Technical Program
Wednesday, June 02, 2010
Session 8: Wirebond and Alternative Interconnect
1:30 PM - 5:10 PM
Committee: Interconnections
Versailles 1 & 2
Session Co-Chairs:
|
William Chen ASE-US, Inc. T +1-408-986-6505 F +1-408-565-0289 william.chen@aseus.com |
Matthew Yao Rockwell Collins T +1-319-295-0147 F myao@rockwellcollins.com |
Papers:
1. 1:30 PM - Effect of Pd Addition on Ultra-Fine Pitch Au Wire/Al Pad Interface
Ji-Won Shin- KAIST
Min-Suk Song- KAIST
Yong-Sung Park- KAIST
Yong-Min Kwon- KAIST
Jeong-Tak Moon - MK Electron Co., Ltd.
Jong-Soo Cho- MK Electron Co., Ltd.
Kyung-Ah Yoo- MK Electron Co., Ltd.
Kwan-Yoo Byun- HYNIX Semiconductor
Cheol-Ho Joh- HYNIX Semiconductor
Eun-Hye Do - HYNIX Semiconductor
Kyung-Wook Paik- KAIST
2. 1:55 PM - Effect of Ultrasonic Energy on Interfacial Structure and Bond Strength in Copper Wire Bonding
H. Xu- Loughborough University
C. Liu- Loughborough University
V.V. Silberschmidt- Loughborough University
M. Sivakumar- ASM Technology
Z. Chen- Nanyang Technological University
3. 2:20 PM - Challenges of CU Wire Bonding on Low-k/Cu Wafers with BOA Structures
Chu-Chung Stephen Lee- Freescale Semiconductor, Inc.
Leo M. Higgins III- Freescale Semiconductor, Inc.
4. 3:30 PM - Low Temperature, Low Profile, Ultra-Fine Pitch Copper-to-Copper Chip-Last Embedded-Active Interconnection Technology
Abhishek Choudhury- Georgia Institute of Technology
Nitesh Kumbhat- Georgia Institute of Technology
P. Markondeya Raj- Georgia Institute of Technology
Rongwei Zhang- Georgia Institute of Technology
Venky Sundaram- Georgia Institute of Technology
Rajiv Dunne- Texas Instruments Inc.
Mario Bolanos-Avila- Texas Instruments Inc.
C.P. Wong- Georgia Institute of Technology
Rao Tummala- Georgia Institute of Technology
5. 3:55 PM - Room-Temperature Si-SiN Wafer Bonding by Nano-Adhesion Layer Method
Ryuichi Kondou- University of Tokyo
Chenxi Wang- University of Tokyo
Tadatomo Suga- University of Tokyo
6. 4:20 PM - Direct Chip Powering and Enhancement of Proximity Communication through Anisotropic Conductive Adhesive Chip-to-Chip Bonding
Jing Shi- Oracle
Darko Popovic- Oracle
Nyles Nettleton- Oracle
Theresa Sze- Oracle
David Douglas- Oracle
Hiren Thacker- Oracle
John Cunningham - Oracle
Kazutaka Furuta- Sony Chemical & Information Device Corporation
Ryoji Kojima- Sony Chemical & Information Device Corporation
Koichi Hirose- Sony Chemicals Corporation of America
Kuopin Hwang- Sony Chemicals Corporation of America
7. 4:45 PM - Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor
Pio Jesudoss- Tyndall National Institute
Wenbin Chen- University College Cork
Alan Mathewson- Tyndall National Institute
William M.D. Wright- University College Cork
Kevin G. McCarthy- University College Cork
Frank Stam- Tyndall National Institute