Technical Program

Thursday, June 03, 2010

Session 21: Solder Joint Reliability Characterization
1:30 PM - 5:10 PM
Committee: Applied Reliability
Versailles 3 & 4

Session Co-Chairs:

Donna M. Noctor
Siemens Industry, Inc.
T +1-973-593-6585
F +1-209-671-7576
donna.noctor@siemens.com

Tim Chaudhry
Broadcom Corporation
T +1-949-926-5977
F
chaudhry@broadcom.com

Papers:

1. 1:30 PM - Prognostics Using Kalman-Filter Models and Metrics for Risk Assessment in BGAs Under Shock and Vibration Loads
Pradeep Lall- Auburn University
Ryan Lowe- Auburn University
Kai Goebel- NASA Ames Research Center

2. 1:55 PM - A New Drop Test Vehicle for a Uniform Shock Response
Dongji Xie- Flextronics
David Geiger- Flextronics
Dongkai Shangguan- Flextronics
Billy Hu- Flextronics
Bill Werner- Trimble Navigation Limited

3. 2:20 PM - Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test
Pradosh Guruprasad- Binghamton University
James Pitarresi- Binghamton University
Bob Sykes- XYZTEC bv

4. 3:30 PM - Investigation of Pb-Free Solder Interconnect under Drop Impact by Ball Pull and Ball Shear Tests
Soon-Wan Chung- Samsung Electronics
Mi-Jin Kim- Samsung Electronics

5. 3:55 PM - Investigation of Joule Heating Effect in Various Stages of Electromigration in Flip-Chip Solder Joints by Infrared Microscopy
Hsiang-Yao Hsiao- National Chiao Tung University
Chih Chen- National Chiao Tung University
D.J. Yao- National Tsing Hua University

6. 4:20 PM - Effects of Corner and Edgebond Epoxy Adhesives on Board Level Solder Joint Reliability of BGA Mezzanine Connectors
Fubin Song- Hong Kong University of Science and Technology
Chaoran Yang- Hong Kong University of Science and Technology
H.L. Henry Wu- Hong Kong University of Science and Technology
C.C. Jeffery Lo- Hong Kong University of Science and Technology
S.W. Ricky Lee- Hong Kong University of Science and Technology
Keith Newman- Oracle

7. 4:45 PM - Thermal Shock and Drop Test Performance of Lead-Free Assemblies with No-Underfill, Corner-Underfill and Full-Underfill
Bankeem V. Chheda- CEMA-RIT
S. Manian Ramkumar- CEMA-RIT
Reza Ghaffarian- Jet Propulsion Laboratory