Professional Development Courses

ECTC is again pleased to offer 16 professional development courses (PDCs) for 2013, covering a number of topics in electronic packaging. PDCs will be held on Tuesday, May 28th, 2013 with 8 parallel courses held in each of the morning and afternoon sessions. Lunch is provided with your PDC registration fee.

For detailed course descriptions and associated information please refer to the ECTC 2013 Advance Program in PDF.

Morning Courses

  1. Lead-Free Solder Joint Reliability – Material Consideration
    Course Leader: Ning Cheng Lee – Indium Corporation
  2. Multi-Physics Modeling in IC Packaging and Microsystems
    Course Leader: Xuejun Fan – Lamar University
  3. Thermal and Mechanical Simulation Techniques for 3D Stacking Yield and Reliability
    Course Leader: Kamal Karimanal – Cielution LLC
  4. Wafer Level Chip Scale Packaging (WLCSP)
    Course Leader: Luu Nguyen – Texas Instruments
  5. Polymers/Nano-Composites – Electronic & Photonic Packaging Recent Advances
    Course Leaders: C. P. Wong – Georgia Institute of Technology; Daniel Lu ­– Henkel Corporation
  6. Power Electronics Thermal Packaging and Reliability
    Course Leaders: Avram Bar-Cohen, Patrick McCluskey – University of Maryland
  7. Fundamental Concepts of Reliability and Mechanics in Electronic Packaging
    Course Leaders: Shubhada Sahasrabudhe, Sandeep Sane – Intel Corporation
  8. High-Frequency Modeling and Optimization of Interconnections in Electronic Packaging
    Course Leaders: Ivan Ndip, Michael Toepper – Fraunhofer IZM
Afternoon Courses
  1. Package Failure Analysis – Failure Analysis and Analytical Tools
    Course Leaders: Rajen Dias, Deepak Goyal – Intel Corporation
  2. Modeling and Simulation of Reliability in Electronic Packaging
    Course Leaders: Craig Hillman, Nathan Blattau – DfR Solutions
  3. 3D IC Packaging & Integration, and 3D Si Integration
    Course Leader: John Lau – Industrial Technology Research Institute
  4. Chip Package Interaction with TSV Reliability for 40nm and Below
    Course Leader: C. S. Premachandran – GLOBALFOUNDRIES
  5. Polymers in Electronic Packaging
    Course Leader: Jeffrey Gotro – InnoCentrix, LLC
  6. Flip Chip Technology
    Course Leader: Eric Perfecto – IBM Corporation
  7. Design for Package Reliability
    Course Leaders: Darvin Edwards, Yaoyu Pang – Texas Instruments
  8. IC Package Design Signal & Power Integrity & EMC
    Course Leader: Sam Karikalan – Broadcom Corporation