Technical Program

The Technical Program for the 62nd ECTC features over 300 technical papers covering all aspects of electronic packaging and interconnect technology. Highlights of the Technical Program include:

  • 36 technical sessions covering 3D/TSV, sensors and MEMS, embedded devices, co-design, RF packaging, microfluidics and inkjet, in addition to conventional electronic packaging topics on advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processes, reliability, assembly and manufacturing, and emerging technologies
  • For the first time, ECTC’s poster sessions will now be 4 Interactive Presentation sessions. Interactive Presentation sessions provide authors the opportunity for one-on-one discussion with colleagues and will feature quad charts displayed on monitors to provide at-a-glance information on the author’s work.
  • A Student poster session highlighting the student research from several universities and organizations around the world
  • Nightly invited panel sessions
    • Panel Discussion – Power Electronics: A Booming Market
    • Plenary Session – Photonics: The Next Frontier?
    • CPMT Seminar – Advanced Coreless Package Substrate and Material Technologies
    • Special Tuesday Session – Next Generation Packaging and Integration: The Transformed Role of the Packaging Foundry

Advanced Packaging
Session 7: Interposer Technology
Session 9: Sensors and MEMS
Session 19: Thru Via Technologies
Session 21: Flip Chip Technologies
Session 25: 3D Integration
Session 32: Advanced Substrate and Wafer Level Packaging
Electronic Components & RF
Session 22: Precision Components, Sensors and RF Packaging
Session 24: Inkjet Technology and Embedded Devices
Emerging Technologies
Session 3: MEMS Integration and Processing
Session 36: Integrated Microfluidics
Interconnections
Session 1: 3D Interconnect: Bonding and Assembly
Session 6: Novel Interconnections
Session 14: Flip Chip Interconnect and Electromigration
Session 20: Co-Design for the 3D Ecosystem
Session 26: Advanced Wirebonding
Session 31: Applications with 3D Technologies
Assembly & Manufacturing Technology
Session 11: Advanced Flip Chip Underfill Assembly
Session 13: 3D TSV Manufacturing
Session 23: Assembly Challenges of Area Array Packages
Session 29: Novel Approaches in Wafer Level Manufacturing
Materials & Processing
Session 10: Conductive and Non-Conductive Adhesives
Session 15: Innovative Processes and Techniques
Session 17: Lead Free Solders
Session 27: Bonding Materials and Processes
Session 33: Substrates and Thermal Interface Materials
Modeling & Simulation
Session 4: Signal and Power Analysis
Session 16: 3D Electrical Analysis
Session 28: New Trends in Mechanical Modeling and Characterization
Session 34: 3D Systems and Emerging Packages-Thermal and Thermo-Mechanical Studies
Optoelectronics
Session 5: LEDs and Emerging Optoelectronics Integration
Session 35: Optical Interconnects
Applied Reliability
Session 2: Next Generation Packaging Reliability
Session 8: 3D Reliability
Session 12: Solder and Material Characterization
Session 18: Innovative Test Methods
Session 30: Interconnect Reliability
Interactive Presentations
Session 37: Interactive Presentations
Session 38: Interactive Presentations
Session 39: Interactive Presentations
Session 40: Interactive Presentations