Professional Development Courses

I am excited about the line-up for the Professional Development Courses (PDC) for the 68th ECTC in San Diego, California.  There is a strong slate of industry experts that we have engaged to cover key Electronic Component and Manufacturing Technologies.  As you review the courses below please consider either an AM/PM course, or both, that fits your development needs.  As always ECTC offers 0.4 CEU’s for each course.  This is a great and interesting way to fulfill your individual state’s Professional License requirements or simply a way to stay in touch with specific areas in your field.

I look forward to seeing you in San Diego.

Kitty Pearsall, PhD., PE
ECTC PDC Chair

MORNING COURSES 8:00 AM – 12:00PM

  1. ACHIEVING HIGH RELIABILITY OF LEAD-FREE SOLDER JOINTS – MATERIALS CONSIDERATIONS
    Course Leader: Ning-Cheng Lee – Indium Corporation
  2. INTRODUCTION TO FAN-OUT WAFER LEVEL PACKAGING
    Course Leader: Beth Keser – Intel Corporation
  3. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR ADVANCED SEMICONDUCTOR PACKAGING
    Course Leader: Aric Shorey and Dr. Jingshi Wu– Corning Inc.
  4. FUTURE OF DEVICE AND SYSTEMS PACKAGING IN POST MOORE’S LAW
    Course Leader: Rao Tummala – Georgia Institute of Technology
  5. INTRODUCTION TO MECHANICS BASED QUALITY AND RELIABILITY ASSESSMENT METHODOLOGY
    Course Leaders: Shubhada Sahasrabudhe and Sandeep Sane – Intel Corporation
  6. POLYMERS AND NANOCOMPOSITES FOR ELECTRONIC AND PHOTONIC PACKAGING
    Course Leaders: C. P. Wong – Georgia Institute of Technology; Daniel Lu –Henkel Corporation
  7. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS
    Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
  8. RELIABILITY MECHANCS AND MODELING FOR IC PACKAGING – THEORY, IMPLEMENTATION AND PRACTICES
    Course Leaders: Ricky Lee -- HKUST and Xuejun Fan – Lamar University
  9. INTEGRATED THERMAL PACKAGING AND RELIABILITY OF POWER ELECTRONICS
    Course Leader: Patrick McCluskey  – University of Maryland

AFTERNOON COURSES 1:15 AM – 5:15PM

  1. FLIP CHIP FABRICATION AND INTERCONNECTION
    Course Leaders: Eric Perfecto – GlobalFoundries; Shengmin Wen – Synaptics Inc.
  2. WAFER LEVEL CHIP SCALE PACKAGING
    Course Leader: Luu Nguyen -- Texas Instruments, Inc.
  3. FLEXIBLE HYBRID ELECTRONICS - MANUFACTURING AND RELIABILITY
    Course Leader: Pradeep Lall – Auburn University
  4. FAN-OUT WAFER-LEVEL PACKAGING AND 3D PACKAGING
    Course Leader: John Lau – ASM Pacific Technology Ltd.
  5. POLYMERS FOR ELECTRONIC PACKAGING
    Course Leader: Jeffrey Gotro – InnoCentrix, LLC
  6. CORROSION IN MICROELECTRONIC PACKAGES
    Course Leader: Varughese Mathew – NXP Semiconductors
  7. AGEING OF POLYMERS AND THE INFLUENCE ON MICROELECTRONIC PACKAGE RELIABILITY
    Course Leaders: Tanja Braun and Ole Hölck – Fraunhofer IZM
  8. SOLVING PACKAGE FAILURE MECHANISMS FOR IMPROVED RELIABILITY
    Course Leader: Darvin Edwards –Edwards Enterprises
  9. DESIGN AND OPTIMIZATION OF HEAT SINKS
    Course Leaders: Marc Hodes – Tufts University and Georgios Karamanis –Transport Phenomena Technologies, LLC.

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.