Technical Program
Wednesday, May 30, 2012
Session 1: 3D Interconnect: Bonding and Assembly
8:00 AM - 11:40 AM
Committee: Interconnections
Harbor Island II
Session Co-Chairs:
|
Changqing Liu Loughborough University T +44-1509-227681 F C.Liu@lboro.ac.uk |
James Lu Rensselaer Polytechnic Institute T +1-518-276-2909 F luj@rpi.edu |
Papers:
1. 8:00 AM - Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs based on Micro-Bump/Adhesive Hybrid Wafer Bonding
C.T. Ko - ITRI, National Chiao Tung University,
Z.C. Hsiao - ITRI
Y.J. Chang - National Chiao Tung University
P.S. Chen - ITRI
J.H. Huang - ITRI
H.C. Fu - ITRI
Y.J. Huang - ITRI
C.W. Chiang - ITRI
C.K. Lee - ITRI
H.H. Chang - ITRI
W.L. Tsai - ITRI
Y.H. Chen - ITRI
2. 8:25 AM - Evaluation of 3D Interconnect Routing and Stacking Strategy to Optimize High Speed Signal Transmission for Memory on Logic
J. Roullard - Université de Savoie
A. Farcy - STMicroelectronics
S. Capraro - Université de Savoie
T. Lacrevaz - Université de Savoie
C. Bermond - Université de Savoie
G. Houzet - Université de Savoie
J. Charbonnier - CEA-LETI
C. Fuchs - CEA-LETI
C. Ferrandon - CEA-LETI
P. Leduc - CEA-LETI
B. Flechet - Université de Savoie
3. 8:50 AM - Study of Low Temperature and High Heat-Resistant Fluxless Bonding via Nanoscale Thin Film Control toward Wafer-Level Multiple Chip Stacking for 3D LSI
Eiji Morinaga - Osaka University
Yuichi Oka - Osaka University
Hiroaki Nishimori - Osaka University
Haruhiko Miyagawa - Osaka University
Ryohei Satoh - Osaka University
Yoshiharu Iwata - Osaka University
Ryota Kanezaki - Osaka University
4. 10:00 AM - High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill
Christopher Gregory - RTI International
Matthew Lueck - RTI International
Alan Huffman - RTI International
John M. Lannon, Jr. - RTI International
Dorota S. Temple - RTI International
5. 10:25 AM - Characterization of a Novel Fluxless Surface Preparation Process for Die Interconnect Bonding
Eric F. Schulte - SET North America
Keith A. Cooper - SET North America
Matthew Phillips - SET North America
Subhash L. Shinde - Sandia National Laboratory
6. 10:50 AM - Development of Anhydride-Based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking
Ji-Won Shin - KAIST
Yong-Won Choi - KAIST
Young Soon Kim - KAIST
Un Byung Kang - Samsung Electronics Company, Ltd.
Young Kun Jee - Samsung Electronics Company, Ltd.
Ji Hwan Hwang - Samsung Electronics Company, Ltd.
Kyung-Wook Paik - KAIST
7. 11:15 AM - "Dual-Purpose" Remateable Conductive Ball-in-Pit Interconnects for Chip Powering and Passive Alignment in Proximity Communication Enabled Multi-Chip Packages
Hiren D. Thacker - Oracle
Ivan Shubin - Oracle
Ying Luo - Oracle
Kannan Raj - Oracle
James G. Mitchell - Oracle
Ashok V. Krishnamoorthy - Oracle
John E. Cunningham - Oracle
