Technical Program
Friday, June 04, 2010
Session 31: Processes for 3D Integration
8:00 a.m. - 11:40 a.m.
Committee: Advanced Packaging
Concorde A
Session Co-Chairs:
|
Christopher Bower Semprius, Inc. T +1-919-522-5022 F chris.bower@semprius.com |
Subhash L. Shinde Sandia National Laboratory T +1-505-284-2965 F +1-505-845-2435 slshind@sandia.gov |
Papers:
1. 1:30 PM - Vertical Metal Interconnect Thanks to Tungsten Direct Bonding
Léa Di Cioccio- CEA LETI-Minatec
Pierric Gueguen- CEA LETI-Minatec
Etienne Grouiller- CEA LETI-Minatec
Laurent Vandroux- CEA LETI-Minatec
Vincent Delaye- CEA LETI-Minatec
Maurice Rivoire- STMicroelectronics
Jean-François Lugand- STMicroelectronics
Laurent Clavelier- CEA LETI-Minatec
2. 1:55 PM - Low Temperature Bumpless Cu-Cu Bonding Enhancement with Self Assembled Monolayer (SAM) Passivation for 3-D Integration
Dau Fatt Lim- Nanyang Technological University
Jun Wei- Singapore Institute of Manufacturing Technology (SIMTech)
Chee Mang Ng- Globalfoundries
Chuan Seng Tan- Nanyang Technological University
3. 2:20 PM - Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration
Chukwudi Okoro- IMEC, K.U. Leuven
Rahul Agarwal- IMEC
Paresh Limaye- IMEC
Bart Vandevelde- IMEC
Dirk Vandepitte- K.U. Leuven
Eric Beyne- IMEC
4. 3:30 PM - 3D Chip Stacking & Reliability Using TSV-Micro C4 Solder Interconnection
K.Y. Au- United Test and Assembly Center, Ltd.
S.L. Kriangsak- United Test and Assembly Center, Ltd.
X.R. Zhang- United Test and Assembly Center, Ltd.
W.H. Zhu- United Test and Assembly Center, Ltd.
C.H. Toh- United Test and Assembly Center, Ltd.
5. 3:55 PM - Evaluation of Thin Wafer Processing Using a Temporary Wafer Handling System as Key Technology for 3D System Integration
K. Zoschke- Fraunhofer IZM
M. Wegner- Fraunhofer IZM
M. Wilke- Fraunhofer IZM
N. Jürgensen- Fraunhofer IZM
C. Lopper- Fraunhofer IZM
I. Kuna- Fraunhofer IZM
V. Glaw- Fraunhofer IZM
J. Röder- Technical University, Berlin
O. Wünsch- Technical University, Berlin
M.J. Wolf- Fraunhofer IZM
O. Ehrmann- Fraunhofer IZM
H, Reichl- Fraunhofer IZM
6. 4:20 PM - CMOS Compatible Thin Wafer Processing Using Temporary Mechanical Wafer, Adhesive and Laser Release of Thin Chips/Wafers for 3D Integration
Bing Dang- IBM Corporation
Paul Andry- IBM Corporation
Cornelia Tsang- IBM Corporation
Joana Maria- IBM Corporation
Robert Polastre- IBM Corporation
Robert Trzcinski- IBM Corporation
Aparna Prabhakar- IBM Corporation
John Knickerbocker- IBM Corporation
7. 4:45 PM - Fine Pitch Chip Interconnection Technology for 3D Integration
Jihwan Hwang- Samsung Electronics Co., Ltd.
Jongyeon Kim- Samsung Electronics Co., Ltd.
Woonseong Kwon- Samsung Electronics Co., Ltd.
Unbyoung Kang- Samsung Electronics Co., Ltd.
Taeje Cho- Samsung Electronics Co., Ltd.
Sayoon Kang- Samsung Electronics Co., Ltd.