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Daniel Baldwin
Engent, Inc.
Suite 300A
3140 Northwoods Pkwy
Norcross GA 30071
USA
Phone:+1-678-990-3320
Fax: +1-678-990-3324
Email: dan.baldwin@engentaat.com
Charles Banda
Laboratory for Physical Sciences
Center for Exceptional Computing
8050 Greenmead Dr.
College Park MD 20740
USA
Phone:+1-410-854-0887
Fax:
Email: cvbanda@lps.umd.edu
Rozalia Beica
Applied Materials
Building 11, 1B05-11
3320 Scott Blvd.
Santa Clara CA 95054
USA
Phone:+1-408-886-4619
Fax:
Email: Rozalia_Beica@amat.com
Christopher Bower
Semprius, Inc.
Suite C
4915 Prospectus Dr.
Durham NC 27713
USA
Phone:+1-919-522-5022
Fax:
Email: chris.bower@semprius.com
Paul M. Harvey
IBM Corporation
SG Packaging Group
11400 Burnet Road
Austin TX 78758
USA
Phone:+1-512-286-6554
Fax: +1-512-838-1272
Email: PMHarvey@us.ibm.com
Altaf Hasan
Intel Corporation
CH5-157
5000 W Chandler Blvd.
Chandler AZ 85226
USA
Phone:+1-480-554-3427
Fax: +1-480-552-1295
Email: altaf.x.hasan@intel.com
Erik Jung
Fraunhofer IZM
System Integration and Interconnect Technologies
Gustav-Meyer-Allee 25
D-13355 Berlin
Germany
Phone:+49-30-46403-230
Fax: +49-30-46403-161
Email: erju@izm.fraunhofer.de
Sam Karikalan
Broadcom Corporation

5300 California Ave
Irvine CA 92617
USA
Phone:+1-949-926-7296
Fax: +1-949-926-9261
Email: samk@broadcom.com
Beth Keser
Qualcomm, Inc.
WT-1210E
5775 Morehouse Dr
San Diego CA 85284
USA
Phone:+1-858-658-3332
Fax:
Email: bethk@qualcomm.com
Young-Gon Kim
Intersil

783 Clara Drive
Palo Alto CA 94303
USA
Phone:+1-408-546-3371
Fax: +1-408-434-5363
Email: ykim@intersil.com
John Knickerbocker
IBM Corporation
06-116
1101 Kitchawan Road
Yorktown Heights NY 10598
USA
Phone:+1-914-945-3306
Fax:
Email: knickerj@us.ibm.com
Jeffrey A. Knight
Endicott Interconnect Technologies, Inc.
Bldg. 14-3, Office I007
1093 Clark Street
Endicott NY 13760
USA
Phone:+1-607-755-1105
Fax: +1-607-755-6400
Email: jeff.knight@eitny.com
John H. Lau
ITRI
Rm. 169, Bldg. 14
195, Sec. 4, Chung Hsing Rd.
Chutung Hsinchu 310
Taiwan
Phone:+886-3591-3390
Fax:
Email: johnlau@itri.org.tw
S. W. Ricky Lee
Hong Kong University of Science and Technology
Department of Mechanical Engineering
Clear Water Bay
Kowloon
Hong Kong
Phone:+852-2358-7203
Fax: +852-2358-1543
Email: rickylee@ust.hk
Raj N. Master
Microsoft Corporation
SVC 2, 2410
1065 La Avenida
Mountain View ca 94043
USA
Phone:+1-650-693-0849
Fax:
Email: rajm@microsoft.com
Luu T. Nguyen
National Semiconductor Corporation
D3-300
PO Box 58090
Santa Clara CA 95052-8090
USA
Phone:+1-408-721-4786
Fax: +1-408-746-2007
Email: Luu.Nguyen@NSC.com
Raj Pendse
STATS ChipPAC, Inc.

47400 Kato Road
Fremont CA 94538
USA
Phone:+1-510-979-8330
Fax: +1-510-979-8009
Email: raj.pendse@statschippac.com
Sudipta K. Ray
IBM Corporation
M/S 81A
2070 Route 52
Hopewell Junction NY 12533-6531
USA
Phone:+1-845-894-6240
Fax: +1-845-892-6799
Email: skray@us.ibm.com
Subhash L. Shinde
Sandia National Laboratory
1084
PO Box 5800
Albuquerque NM 87185-1084
USA
Phone:+1-505-284-2965
Fax: +1-505-845-2435
Email: slshind@sandia.gov
Joseph W. Soucy
Draper Laboratory
MS 80
555 Technology Square
Cambridge MA 02139-3563
USA
Phone:+1-617-258-2953
Fax: +1-617-258-1779
Email: Jsoucy@draper.com
E. Jan Vardaman
TechSearch International, Inc.
Suite 150
4801 Spicewood Springs Road
Austin TX 78759
USA
Phone:+1-512-372-8887
Fax: +1-512-372-8889
Email: tsi@techsearchinc.com
James Jian Zhang
Numonyx Corporation
FM3-N-40
1900 Prairie City Road
Folsom CA 95630
USA
Phone:+1-916-377-8893
Fax: +1-916-356-2119
Email: james.jian.zhang@numonyx.com
   

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