Technical Program
The Technical Program for the 62nd ECTC features over 300 technical papers covering all aspects of electronic packaging and interconnect technology. Highlights of the Technical Program include:
- 36 technical sessions covering 3D/TSV, sensors and MEMS, embedded devices, co-design, RF packaging, microfluidics and inkjet, in addition to conventional electronic packaging topics on advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processes, reliability, assembly and manufacturing, and emerging technologies
- For the first time, ECTC’s poster sessions will now be 4 Interactive Presentation sessions. Interactive Presentation sessions provide authors the opportunity for one-on-one discussion with colleagues and will feature quad charts displayed on monitors to provide at-a-glance information on the author’s work.
- A Student poster session highlighting the student research from several universities and organizations around the world
- Nightly invited panel sessions
- Panel Discussion – Power Electronics: A Booming Market
- Plenary Session – Photonics: The Next Frontier?
- CPMT Seminar – Advanced Coreless Package Substrate and Material Technologies
- Special Tuesday Session – Next Generation Packaging and Integration: The Transformed Role of the Packaging Foundry
Advanced Packaging
|
Session
7: Interposer Technology
|
Session
9: Sensors and MEMS
|
Session
19: Thru Via Technologies
|
Session
21: Flip Chip Technologies
|
Session
25: 3D Integration
|
Session
32: Advanced Substrate and Wafer Level Packaging
|
Electronic Components & RF
|
Session
22: Precision Components, Sensors and RF Packaging
|
Session
24: Inkjet Technology and Embedded Devices
|
Emerging Technologies
|
Session
3: MEMS Integration and Processing
|
Session
36: Integrated Microfluidics
|
Interconnections
|
Session
1: 3D Interconnect: Bonding and Assembly
|
Session
6: Novel Interconnections
|
Session
14: Flip Chip Interconnect and Electromigration
|
Session
20: Co-Design for the 3D Ecosystem
|
Session
26: Advanced Wirebonding
|
Session
31: Applications with 3D Technologies
|
Assembly & Manufacturing Technology
|
Session
11: Advanced Flip Chip Underfill Assembly
|
Session
13: 3D TSV Manufacturing
|
Session
23: Assembly Challenges of Area Array Packages
|
Session
29: Novel Approaches in Wafer Level Manufacturing
|
Materials & Processing
|
Session
10: Conductive and Non-Conductive Adhesives
|
Session
15: Innovative Processes and Techniques
|
Session
17: Lead Free Solders
|
Session
27: Bonding Materials and Processes
|
Session
33: Substrates and Thermal Interface Materials
|
Modeling & Simulation
|
Session
4: Signal and Power Analysis
|
Session
16: 3D Electrical Analysis
|
Session
28: New Trends in Mechanical Modeling and Characterization
|
Session
34: 3D Systems and Emerging Packages-Thermal and Thermo-Mechanical Studies
|
Optoelectronics
|
Session
5: LEDs and Emerging Optoelectronics Integration
|
Session
35: Optical Interconnects
|
Applied Reliability
|
Session
2: Next Generation Packaging Reliability
|
Session
8: 3D Reliability
|
Session
12: Solder and Material Characterization
|
Session
18: Innovative Test Methods
|
Session
30: Interconnect Reliability
|
Interactive Presentations
|
Session
37: Interactive Presentations
|
Session
38: Interactive Presentations
|
Session
39: Interactive Presentations
|
Session
40: Interactive Presentations
|
