Technical Program

Friday, May 29, 2009
Session 39: Student Posters
Committee: Posters
8:30 a.m. - 10:30 a.m.

Session Co-Chairs:

Mark Eblen Kyocera America T +1-858-614-2537 mark.eblen@kyocera.com

Nam Phan IBM Corporation T +1-512-823-7606 npham@us.ibm.com

Posters:

Characterization of Encapsulants for High-Voltage, High-Temperature Power Electronic Packaging
Yiying Yao- Virginia Polytechnic Institute and State University
Zheng Chen- Virginia Polytechnic Institute and State University
Guo-Quan Lu- Virginia Polytechnic Institute and State University
Dushan Boroyevich- Virginia Polytechnic Institute and State University
Khai D.T. Ngo- Virginia Polytechnic Institute and State University

Evaluation of Electromigration (EM) Life of ENEPIG and CuSOP Surface Finishes with Various Solder Bump Materials
Dong Wook Kim- Xilinx, Inc.
J.K. Jerry Lee- Xilinx, Inc.
Myung-June (M.J.) Lee- Xilinx, Inc.
S.Y. Pai- Xilinx, Inc.
Stan Chen- Siliconware Precision Industries Co., Ltd.
Frank Kuo- Siliconware Precision Industries Co., Ltd.

Influence of Artificial Body Fluids and Medical Sterilization Procedures on Chemical Stability of Parylene C
N. Beshchasna- Technische Universität Dresden
B. Adolphi- Technische Universität Dresden
S. Granovsky- M.V. Lomonosov Moscow State University
M. Braunschweig- Microelectronic Packaging Dresden GmbH
W. Schneider- Microelectronic Packaging Dresden GmbH
J. Uhlemann- Technische Universität Dresden
K.-J. Wolter- Technische Universität Dresden

Electrical-Thermal Co-Design of High Speed Links
Tsunwai Gary Yip- Rambus, Inc.
Wendemagegnehu T. Beyene- Rambus, Inc.
Gnanadeep Kollipara- Rambus, Inc.
William Ng- Rambus, Inc.
June Feng- Rambus, Inc.

NCF for Wafer Lamination Process in Higher Density Electronic Packages
Kazutaka Honda- Hitachi Chemical Co., Ltd.
Tetsuya Enomoto- Hitachi Chemical Co., Ltd.
Akira Nagai- Hitachi Chemical Co., Ltd.
Nozomu Takano- Hitachi Chemical Co., Ltd.

Lattice Deformation of Sn Nanowires for the Application to Nano-Interconnection Technology
Ho Sun Shin- KAIST
Jae Yong Song- Korea Research Institute of Standards and Science
Jin Yu- KAIST

High-Speed Parallel Interface Implementation with Low-Cost System Solution by Using Signal Integrity Factorial Design
Jimmy Hsu- Himax Technologies, Inc.
Sam Yang- Himax Technologies, Inc.
Wei-Da Guo- Himax Technologies, Inc.
Renee Lee- Himax Technologies, Inc.
Tung-Yang Chen- Himax Technologies, Inc.

Characterization and Management of Wafer Stress for Various Pattern Densities in 3D Integration Technology
X.F. Pang- Institute of Microelectronics, A*STAR
T.T. Chua- Institute of Microelectronics, A*STAR
H.Y. Li- Institute of Microelectronics, A*STAR
E.B. Liao- Institute of Microelectronics, A*STAR
W.S. Lee- Institute of Microelectronics, A*STAR
F.X. Che- Institute of Microelectronics, A*STAR

Size Effect of Ag Nanoparticles on Laser Sintering and Wire Bondability
Yoshiyuki Tsutsui- Ibaraki University
Kazuhiko Yamasaki- Ibaraki University
Katsuhiro Maekawa- Ibaraki University
Tomotake Niizeki- Ibaraki University
Ahmed Bucheeri- Ibaraki University
Mamoru Mita- Hitachi
Yorishige Matsuba- Harima Chemicals, Inc.
Nobuto Terada- Harima Chemicals, Inc.
Hiroshi Saito- Harima Chemicals, Inc.

Thermal Design of a 16W LED Bulb Based on Thermal Analysis of a 4W LED Bulb
Xiaobing Luo- Huazhong University of Science & Technology
Zhangming Mao- Huazhong University of Science & Technology
Sheng Liu- Huazhong University of Science & Technology

Comprehensive Design Guidance for PTH Via Stub in Board-Level High Speed Differential Interconnects
Jaemin Shin- QUALCOMM Incorporated
Timothy Michalka - QUALCOMM Incorporated

Modeling and Measurements of Lead Titanate Acoustic Transducers for Input Impedance Matching Development
Kyu Tak Son- University of California, Irvine
Chin C. Lee- University of California, Irvine

Link Analysis and Design of High Speed Storage Buses in Backplane and Cabling Environments
Nanju Na- IBM Corporation
Tao Wang- IBM Corporation
Scot Baumgartner- IBM Corporation
Rohan Mandrekar- IBM Corporation
Yaping Zhou- IBM Corporation

High Temperature Resistant Bonding Solutions Enabling Thin Wafer Processing (Characterization of Polyimide Base Temporary Bonding Adhesive for Thinned Wafer Handling)
Toshiaki Itabashi- DuPont WLP Solutions
Melvin P. Zussman- HD MicroSystems

Yield Modeling of 3D Integrated Wafer Scale Assemblies
David V. Campbell- Sandia National Laboratories

Adhesion and RF Properties of Electrically Conductive Adhesives
K. Moon- Georgia Institute of Technology
D. Staiculescu- Georgia Institute of Technology
S. Kim- Georgia Institute of Technology
Z. Liu- Georgia Institute of Technology
H. Chan- Georgia Institute of Technology
V. Sundaram- Georgia Institute of Technology
R. Tummala- Georgia Institute of Technology
C.P. Wong- Georgia Institute of Technology

Moisture Induced Change of the Viscoelastic Material Properties of Adhesives for SHM Sensor Applications
B. Boehme- Technische Universität Dresden
M. Roellig- Fraunhofer Institute for Non-Destructive Testing
K.-J. Wolter- Technische Universität Dresden

Interfacial Fracture Parameters of Silicon-to-Molding Compound
G. Schlottig- Infineon Technologies AG, Fraunhofer IZM, Delft University of Technology
I. Maus- AMIC Angewandte Micro-Messtechnik GmbH
H. Walter- Fraunhofer IZM
K.M.B. Jansen- Delft University of Technology
H. Pape- Infineon Technologies AG
B. Wunderle- Fraunhofer IZM, Chemnitz University of Technology
L.J. Ernst- Delft University of Technology