Technical Program
Wednesday, June 02, 2010
Session 5: Advances in Predictive Reliability
8:00 a.m. - 11:40 a.m.
Committee: Applied Reliability
Champagne 1
Session Co-Chairs:
|
Lakshmi N. Ramanathan Microsoft Corporation T +1-425 421 3838 F +1-425 936 7329 laramana@microsoft.com |
Ephraim Suhir University of California, Santa Cruz T +1-650-969-1530 F +1-650-968-4611 suhire@aol.com |
Papers:
1. 8:00 AM - Finite Element Based Fatigue Life Prediction for Electronic Components under Random Vibration Loading
Da Yu- Binghamton University
Abdullah Al-Yafawi- Binghamton University
Seungbae Park- Binghamton University
Soonwan Chung- Samsung Electronics
2. 8:25 AM - Mechanical Analysis and Reliability Enhancement of a Proximity Communication Flip Chip Package
Bruce Guenin- Oracle
Jing Shi- Oracle
3. 8:50 AM - Quantification of Micropartial Residual Stress for Mechanical Characterization of TSV through Nanoinstrumented Indentation Testing
Gyujei Lee- Hynix Semiconductor, Inc.
Ho Young Son- Hynix Semiconductor, Inc.
Joon Ki Hong- Hynix Semiconductor, Inc.
Kwang Yoo Byun- Hynix Semiconductor, Inc.
Dongil Kwon- Seoul National University
4. 10:00 AM - Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling
Pradeep Lall- Auburn University
Rahul Vaidya- Auburn University
Vikrant More- Auburn University
Kai Goebel- NASA Ames Research Center
Jeff Suhling- Auburn University
5. 10:25 AM - Full Characterization of Cu/Cu Direct Bonding for 3D Integration
Rachid Taibi- STMicroelectronics
Léa Di Cioccio- CEA LETI-Minatec
Cedrick Chappaz- STMicroelectronics
Laurent-Luc Chapelon- STMicroelectronics
Pierric Gueguen- CEA LETI-Minatec
Jérôme Dechamp- CEA LETI-Minatec
Roland Fortunier- Université de Lyon
Laurent Clavelier- CEA LETI-Minatec
6. 10:50 AM - A Study of Package Warpage for Package on Package (PoP)
Masazumi Amagai- Texas Instruments, Japan
Yutaka Suzuki- Texas Instruments, Japan
7. 11:15 AM - Reliability of Au-Ag Alloy Wire Bonding
Hai Liu- Samsung Semiconductor
Qi Chen- Samsung Semiconductor
Zhenqing Zhao- Samsung Semiconductor
Qian Wang- Samsung Semiconductor
Jianfeng Zeng- Samsung Semiconductor
Jonghyun Chae- Samsung Semiconductor
Jaisung Lee- Samsung Semiconductor