
|
Craig Gaw Freescale Semiconductor, Inc. T +1-480-413-5920 F +1-480-413-5723 c.a.gaw@ieee.org |
Albert F. Puttlitz Mechanical Eng. Consultant T +1-802-899-4692 F +1-802-899-4692 a.f.puttlitz@ieee.org |
Papers:
1. 1:30 PM - Design, Fabrication and Characterization of BCB Polymer Embedded 60 GHz Parallel-Coupled BPF
S. Seok- IEMN
N. Rolland- IEMN
P.-A. Rolland- IEMN
2. 1:55 PM - Via-Less X-Band Stacked Filters on Duroid Substrate
Benjamin Lacroix- Georgia Institute of Technology
Kwang Choi- nGimat, Inc.
Andrew T. Hunt- nGimat, Inc.
John Papapolymerou- Georgia Institute of Technology
3. 2:20 PM - Packaging and AC Powering of LED Array
Weifeng Feng- University of California, Irvine
Yongzhi He- University of California, Irvine
Frank G. Shi- University of California, Irvine
4. 3:30 PM - Design of Wideband Bandpass Filters Using Si-BCB Technology for Millimeter-Wave Applications
Rui Li- Institute of Microelectronics, A*STAR
Teck Guan Lim- Institute of Microelectronics, A*STAR
Soon Wee Ho- Institute of Microelectronics, A*STAR
Yong Zhong Xiong- Institute of Microelectronics, A*STAR
Damaruganath Pinjala- Institute of Microelectronics, A*STAR
5. 3:55 PM - Millimeter-Wave/THz Passive Components Design Using Through Silicon Via (TSV) Technology
Sanming Hu- Institute of Microelectronics, A*STAR
Lei Wang- Institute of Microelectronics, A*STAR
Yong-Zhong Xiong- Institute of Microelectronics, A*STAR
Jinglin Shi- Institute of Microelectronics, A*STAR
Bo Zhang- Institute of Microelectronics, A*STAR
Dan Zhao- Institute of Microelectronics, A*STAR
Teck Guan Lim- Institute of Microelectronics, A*STAR
Xiaojun Yuan- Institute of Microelectronics, A*STAR
6. 4:20 PM - Novel On-Chip Through-Silicon-Via Wilkinson Power Divider
Wayne Woods- IBM Corporation
Hanyi Ding- IBM Corporation
Guoan Wang- IBM Corporation
Alvin Joseph- IBM Corporation
7. 4:45 PM - Design and Fabrication of Bandpass Filters in Glass Interposer with Through-Package-Vias (TPV)
Vivek Sridharan- Georgia Institute of Technology
Sunghwan Min- Georgia Institute of Technology
Venky Sundaram- Georgia Institute of Technology
Vijay Sukumaran- Georgia Institute of Technology
Seunghyun Hwang- Georgia Institute of Technology
Hunter Chan- Georgia Institute of Technology
Fuhan Liu- Georgia Institute of Technology
Christian Nopper- STMicroelectronics
Rao Tummala- Georgia Institute of Technology