Advanced Packaging
Major Topics: 3D integration, embedded, and wafer level packaging, flip chip, advanced substrates, novel assembly technologies, interposers, TSVs, MEMS & sensors, electronic (digital, analog, & RF), and optoelectronic & photovoltaic device packaging.
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Chair
Joseph W. Soucy Draper Laboratory MS 80 555 Technology Square Cambridge MA 02139-3563 USA Phone: +1-617-258-2953 Email: Click Here |
Assistant Chair
Raj N. Master Microsoft Corporation SVC 2, 2410 1065 La Avenida Mountain View ca 94043 USA Phone: +1-650-693-0849 Email: Click Here |
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Daniel Baldwin
Engent, Inc. Suite 300A 3140 Northwoods Pkwy Norcross GA 30071 USA Phone: +1-678-990-3320 Email: Click Here |
Rozalia Beica
Lam Research AG Customer Application Technology SEZ Strasse 1 Villach 9500 Austria Phone: +43 (0) 676 8204 1233 Email: Click Here |
Christopher Bower
Semprius, Inc. Suite C 4915 Prospectus Dr. Durham NC 27713 USA Phone: +1-919-522-5022 Email: Click Here |
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Jianwei Dong
Dow Electronic Materials 455 Forest St. Marlborough MA 01752 USA Phone: +1-508-229-7117 Email: Click Here |
Paul M. Harvey
IBM Corporation SG Packaging Group 11400 Burnet Road Austin TX 78758 USA Phone: +1-512-286-6554 Email: Click Here |
Altaf Hasan
Intel Corporation CH3-206 5000 W Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-554-3427 Email: Click Here |
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Erik Jung
Fraunhofer IZM System Integration and Interconnect Technologies Gustav-Meyer-Allee 25 Berlin D 13355 Germany Phone: +49-30-46403-230 Email: Click Here |
Sam Karikalan
Broadcom Corporation 5300 California Ave Irvine CA 92617 USA Phone: +1-949-926-7296 Email: Click Here |
Beth Keser
Qualcomm, Inc. R-343U 5775 Morehouse Dr San Diego CA 85284 USA Phone: +1-858-658-3332 Email: Click Here |
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Young-Gon Kim
IDT 6024 Silver Creek Valley Road San Jose CA 95138 USA Phone: +1-408-360-1545 Email: Click Here |
John Knickerbocker
IBM Corporation 06-116 1101 Kitchawan Road Yorktown Heights NY 10598 USA Phone: +1-914-945-3306 Email: Click Here |
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John H. Lau
ITRI Rm. 169, Bldg. 14 195, Sec. 4, Chung Hsing Rd. Chutung Hsinchu 310 Taiwan Phone: +1-886-3591-3390 Email: Click Here |
S. W. Ricky Lee
Hong Kong University of Science and Technology Department of Mechanical Engineering Clear Water Bay Kowloon Hong Kong Phone: +852-2358-7203 Email: Click Here |
Luu T. Nguyen
Texas Instruments A2-300 2900 Semiconductor Drive Santa Clara CA 95052-8090 USA Phone: +1-408-721-4786 Email: Click Here |
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Raj Pendse
STATS ChipPAC, Inc. 47400 Kato Road Fremont CA 94538 USA Phone: +1-510-979-8330 Email: Click Here |
Peter Ramm
Fraunhofer EMFT Research Institution for Modular Solid State Technologies Hansastr. 27d Munich 80686 Germany Phone: +49-89-54759-539 Email: Click Here |
Subhash L. Shinde
Sandia National Laboratory 1127 PO Box 5800 Albuquerque NM 87185-1127 USA Phone: +1-505-284-2965 Email: Click Here |
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E. Jan Vardaman
TechSearch International, Inc. Suite 150 4801 Spicewood Springs Road Austin TX 78759 USA Phone: +1-512-372-8887 Email: Click Here |
James Jian Zhang
Micron Technology, Inc. 2235 Iron Point Road Folsom CA 95630 USA Phone: +1-916 458 3540 Email: Click Here |
