Technical Program
Wednesday, May 27, 2009
Session 37: Posters
1:30 pm - 3:30 pm
Committee: Posters
Events Center Exhibition Hall
Session Co-Chairs:
| Mark Eblen Kyocera America T +1-858-614-2537 mark.eblen@kyocera.com |
Nam Phan IBM Corporation T +1-512-823-7606 npham@us.ibm.com |
Posters:
1. An Evaluation of Die Crack Risk of Over-Molded Packages Due to External Impact
Peng Su- Cisco Systems, Inc.
Boaz Khan- Cisco Systems, Inc.
Ming Ding- Freescale Semiconductor, Inc.
2. 3D SiP Module Using TSV and Novel Solder Bump Maker
Hyun-Cheol Bae- Electronics and Telecommunications Research Institute
Kwang-Seong Choi- Electronics and Telecommunications Research Institute
Yong-Sung Eom- Electronics and Telecommunications Research Institute
Byeong-Ok Lim- Electronics and Telecommunications Research Institute
Ki-Jun Sung- Electronics and Telecommunications Research Institute, University of Science and Technology
Sunghae Jung- Electronics and Telecommunications Research Institute
Byeung-Gee Kim- NEPES Corporation
In-Soo Kang- NEPES Corporation
Jong-Tae Moon- Electronics and Telecommunications Research Institute
3. Optimized TSV Process Using Bottom-Up Electroplating without Wafer Cracks
Byeong-Ok Lim- Electronics and Telecommunications Research Institute
Kwang-Seong Choi- Electronics and Telecommunications Research Institute
Yong-Sung Eom- Electronics and Telecommunications Research Institute
Hyun-Cheol Bae- Electronics and Telecommunications Research Institute
Sunghae Jung- Electronics and Telecommunications Research Institute
Ki-Jun Sung- University of Science and Technology
Jong-Tae Moon- Electronics and Telecommunications Research Institute
4. GlassPack - A 3D Glass Based Interposer Concept for SiP with Integrated Optical Interconnects
H. Schröder- Fraunhofer IZM
L. Brusberg- Fraunhofer IZM
R. Erxleben- Fraunhofer IZM
I. Ndip- Fraunhofer IZM
M. Töpper- Fraunhofer IZM
N.F. Nissen- Fraunhofer IZM
H. Reichl- Fraunhofer IZM
5. 3D TSV Transformer Design for DC-DC/AC-DC Converter
Bo Zhang- Xidian University, Institute of Microelectronics, A*STAR, National University of Singapore
Yong-Zhong Xiong- Institute of Microelectronics, A*STAR
Lei Wang- Institute of Microelectronics, A*STAR
Sanming Hu- Institute of Microelectronics, A*STAR
Jinglin Shi- Institute of Microelectronics, A*STAR
Yi-Qi Zhuang- Xidian University
Le-Wei Li- National University of Singapore
Xiaojun Yuan- Institute of Microelectronics, A*STAR
6. A Low Stress Bond Pad Design for Low Temperature Solder Interconnections on Through Silicon Vias (TSVs)
Xiaowu Zhang- Institute of Microelectronics, A*STAR
R. Rajoo - Institute of Microelectronics, A*STAR
C.S. Selvanayagam - Institute of Microelectronics, A*STAR
C.S. Premachandran- Institute of Microelectronics, A*STAR
W.K. Choi- Institute of Microelectronics, A*STAR
S.W. Ho- Institute of Microelectronics, A*STAR
S.W. Ong- Institute of Microelectronics, A*STAR
Ling Xie- Institute of Microelectronics, A*STAR
D. Pinjala- Institute of Microelectronics, A*STAR
V.N. Sekhar- Institute of Microelectronics, A*STAR
D.-L. Kwong- Institute of Microelectronics, A*STAR
7. Low Cost Wafer-Level Packaging Method Based on Anodized Aluminum Substrate with Backside Signal Pad and EMC Passivation
Young-Joon Kim- KAIST
Jun-Ho Han- KAIST
Jung-Woo Kim- KAIST
Young-Se Kwon- KAIST
8. Design, Process Integration and Characterization of Wafer Level Vacuum Packaging for MEMS Resonator
