Technical Program

Wednesday, May 31, 2017

Session 1: Flexible Electronics, Substrate for High Frequency Applications
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Harbor Island 1

Session Co-Chairs:

Yan Liu
Medtronic Inc. USA
T +1-480-477-2311
Lejun Wang
Qualcomm Technologies, Inc.
T +1-858-658-4838


1. 8:00 AM - Assembly of Ultra Small Flip Chip Die for Flexible Hybrid Electronics (FHE) Packaging for IoT applications
Bing Dang - IBM Research
Qianwen Chen - IBM Research
Li-Wen Hung - IBM Research
Evan Colgan - IBM Research
Jae-Woong Nah - IBM Research
Bo Wen - IBM Research
Russ Budd - IBM Research
Christopher Scerb - IBM Research
John Knickerbocker - IBM Research

2. 8:25 AM - Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas
Bo Song - Georgia Institute of Technology
Ryan Barr - Georgia Institute of Technology
Fan Wu - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Manos Tentzeris - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

3. 8:50 AM - A study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Flex-On-Flex(FOF) assembly using an ultrasonic bonding method
Dal-Jin Yoon - Korea Advanced Institute of Science and Technology (KAIST)
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology (KAIST)

4. 10:00 AM - Development of Novel BT Laminate Material for Low-loss and High Speed Transmission
Masahiko Shigaki - Mitsubishi Gas Chemical company
Mika Suzuki - Mitsubishi Gas Chemical company
Takashi Kobayashi - Mitsubishi Gas Chemical Company
Kentarou Takano - Mitsubishi Gas Chemical Company
Takaki Tsuchida - Mitsubishi Gas Chemical Company
Sotaro Hiramatsu - Mitsubishi Gas Chemical Company
Yoshitaka Ueno - Mitsubishi Gas Chemical Company
Tsuyoshi Kida - Mitsubishi Gas Chemical Company
Shu Yoshida - Mitsubishi Gas Chemical Company
Toyoji Oshima - Mitsubishi Gas Chemical Company

5. 10:25 AM - Organic substrate material with low transmission loss and effective in suppressing package warpage for 5G application
Shunsuke Tonouchi - Hitachi Chemical Company, Ltd.

6. 10:50 AM - High-frequency signal propagation on printed circuit board : Dielectric loss tangent and pattern roughness
KISEOK KIM - Samsung Electro-Mechanics Company, Limited
CHANGHWA PARK - Samsung Electro-Mechanics Company, Limited
SONGI KIM - Samsung Electro-Mechanics Company, Limited
HYEJIN KIM - Samsung Electro-Mechanics Company, Limited
GAYOUNG YOO - Samsung Electro-Mechanics Company, Limited
SANGA KIM - Samsung Electro-Mechanics Company, Limited
YOOLIM CHOI - Samsung Electro-Mechanics Company, Limited
JIHYE SHIM - Samsung Electro-Mechanics Company, Limited

7. 11:15 AM - Development of multi-layered build-up insulation dry-film material for ultra-low transmission loss waveguides with low interface roughness for high-speed semi-conductor packaging
Zhong Guan - TAIYO INK MFG. CO., LTD.
Arata Endo - TAIYO INK MFG. CO., LTD.
Tadahiko Hanada - TAIYO AMERICA, INC.