Technical Program
Wednesday, June 02, 2010
Session 6: Optical Interconnects/Fiber Optics to the Board
8:00 AM - 11:40 AM
Committee: Optoelectronics
Champagne 4
Session Co-Chairs:
|
Masanobu Okayasu Opnext T +81-45-865-7003 ext.4236 F +81-45-865-7055 masanobu.okayasu@opnext.com |
Andrew Shapiro JPL T +1-818-393-7311 F +1-818-393-2454 aashapiro@aol.com |
Papers:
1. 8:00 AM - Flip-Chip Integrated Silicon Photonic Bridge Chips for Sub-Picojoule Per Bit Optical Links
Hiren D. Thacker- Oracle
Ying Luo- Oracle
Jing Shi- Oracle
Ivan Shubin- Oracle
Jon Lexau- Oracle
Xuezhe Zheng- Oracle
Guoliang Li- Oracle
Jin Yao- Oracle
Joannes Costa- Oracle
Thierry Pinguet- Luxtera Inc.
Attila Mekis- Luxtera Inc.
Po Dong- Kotura Inc.
2. 8:25 AM - Dense 24 TX + 24 RX Fiber-Coupled Optical Module Based on a Holey CMOS Transceiver IC
Fuad E. Doany- IBM Corporation
Clint L. Schow- IBM Corporation
Benjamin G. Lee- IBM Corporation
Alexander V. Rylyakov- IBM Corporation
Christopher Jahnes- IBM Corporation
Young Kwark- IBM Corporation
Christian Baks- IBM Corporation
Daniel M. Kuchta- IBM Corporation
Jeffrey A. Kash- IBM Corporation
3. 8:50 AM - 12-Channel x 20-Gbps On-board Parallel Optical Modules Using Multi-Chip Visual Alignment Technique
T. Sugimoto- NEC Corporation
Y. Hashimoto- NEC Corporation
K. Yamamoto- NEC Corporation
M. Kurihara- NEC Corporation
M. Oda- NEC Corporation
J. Sakai- NEC Corporation
H. Ono- NEC Corporation
T. Akagawa- NEC Corporation
K. Yashiki- NEC Corporation
H. Hatayama- NEC Corporation
N. Suzuki- NEC Corporation
M. Tsuji- NEC Corporation
4. 10:00 AM - Cavity-Resonator-Integrated Grating Input/Output Couplers for WDM Optical-Interconnect System in Package
Shogo Ura- Kyoto Institute of Technology
Katsuya Shimizu- Kyoto Institute of Technology
Yuki Kita- Kyoto Institute of Technology
Kenji Kintaka- National Institute of AIST
Junichi Inoue- Kyoto Institute of Technology
Yasuhiro Awatsuji- Kyoto Institute of Technology
5. 10:25 AM - Glass Carrier Based Packaging Approach Demonstrated on a Parallel Optoelectronic Transceiver Module for PCB Assembling
Lars Brusberg- Fraunhofer IZM
Henning Schröder- Fraunhofer IZM
Robert Erxleben- Fraunhofer IZM
Ivan Ndip- Fraunhofer IZM
Michael Töpper- Fraunhofer IZM
Nils F. Nissen- Fraunhofer IZM
Herbert Reichl- Fraunhofer IZM
6. 10:50 AM - On-Board Fabrication of Multi-Channel Polymer Optical Waveguide with Graded-Index Cores by Soft-Lithography
Takaaki Ishigure- Keio University
Yosuke Nitta- Keio University
7. 11:15 AM - High Channel-Count Optical Interconnection for Servers
Yoichi Taira- IBM Japan
Hidetoshi Numata- IBM Japan
Shigeru Nakagawa- IBM Japan
Masao Tokunari- IBM Japan
Jean Benoit Heroux- IBM Japan
Fumiaki Yamada- IBM Japan