About ECTC
A Premier Event....
The premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year's conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner with over 70 exhibitors. The 59th ECTC will be held at Sheraton San Diego Hotel & Marina, San Diego, CA, USA from May 26 to May 29, 2009.
The Technical Program contains papers covering leading edge developments and technical innovations across the packaging spectrum topics include advanced packaging, modeling & simulation, optoelectronics, interconnections, materials & processing, applied reliability, assembly and manufacturing technology, components & RF and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded IEEE CPMT Society Graduate Student Fellowship, Intel Best Student Paper award, and best and outstanding paper awards. Committee Information
The Professional Development Courses offer state-of-the-art technology reviews and updates in condensed half-day format. Topics cover a wide range of technologies including: 3D packaging, Pb-free solders, RF/Wireless packaging, GHz IC packaging, optoelectronic components and modules, system-on-package, chip scale and wafer scale packaging, integrated passive technology, polymers for electronic packaging, and package reliability.
The panel discussion, plenary session and CPMT seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
The Technology Corner complements the technical program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.
The ECTC would not be possible without the sponsorship of the IEEE Components, Packaging, Manufacturing Technology Society and the Electronic Components Association, numerous corporate participants and sponsors, and the time and energies of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.