Technical Program

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Wednesday, June 02, 2010

Session 9: Electrical, Thermal and Reliability Modeling
1:30 PM - 5:10 PM
Committee: Modeling & Simulation
Versailles 3 & 4

Session Co-Chairs:

Pradeep Lall Auburn University T +1-334-844-3424 F +1-334-844-3307 lall@eng.auburn.edu

Michael Lamson Consultant T +1­231-544-8093 F m-lamson@ieee.org

Papers:

1. 1:30 PM - Alternating-Direction Explicit FDTD Method for Three-Dimensional Full-Wave Simulation
Shuichi Aono- SESAME Technology Inc.
Masaki Unno- Shizuoka University
Hideki Asai- Shizuoka University, SESAME Technology Inc.

2. 1:55 PM - Receiver Macro Modeling Including DC, Filter, and Preamplifier Nonlinear Properties for Packaging System Transient Simulations
Zhaoqing Chen- IBM Corporation

3. 2:20 PM - Utilizing Time-Domain Waveform to Synthesize Scalable SPICE-Compatible Macro-Models of Interconnectors
Chen-Chao Wang- Advanced Semiconductor Engineering, Inc.
Chih-Wen Kuo- National Sun Yat-Sen University
Che-Ching Wu- National Sun Yat-Sen University
Sung-Mao Wu- National University of Kaohsiung
C.T. Chiu- Advanced Semiconductor Engineering, Inc.
C.P. Hung- Advanced Semiconductor Engineering, Inc.

4. 3:30 PM - Some Remarks on Finite Element Modeling of Electromigration in Solder Joints
P. Dandu- Lamar University
X.J. Fan- Lamar University
Y. Liu- Fairchild Semiconductor Corporation

5. 3:55 PM - Modeling for Defects Impact on Electrical Performance of Power Packages
Yumin Liu- Fairchild Semiconductor Corporation
Chung-Lin Wu- Fairchild Semiconductor Corporation
Yong Liu- Fairchild Semiconductor Corporation
Dan Kinzer- Fairchild Semiconductor Corporation
O.S. Jeon- Fairchild Semiconductor Corporation

6. 4:20 PM - Mitigating Heat Dissipation and Thermo-Mechanical Stress Challenges in 3-D IC Using Thermal Through Silicon Via (TTSV)
Santhosh Onkaraiah- Nanyang Technological University
Chuan Seng Tan- Nanyang Technological University

7. 4:45 PM - Atomistic Simulations of Heat Transfer at Carbon Nanotube/Si Interfaces
Ajing Cao- Northwestern University
Jianmin Qu- Northwestern University
Matthew Yao- Rockwell Collins, Inc.