Donna Noctor 53rd ECTC Program Chair

Introduction to ECTC 2003

The Electronic Components and Technology Conference (ECTC) continues to be the premier international packaging, components, and microelectronic systems technology conference. This year's conference will have 38 technical sessions, 14 professional development courses, a panel discussion, a plenary session, and a technology corner with over 50 exhibitors. The 53rd ECTC will be held at the Sheraton New Orleans Hotel, New Orleans, Louisiana from 27 - 30 May 2003.

The Technical Program will have papers focusing on leading edge developments and technical innovations in several areas, including: optoelectronics, RF and MEMS packaging, 3D and high performance package design, flip chip and Pb-free interconnections, wafer-level packaging and manufacturing, reliability test methods, and electrical, thermal and mechanical modeling. Two technical sessions explore topics related to engineering education and academic-industry-government collaborative research and engineering programs for the 21st century. Papers will be presented in either poster or presentation formats.

The Professional Development Courses offer state-of-the-art technology reviews and updates in condensed half-day and full-day formats. Topics cover a wide range of technologies including: RF/wireless packaging, GHz IC packaging photonic/optoelectronic packaging and systems, systems on a package, chip scale and wafer scale packaging, integrated passive technology, and polymers for electronic packaging.

The panel discussion, offered on the evening of the first day of the conference, has a format that allows for ample exchange and dialogue between the presenters and audience. The presentations will focus on new, emerging, and disruptive technologies.

The plenary session provides the conference participants the opportunity to gain the insight and perspective of technical and business leaders. This session will occur on the evening of the second day of the conference.

The Technology Corner complements the technical program in that it offers companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.

This year, the International Academic Workshop (sponsored by the Packaging Research Center) will be held in conjunction with ECTC as a one-day workshop on the first day of the conference. The purpose of this workshop is to make the academic community aware of the significant advances being made world-wide in next generation electronic packaging education and to promote international collaborations that serve the global technical community.

The ECTC would not be possible without the sponsorship of the IEEE Components, Packaging, Manufacturing Technology Society and the Electronic Components, Assemblies, and Materials Association (the components sector of the Electronic Industries Alliance), numerous corporate participants and sponsors, and the time and energies of the more than 140 engineers and scientists on the ECTC Executive and Program Committees.

International Workshop

The purpose of the Academic Workshop is to make the academic community aware of the significant advances being made worldwide in next generation electronic packaging education and to promote international collaborations in areas of mutual interest to serve the global technical community.

Starting in 1998, the Packaging Research Center (PRC) organized three international conferences as an initiative to bring the whole academic community together. These were held annually from 1998 to 2000 at the Georgia Tech campus and were well attended by packaging faculty from all around the world. These conferences have provided opportunities for faculty to present courses, curriculum and other educational programs they developed and exchange ideas on how to improve the status of microsystems packaging education. Two years ago, a decision was made to rotate the conference site and organize it at different international sites. In 2001, it was held in Hong Kong and in 2002 in Dresden, Germany. This year, the Academic Conference will be held in conjunction with ECTC as a one-day workshop.