Interconnections
Major Topics: Design, structure, processes, performance, reliability (including electromigration), and test of first- and second-level interconnections. Interconnections for 3D integration including TSV and silicon interposers; interconnections in substrates, PCBs and systems. Solder bumping and Cu-pillar for flip chip packaging, wafer-level
packaging, advanced wirebond interconnections, non-solder interconnections and connectors.
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Chair
Bernd Ebersberger Intel Mobile Communications ETS BE FCP Am Campeon 10-12 Neubiberg 85579 Germany Phone:+49-89-998853-53281 Fax: Email: Click Here |
Assistant Chair
Gilles Poupon CEA-LETI-MINATEC 17, rue des Martyrs Grenoble Cedex 9 38054 France Phone:+33-438-785-399 Fax: Email: Click Here |
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Flynn Carson
STATS ChipPAC, Inc. 47400 Kato Rd Fremont CA 94538 USA Phone:+1 510-979-8338 Fax: Email: Click Here |
William Chen
Advanced Semiconductor Engineering, Inc. 3590 Peterson Way Santa Clara CA 95054 USA Phone:+1-408-986-6505 Fax: Email: Click Here |
Rajen Dias
Intel Corporation CH5-263 5000 W. Chandler Blvd. Chandler AZ 85226-3699 USA Phone:+1-480-554-5202 Fax: Email: Click Here |
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Alan Huffman
RTI International Center for Materials and Electronic Technlogies 3040 Cornwallis Road RTP NC 27709 USA Phone:+1-919-248-9216 Fax: Email: Click Here |
Li Li
Cisco Systems, Inc. SJC-D/2/4 170 West Tasman Drive San Jose CA 95134 USA Phone:+1-408-527-0801 Fax: Email: Click Here |
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Changqing Liu
Loughborough University Wolfson School of Mechanical & Manufacturing Engineering Leicestershire Loughborough LE11 3TU United Kingdom Phone:+44-1509-227681 Fax: Email: Click Here |
Wei-Chung Lo
ITRI B17-205, 195, Sec. 4, ChungHsing Rd. Chutung, HsinChu 31040 Taiwan, ROC Phone:+ 886-3-591-7024 Fax: Email: Click Here |
James Lu
Rensselaer Polytechnic Institute CII-6015/CIE 110 8th Street Troy NY 12180 USA Phone:+1-518-276-2909 Fax: Email: Click Here |
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Voya Markovich
Endicott Interconnect Technologies, Inc. B257-2 1701 North Street Endicott NY 13760 USA Phone:+1-607-755-1978 Fax: Email: Click Here |
David McCann
Global Foundries 400 Stone Break Rd Extension Malta NY 12020 USA Phone:+1-518-222-6128 Fax: Email: Click Here |
James E. Morris
Portland State University ECE Dept., Fourth Avenue Bldg. Suite 160 1900 SW 4th Avenue Portland OR 97207-0751 USA Phone:+1-503-725-9588 Fax: Email: Click Here |
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Lou Nicholls
Amkor Technology, Inc. 1900 S. Price Rd Chandler AZ 85286 USA Phone:480-786-7687 Fax: Email: Click Here |
Prema Palaniappan
Texas Instruments, Inc. 940 13536 North Central Expressway Dallas TX 75243 USA Phone:+1-972-995-2189 Fax: +1-972-995-2658 Email: Click Here |
Senol Pekin
Intel Corporation CH05-157 500 W. Chandler Blvd. Chandler AZ 85226-3699 USA Phone:+1-480-552-4898 Fax: +1-480-552-1304 Email: Click Here |
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Wolfgang Sauter
IBM Corporation 9615L 1000 River Road Essex Junction VT 05452 USA Phone:+1-802-769-3634 Fax: +1-802-769-1038 Email: Click Here |
Lei Shan
IBM Corporation Rt. 134, PO Box 218 Yorktown Heights NY 10598 USA Phone:+1-914-945-2304 Fax: Email: Click Here |
Akitsu Shigetou
National Institute for Materials Science Functional Interconnection Group 1-1, Namiki, Tsukuba Ibaraki 305-0044 Japan Phone:+81-29-860-4342 Fax: Email: Click Here |
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Matthew Yao
Rockwell Collins 108-102 400 Collins Road Cedar Rapids IA 52498 USA Phone:+1-319-295-0147 Fax: Email: Click Here |
