ECTC | IEEE Electronic Components and Technology Conference

Applied Reliability

Major Topics: Package reliability, characterization and test methods, interconnection reliability; solder and material characterization, and next generation/novel packaging reliability.

Chair Keith Newman Hewlett-Packard M/S 1419 1501 Page Mill Road Palo Alto CA 94304 USA Phone: +1-650-857-4482 Email: Click Here	Assistant Chair Scott Savage Medtronic Microelectronics Center 2343 W. Medtronic Way Tempe AZ 85281-5133 USA Phone: +1-480-303-4749 Email: Click Here
Jo Caers Royal Philips Philips Applied Technologies, Electronic Packaging and Thin Film HTC7 Eindhoven 5656 AE Netherlands Phone: +31 4027-48920 Email: Click Here	Sridhar Canumalla Microsoft Corporation Redmond WA USA Phone: +1-425-538-4060 Email: Click Here	Tim Chaudhry Broadcom Corporation 5300 California Ave Irvine CA 92617 USA Phone: +1-949-926-5977 Email: Click Here
Tz-Cheng Chiu National Cheng Kung University 1 University Rd., East District Tainan 701 Taiwan Phone: +886-6-2757575 Email: Click Here	Darvin R. Edwards Texas Instruments, Inc. PO Box 655012, MS940 Dallas TX 75265 USA Phone: +1-972-995-3569 Email: Click Here	Deepak Goyal Intel Corporation CH5-263 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-554-5203 Email: Click Here
Vikas Gupta Texas Instruments MS 8645 12500 TI Blvd Dallas TX 75243 USA Phone: +1-214-567-3160 Email: Click Here	Dongming He Qualcomm, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-651-8139 Email: Click Here	Toni Mattila Aalto University Plazankuja 2 B 23 Helsinki 00580 Finland Phone: +358-405009909 Email: Click Here
Donna M. Noctor Siemens Industry, Inc. 5596 Furnace Hill Road Zionsville PA 18092 USA Phone: +1-973-593-6585 Email: Click Here	John H. L. Pang Nanyang Technological University Rm N3-02b-55 50 Nanyang Ave Singapore 639798 Singapore Phone: +65-6790-5514 Email: Click Here	S.B. Park Binghamton University Thomas J. Watson School of Engineering and Applied Science Binghamton NY 13902-6000 USA Phone: +1-607-777-3415 Email: Click Here
Lakshmi N. Ramanathan Microsoft Corporation Studio B/ 2797 One Microsoft Way Redmond WA 98052 USA Phone: +1-425-421-3838 Email: Click Here	Ephraim Suhir University of California, Santa Cruz ERS Co. 727 Alvina Court Los Altos CA 94024 USA Phone: +1-650-969-1530 Email: Click Here	Jeffrey Suhling Auburn University Department of Mechanical Engineering 1418 Wiggins Hall Auburn AL 36849 USA Phone: +1-334-844-3332 Email: Click Here
Dongji Xie NVIDIA Corp Santa Clara CA 95050 USA Phone: +1-408-486-8630 Email: Click Here