Advance Packaging
Major Topics: 3D integration, embedded, and wafer level packaging, flip chip, advanced substrates, novel assembly technologies, interposers, TSVs, MEMS & sensors, and optoelectronic & photovoltaic device packaging.
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Chair
Joseph W. Soucy Draper Laboratory MS 80 555 Technology Square Cambridge MA 02139-3563 USA Phone:+1-617-258-2953 Fax: Email: Click Here |
Assistant Chair
Raj N. Master Microsoft Corporation SVC 2, 2410 1065 La Avenida Mountain View ca 94043 USA Phone:+1-650-693-0849 Fax: Email: Click Here |
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Daniel Baldwin
Engent, Inc. Suite 300A 3140 Northwoods Pkwy Norcross GA 30071 USA Phone:+1-678-990-3320 Fax: Email: Click Here |
Charles Banda
Laboratory for Physical Sciences Center for Exceptional Computing 8050 Greenmead Dr. College Park MD 20740 USA Phone:+1-443-654-7842 Fax: Email: Click Here |
Rozalia Beica
Lam Research AG Customer Application Technology SEZ Strasse 1 Villach 9500 Austria Phone:+43 (0) 676 8204 1233 Fax: Email: Click Here |
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Christopher Bower
Semprius, Inc. Suite C 4915 Prospectus Dr. Durham NC 27713 USA Phone:+1-919-522-5022 Fax: Email: Click Here |
Paul M. Harvey
IBM Corporation SG Packaging Group 11400 Burnet Road Austin TX 78758 USA Phone:+1-512-286-6554 Fax: Email: Click Here |
Altaf Hasan
Intel Corporation CH3-206 5000 W Chandler Blvd. Chandler AZ 85226 USA Phone:+1-480-554-3427 Fax: Email: Click Here |
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Erik Jung
Fraunhofer IZM System Integration and Interconnect Technologies Gustav-Meyer-Allee 25 D-13355 Berlin Germany Phone:+49-30-46403-230 Fax: Email: Click Here |
Sam Karikalan
Broadcom Corporation 5300 California Ave Irvine CA 92617 USA Phone:+1-949-926-7296 Fax: Email: Click Here |
Beth Keser
Qualcomm, Inc. WT-1210E 5775 Morehouse Dr San Diego CA 85284 USA Phone:+1-858-658-3332 Fax: Email: Click Here |
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Young-Gon Kim
IDT 6024 Silver Creek Valley Road San Jose CA 95138 USA Phone:+1-408-360-1545 Fax: Email: Click Here |
John Knickerbocker
IBM Corporation 06-116 1101 Kitchawan Road Yorktown Heights NY 10598 USA Phone:+1-914-945-3306 Fax: Email: Click Here |
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John H. Lau
ITRI Rm. 169, Bldg. 14 195, Sec. 4, Chung Hsing Rd. Chutung Hsinchu 310 Taiwan Phone:+886-3591-3390 Fax: Email: Click Here |
S. W. Ricky Lee
Hong Kong University of Science and Technology Department of Mechanical Engineering Clear Water Bay Kowloon Hong Kong Phone:+852-2358-7203 Fax: Email: Click Here |
Luu T. Nguyen
Texas Instruments A2-300 2900 Semiconductor Drive Santa Clara CA 95052-8090 USA Phone:+1-408-721-4786 Fax: Email: Click Here |
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Raj Pendse
STATS ChipPAC, Inc. 47400 Kato Road Fremont CA 94538 USA Phone:+1-510-979-8330 Fax: Email: Click Here |
Sudipta K. Ray
IBM Corporation M/S 81A 2070 Route 52 Hopewell Junction NY 12533-6531 USA Phone:+1-845-894-6240 Fax: Email: Click Here |
Subhash L. Shinde
Sandia National Laboratory 1084 PO Box 5800 Albuquerque NM 87185-1084 USA Phone:+1-505-284-2965 Fax: Email: Click Here |
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E. Jan Vardaman
TechSearch International, Inc. Suite 150 4801 Spicewood Springs Road Austin TX 78759 USA Phone:+1-512-372-8887 Fax: Email: Click Here |
James Jian Zhang
Micron Technology, Inc. 2235 Iron Point Road Folsom CA 95630 USA Phone:+1-916 458 3540 Fax: Email: Click Here |