Aibin Yu- Institute of Microelectronics, A*STAR
C.S. Premachandran- Institute of Microelectronics, A*STAR
Ranganathan Nagarajan- Institute of Microelectronics, A*STAR
Choi Won Kyoung- Institute of Microelectronics, A*STAR
Lam Quynh Trang- Institute of Microelectronics, A*STAR
Rakesh Kumar- Institute of Microelectronics, A*STAR
Li Shiah Lim- Institute of Microelectronics, A*STAR
Johnny He Han- Institute of Microelectronics, A*STAR
Yap Guan Jie- Institute of Microelectronics, A*STAR
Pinjala Damaruganath- Institute of Microelectronics, A*STAR
9. Electrical and Fluidic C4 Interconnections for Inter-Layer Liquid Cooling of 3D Ics
Calvin R. King- Georgia Institute of Technology
Jesal Zaveri- Georgia Institute of Technology
Muhannad S. Bakir- Georgia Institute of Technology
James D. Meindl- Georgia Institute of Technology
10. Power Delivery System Architecture for Many-Tier 3D Systems
Michael B. Healy- Georgia Institute of Technology
Sung Kyu Lim- Georgia Institute of Technology
11. Packaging Effect Investigation for MEMS-Based Sensors WL-CSP with a Central Opening
Lung-Tai Chen- Industrial Technology Research Institute (ITRI)
Yu-Wen Hsu- Industrial Technology Research Institute (ITRI)
Pzu-Jui Fan- National Cheng-Kung University
R.S. Chen- National Cheng-Kung University
12. Process Solutions and Polymer Materials for 3D-WLP Through Silicon Via Filling
M. Bouchoucha- STMicroelectronics
P. Chausse- CEA LETI-Minatec
D. Henry- CEA LETI-Minatec
N. Sillon- CEA LETI-Minatec
13. Development of Novel Carbon Nanotube TSV Technology
Anurag Gupta- University of Alabama
Sukeshwar Kannan- University of Alabama
Bruce C. Kim- University of Alabama
Falah Mohammed- AN-Najah National University
Byoungchul Ahn- Yeungnam University
14. Realization of High Spatial Color Uniformity for White Light-Emitting Diodes by Remote Hemispherical YAG: Ce Phosphor Film
Zongyuan Liu- Huazhong University of Science and Technology
Kai Wang- Huazhong University of Science and Technology
Xiaobing Luo- Huazhong University of Science and Technology
Sheng Liu- Huazhong University of Science and Technology
15. Co-Electrodeposited Graphite and Diamond-Loaded Solder Nanocomposites as Thermal Interface Materials
G. Prashant Reddy- Georgia Institute of Technology
P. Markondeya Raj- Georgia Institute of Technology
Nikhilesh Nataraj- Georgia Institute of Technology
P.M. Rajesh- Georgia Institute of Technology
Gopal Jha- Georgia Institute of Technology
Abhishek Choudhury- Georgia Institute of Technology
Nitesh Kumbhat- Georgia Institute of Technology
Rao Tummala- Georgia Institute of Technology
Nathaniel Brese- Dow Chemical Company
Michael Toben- Dow Chemical Company
Edit Szöcs- Dow Chemical Company
16. Deconstructing the Myth of Percolation in Electrically Conductive Adhesives and Its Implications
Joshua C. Agar- Georgia Institute of Technology
Katy J. Lin- Georgia Institute of Technology
Rongwei Zhang- Georgia Institute of Technology
Jessica Durden- Georgia Institute of Technology
Kevin Lawrence- Georgia Institute of Technology
Kyoung-Sik Moon- Georgia Institute of Technology
C.P. Wong- Georgia Institute of Technology
17. Micro/Nano Structure Size Effect on Superhydrophobicity and Anti-Reflection of Single Crystalline Si Solar Cells
Yan Liu- Georgia Insitute of Technology
Yonghao Xiu- Georgia Insitute of Technology
C.P. Wong- Georgia Insitute of Technology