Technical Program

Wednesday, May 30, 2018

Session 1: Flexible Electronics, Substrate for High Frequency Applications
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Harbor Island 1

Session Co-Chairs:

Yan Liu
Medtronic Inc. USA
T +1-480-477-2311
yan.x.liu@medtronic.com
Lejun Wang
Qualcomm Technologies, Inc.
T +1-858-658-4838
lejunw@qti.qualcomm.com

Papers:

1. 8:00 AM - In-Situ Stress Determination of Electroless Cu on PCB-relevant Substrates
Tobias Bernhard - Atotech Deutschland GmbH
Ralf Brüning - Mount Allison University
L. Gregoriades E. Steinhäuser S. Kempa F. Brüning T. Sharma D. Brown E. A. Luy

2. 8:25 AM - Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas
Bo Song - Georgia Institute of Technology
Ryan Barr - Georgia Institute of Technology
Fan Wu - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Manos Tentzeris - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

3. 8:50 AM - A Study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Flex-On-Flex(FOF) Assembly Using an Ultrasonic Bonding Method
Dal-Jin Yoon - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

4. 10:00 AM - Development of Novel BT Laminate Material for Low-Loss and High Speed Transmission
Masahiko Shigaki - Mitsubishi Gas Chemical Company, Inc.
Mika Suzuki - Mitsubishi Gas Chemical Company, Inc.
Takashi Kobayashi - Mitsubishi Gas Chemical Company, Inc.
Kentarou Takano - Mitsubishi Gas Chemical Company, Inc.
Takaki Tsuchida - Mitsubishi Gas Chemical Company, Inc.
Sotaro Hiramatsu - Mitsubishi Gas Chemical Company, Inc.
Yoshitaka Ueno - Mitsubishi Gas Chemical Company, Inc.
Tsuyoshi Kida - Mitsubishi Gas Chemical Company, Inc.
Shu Yoshida - Mitsubishi Gas Chemical Company, Inc.
Toyoji Oshima - Mitsubishi Gas Chemical Company, Inc.

5. 10:25 AM - Organic Substrate Material With Low Transmission Loss and Effective in Suppressing Package Warpage for 5G Application
Shunsuke Tonouchi - Hitachi Chemical Company, Ltd.
Etsuo Mizushima - Hitachi Chemical Company, Ltd.
Tomio Fukuda - Hitachi Chemical Company, Ltd.
Tomokazu Shimada - Hitachi Chemical Company, Ltd.
Yukio Nakamura - Hitachi Chemical Company, Ltd.
Toshiyuki Iijima - Hitachi Chemical Company, Ltd.

6. 10:50 AM - High-Frequency Signal Propagation on Printed Circuit Board: Dielectric Loss Tangent and Pattern Roughness
Kiseok Kim - Samsung Electro-Mechanics Co., Ltd.
Changhwa Park - Samsung Electro-Mechanics Co., Ltd.
Songi Kim - Samsung Electro-Mechanics Co., Ltd.
Hyejin Kim - Samsung Electro-Mechanics Co., Ltd.
Gayoung Yoo - Samsung Electro-Mechanics Co., Ltd.
Sanga Kim - Samsung Electro-Mechanics Co., Ltd.
Yoolim Choi - Samsung Electro-Mechanics Co., Ltd.
Jihye Shim - Samsung Electro-Mechanics Co., Ltd.

7. 11:15 AM - Development of Multi-Layered Build-Up Insulation Dry-Film Material for Ultra-Low Transmission Loss Waveguides With Low Interface Roughness for High-Speed Semi-Conductor Packaging
Zhong Guan - Taiyo Ink Mfg. Co., Ltd.
Arata Endo - Taiyo Ink Mfg. Co., Ltd.
Tadahiko Hanada - Taiyo America, Inc.