Technical Program

Thursday, June 03, 2010

Session 24: Manufacturing Aspects of 3D
1:30 PM - 5:10 PM
Committee: Assembly & Manufacturing Technology
Champagne 4

Session Co-Chairs:

Claudius Feger
IBM Corporation
T +1-914-945-3466
F +1-914-945-4219
feger@us.ibm.com

Tom Poulin
Aerie Engineering
T +1-909-248-1237
F +1-951-248-1237
poulintr@cs.com

Papers:

1. 1:30 PM - TSV Manufacturing Yield and Hidden Costs for 3D IC Integration
John H. Lau- Industrial Technology Research Institute (ITRI)

2. 1:55 PM - Assembly and Reliability Characterization of 3D Chip Stacking with 30µm Pitch Lead-Free Solder Micro Bump Interconnection
Chau-Jie Zhan- Industrial Technology Research Institute (ITRI)
Chun-Chih Chuang - Industrial Technology Research Institute (ITRI)
Jing-Ye Juang- Industrial Technology Research Institute (ITRI)
Su-Tsai Lu- Industrial Technology Research Institute (ITRI)
Tao-Chih Chang- Industrial Technology Research Institute (ITRI)

3. 2:20 PM - Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration
T. Fukushima- Tohoku University
E. Iwata- Tohoku University
K.-W. Lee- Tohoku University
T. Tanaka- Tohoku University
M. Koyanagi- Tohoku University

4. 3:30 PM - A New Plasma Source for Next Generation MEMS Deep Si Etching: Minimal Tilt, Improved Profile Uniformity and Higher Etch Rates
Richard Barnett- SPP Process Technology Systems
Dave Thomas- SPP Process Technology Systems
Yiping Song- SPP Process Technology Systems
David Tossell- SPP Process Technology Systems
Tony Barrass- SPP Process Technology Systems
Oliver Ansell- SPP Process Technology Systems

5. 3:55 PM - Thermal and Electrical Characterization of eWLB (Embedded Wafer Level BGA)
Seung Wook Yoon- STATS ChipPAC, Inc.
Roger Emigh - STATS ChipPAC, Inc.
Kai Liu- STATS ChipPAC, Inc.
Sin Jae Lee- STATS ChipPAC, Inc.
Ray Coronado- STATS ChipPAC, Inc.
Flynn Carson- STATS ChipPAC, Inc.

6. 4:20 PM - Development of an 18 x 18 mm Package-on-Package Using C4NP Flip Chip Attach and Back Side Grind
Stephen MacQuarrie- IBM Corporation
Eiji Ohno- IBM Corporation
Luc Ouellet- IBM Corporation

7. 4:45 PM - Effect of Material Properties on PoP Top Package Warpage Behaviors
Myung Jin Yim- Numonyx
Richard Strode- Numonyx
Ravikumar Adimula- Numonyx
Chan Yoo- Numonyx