Technical Program

Thursday, May 28, 2009

Session 15: Advances in Predictive Reliability
8:00 a.m. - 11:40 a.m.
Committee: Applied Reliability
Harbor Island I

Session Co-Chairs:

Lakshmi N. Ramanathan
Freescale Semiconductor, Inc.
T +1-480-413-5659
F +1-480-413-6744
r37378@freescale.com

Patrick Thompson
Texas Instruments, Inc.
T +1-972-995-7660
F +1-972-995-2658
patrick.thompson@ti.com

Papers:

1. 8:00 AM - Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis
Daeil Kwon- University of Maryland
Michael H. Azarian- University of Maryland
Michael Pecht- University of Maryland

2. 8:25 AM - Fault-Mode Classification for Health Monitoring of Electronics Subjected to Drop and Shock
Pradeep Lall- Auburn University
Prashant Gupta- Auburn University
Dhananjay Panchagade- Auburn University
Arjun Angral- Auburn University

3. 8:50 AM - Parametric Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling Conditions
Mudasir Ahmad- Cisco Systems, Incorporated
Weidong Xie- Cisco Systems, Incorporated
Kuo-Chuan Liu- Cisco Systems, Incorporated
Jie Xue- Cisco Systems, Incorporated
Dave Towne- Cisco Systems, Incorporated

4. 10:00 AM - Interfacial Stresses in a Bi-Material Assembly Subjected to External Tensile Forces and Bending Moments Applied to the Ends of One of Its Components
Ephraim Suhir- University of California, Santa Cruz; University of Maryland, College Park; ERS Company
Milena Vujosevic- Intel Corporation

5. 10:25 AM - Board Level Drop Test Modeling for System-in-Packages
Masazumi Amagai- Texas Instruments
Eiichi Yamada- Texas Instruments

6. 10:50 AM - An Integrated Creep, Crack Growth and Thermo-Mechanical Fatigue Model for WLCSP Assemblies Soldered with SAC 405
Paresh Limaye- IMEC
Bart Vendevelde- IMEC
Dirk Vandepitte- Catholic University Leuven
Bert Verlinden- Catholic University Leuven

7. 11:15 AM - "Stretchable" Electronics: Does One Really Need a Good Thermal Expansion (Contraction) Match between the Silicon Die and the Plastic Carrier?
E. Suhir- University of California, Santa Cruz; University of Maryland, College Park; ERS Company LLC