Technical Program
Thursday, May 28, 2009
Session 38: Posters
1:30 pm - 3:30 pm
Committee: Posters
Events Center Exhibition Hall
Session Co-Chairs:
| Mark Eblen Kyocera America T +1-858-614-2537 mark.eblen@kyocera.com |
Nam Phan IBM Corporation T +1-512-823-7606 npham@us.ibm.com |
Posters:
1. Improving Humidity Bond Reliability of Copper Bonding Wires
Tomohiro Uno- Nippon Steel Corporation
Takashi Yamada- Nippon Micrometal Corporation
2. Multimode Transceiver for High-Density Interconnects: Measurement and Validation
Yongjin Choi- North Carolina State University
Henning Braunisch- Intel Corporation
Kemal Aygun- Intel Corporation
Paul D. Franzon- North Carolina State University
3. Indium Deposition Processes for Ultra Fine Pitch 3D Interconnections
Marion Volpert- CEA-LETI, MINATEC
Lucile Roulet- CEA-LETI, MINATEC
J.F. Boronat- CEA-LETI, MINATEC
I. Borel- CEA-LETI, MINATEC
S. Pocas- CEA-LETI, MINATEC
H. Ribot- CEA-LETI, MINATEC
4. The Experimental and Numerical Investigation on Shear Behaviour of Solder Ball in a Wafer Level Chip Scale Package
Ye Zhang- Zhejiang University of Technology
Yangjian Xu- Zhejiang University of Technology
Yong Liu- Fairchild Semiconductor Corporation
Andrew Schoenberg- Fairchild Semiconductor Corporation
5. Improvement of the Solder Joint Strength in a SAC 305 Solder Ball to a ENIG Substrate Using LF Hydrogen Radical Treatment
Seung jae Jo- National Core Research Center (NCRC)
Ah reum Lee- National Core Research Center (NCRC)
Chung Yun Kang- Pusan National University
6. Micro Tube Insertion into Indium, Copper and Other Materials for 3D Applications
B. Goubault de Brugière- CEA LETI-Minatec
F. Marion- CEA LETI-Minatec
M. Fendler- CEA LETI-Minatec
V. Mandrillon- CEA LETI-Minatec
A. Hazotte- LETAM – CNRS/UPVM/ENIM
M. Volpert- CEA LETI-Minatec
H. Ribot- CEA LETI-Minatec
7. Room-Temperature Chip-Stack Interconnection Using Compliant Bumps and Wedge-Incorporated Electrodes
Naoya Watanabe- Kyushu University
Tanemasa Asano- Kyushu University
8. Integrated Process for Defect-Free Copper Plating and Chemical-Mechanical Polishing of Through-Silicon Vias for 3D Interconnects
Dean Malta- RTI International
Christopher Gregory- RTI International
Dorota Temple- RTI International
Trevor Knutson- MEMSCAP, Inc.
Chen Wang- Enthone, Inc.
Thomas Richardson- Enthone, Inc.
Yun Zhang- Enthone, Inc.
Robert Rhoades- Entrepix, Inc.
9. Thermosonic Au Ball Bonding Process Investigated Using Microsensor and Laser Vibrometer
I. Qin- Kulicke and Soffa, Inc.
A. Shah- University of Waterloo
C. Huynh- Kulicke and Soffa, Inc.
D. DeAngelis- Kulicke and Soffa, Inc.
M. Meyer- Kulicke and Soffa, Inc.
M. Mayer- University of Waterloo
Y Zhou- University of Waterloo
10. Extraction of a Lumped Element, Equivalent Circuit Model for Via Interconnections in 3-D Packages Using a Single Via Structure with Embedded Capacitors
Chung Hang John Poh- Georgia Institute of Technology
Swapan K. Bhattacharya- Georgia Institute of Technology
Jason Ferguson- NSWC Crane
John D. Cressler- Georgia Institute of Technology
John Papapolymerou- Georgia Institute of Technology
11. Critical Size of Crack Propagation from Residual Void in Micro Via in Printed Wiring Boards
Hyo-Soo Lee- Korea Institute of Industrial Technology
12. Manufacturability and Reliability Study of ALX Polymers for WLP Applications
Alan Huffman- RTI International
Philip Garrou- MCNC
Rex Anderson- Amkor Technology, Inc.
Boyd Rogers- Amkor Technology, Inc.
13. An Investigation of Reliability and Solder Joint Microstructure Evolution of Select Pb-Free FCBGA Pad Finish and Solder Ball Alloy Combinations
Daniel Cavasin- Advanced Micro Devices
14. Accelerated Preconditioning for Stack Die Packages
Yuchul Hwang- Samsung Electronics
Hwan-Ki Jeon- Samsung Electronics
Hye-Kyung Oh- Samsung Electronics
Young-Gyun Ryu- Samsung Electronics
Juseong Kang- Samsung Electronics
15. An Investigation into a Low Insulation Resistance Failure of Multilayer Ceramic Capacitors
Anshul Shrivastava- University of Maryland
Bhanu Sood- University of Maryland
Michael Azarian- University of Maryland
Michael Osterman- University of Maryland
Michael Pecht- University of Maryland
16. Acceleration Factor Study of Lead-Free Solder Joints under Wide Range Thermal Cycling Conditions
Hongtao Ma- Cisco Systems, Inc.
Mudasir Ahmad- Cisco Systems, Inc.
Kuo-Chuan Liu- Cisco Systems, Inc.
17. Reliability of Sn-3.5Ag Solder Joints in High Temperature Packaging Applications
Govindarajan Muralidharan- Oak Ridge National Laboratory
Kanth Kurumaddali- Oak Ridge National Laboratory
Andrew K. Kercher- Oak RIdge National Laboratory
Scott G. Leslie- Powerex Inc.
18. Thermal Stability of the Dielectric Properties of the Low-Loss, Organic Material RT/Duroid 6002 from 30 GHz to 70 GHz
Carlos Donado Morcillo- Georgia Institute of Technology
Swapan K Bhattacharya- Georgia Institute of Technology
Allen Horn- Rogers Corporation
John Papapolymerou- Georgia Institute of Technology