Technical Program

Session 40: Interactive Presentations
Committee: Interactive Presentations
Events Center Exhibition Hall

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
F +1-512-973-4240
npham@us.ibm.com
 
Mark Eblen
Kyocera America
T +1858-614-2537
mark.eblen@kyocera.com

Papers:

Chip to Wafer Direct Bonding Technologies for High Density 3D Integration
L. Sanchez - CEA-LETI
L. Bally - CEA-LETI
B. Montmayeul - CEA-LETI
F. Fournel - CEA-LETI
J. Dafonseca - CEA-LETI
E. Augendre - CEA-LETI
L. Di Cioccio - CEA-LETI
V. Carron - CEA-LETI
T. Signamarcheix - CEA-LETI
R. Taibi - STMicroelectronics
S. Mermoz - STMicroelectronics
G. Lecarpentier - SET

Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection
Shenglin Ma - Peking University
Xin Sun - Peking University
Yunhui Zhu - Peking University
Zhiyuan Zhu - Peking University
Qinghu Cui - Peking University
Meng Chen - Peking University
Yongqiang Xiao - Peking University
Jing Chen - Peking University
Min Miao - Peking University, Beijing Information Science & Technology University
Wengao Lu - Peking University
Yufeng Jin - Peking University

Compliant Interconnects for Reduced Cost of a Ceramic Ball Grid Array Carrier
Maaike M.V. Taklo - SINTEF ICT
Andreas Larsson - SINTEF ICT
Astrid-Sofie Vardøy - SINTEF ICT
Helge Kristiansen - Conpart AS
Lars Hoff - Vestfold University College
Knut Waaler - WesternGeco AS

Study of Pd Mixing during Pd-Cu Wire Ball Formation and Impact on Wire Bond Quality
Flynn Carson - STATS ChipPAC
Jae Hak Yee - STATS ChipPAC
Soo San Park - STATS ChipPAC
Edward Fontanilla - STATS ChipPAC

Cu and Al-Cu Composite-Material Interconnects for Power Devices
Jamin Ling - Kulicke and Soffa Industries, Inc.
Tao Xu - Kulicke and Soffa Industries, Inc.
Raymond Chen - Kulicke and Soffa Industries, Inc.
Orlando Valentin - Kulicke and Soffa Industries, Inc.
Christoph Luechinger - Kulicke and Soffa Industries, Inc.

Remedies to Control Electromigration: Effects of CNT Doped Sn-Ag-Cu Interconnects
Sha Xu - City University of Hong Kong
Xiaoxin Zhu - University of Greenwich
Hiren Kotadia - King's College London
Hua Lu - University of Greenwich
Samjid H. Mannan - King's College London
Chris Bailey - University of Greenwich
Y.C. Chan - City University of Hong Kong

Bio-Inspired Surface Treatment on Touch Screen Panels (TSPs) for Adhesion Enhancement
Il Kim - KAIST
Seung-Ho Kim - KAIST
Inseong You - KAIST
Haeshin Lee - KAIST
Kyung-Wook Paik - KAIST

Low Slow-Wave Effect and Crosstalk for Low-Cost ABF-Coated TSVs in 3-D IC Interposer
Yu-Jen Chang - National Taiwan University
Tai-Yu Zheng - National Taiwan University
Hao-Hsiang Chuang - National Taiwan University
Chuen-De Wang - National Taiwan University
Peng-Shu Chen - ITRI
Tzu-Ying Kuo - ITRI
Chau-Jie Zhan - ITRI
Shih-Hsien Wu - ITRI
Wei-Chung Lo - ITRI
Yi-Chang Lu - National Taiwan University
Yih-Peng Chiou - National Taiwan University
Tzong-Lin Wu - National Taiwan University

Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding using Au Stud Bumps
Kwang-Seong Choi - ETRI
Ho-Eun Bae - ETRI
Su-Jeong Jeon - ETRI
Hyun-Cheol Bae - ETRI
Yong-Sung Eom - ETRI

Design of a Liquid Bridge Heat Switch System based on the Liquid Bridge Control for the Electronics Cooling
Su-Heon Jeong - Gwang-ju Institute of Science and Technology
Wataru Nakayama - Thermtech International
Sung-Ki Nam - Gwang-ju Institute of Science and Technology
Sun-Kyu Lee - Gwang-ju Institute of Science and Technology

Development of Ultra Dense Edge Interconnects for Die to Die Connections based on Immersion Solder Bridging
Dahwey Chu - Sandia National Laboratories
Lauren E.S. Rohwer - Sandia National Laboratories

Cost Trade-Off Analysis of PoP versus 3D TSV
Chet A. Palesko - SavanSys Solutions, LLC
E. Jan Vardaman - TechSearch International, Inc.
Alan C. Palesko - SavanSys Solutions, LLC

A Cost-Effective and Compact 28-Gb/s ROSA Module using a Novel TO-CAN Package
Sae-Kyoung Kang - Electronics and Telecommunications Research Institute
Joon Ki Lee - Electronics and Telecommunications Research Institute
Joon-Young Huh - Electronics and Telecommunications Research Institute
Jyung Chan Lee - Electronics and Telecommunications Research Institute
Kwangjoon Kim - Electronics and Telecommunications Research Institute

A New Approach towards an Optimum Design and Manufacture of Microfluidic Devices based on Ex Situ Fabricated Hydrogel based Thin Films’ Integration
Weiwei Zhao - Loughborough University
Tommaso Santaniello - Loughborough University, University of Milan
Patrick Webb - Manufacturing Technology Centre
Cristina Lenardi - University of Milan, Fondazione Filarete
Changqing Liu - Loughborough University

Microfluidic Chips Fabrication from UV Curable Adhesives for Heterogeneous Integration
V.R.S.S. Mokkapati - National University of Singapore
Ole Bethge - Technical University of Vienna
Rainer Hainberger - Austrian Institute of Technology
Hubert Brueckl - Austrian Institute of Technology

Broad-Side Crosstalk Mitigation in Dual-Stripline Design
Jimmy Hsu - Intel Corporation
Kai Xiao - Intel Corporation

High Density Compliant Contacting Technology for Integrated High Power Modules in Automotive Applications
Paolo Nenzi - University of Rome
Rocco Crescenzi - University of Rome
Alexander Dolgyi - Belarussian State University of Informatics and Radioelectronics
Alexy Klyshko - Belarussian State University of Informatics and Radioelectronics
Vitaly Bondarenko - Belarussian State University of Informatics and Radioelectronics
Nicola Pio Belfiore - University of Rome
Marco Balucani - University of Rome

Design and Fabrication of Low-Loss, Horizontal and Vertical Interconnect Links using Air-Clad Transmission Lines and Through Silicon Vias
Rohit Sharma - Georgia Institute of Technology
Erdal Uzunlar - Georgia Institute of Technology
Vachan Kumar - Georgia Institute of Technology
Rajarshi Saha - Georgia Institute of Technology
Xinyi Yeow - Georgia Institute of Technology
Rizwan Bashirullah - University of Florida
Azad Naeemi - Georgia Institute of Technology
Paul Kohl - Georgia Institute of Technology

Vertical Tree 3-Dimensional TSV Clock Distribution Network in 3D IC
Dayoung Kim - KAIST
Joohee Kim - KAIST
Junso Pak - KAIST
Hyungdong Lee - Hynix Semiconductor Inc.
Junho Lee - Hynix Semiconductor Inc.
Kunwoo Park - Hynix Semiconductor Inc.
Joungho Kim - KAIST