Technical Program
Wednesday, May 29, 2013
Session 1: 3D Assembly and Reliability
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Mont-Royal 1
Session Co-Chairs:
|
John Knickerbocker IBM Corporation T +1-914-945-3306 knickerj@us.ibm.com |
Sam Karikalan Broadcom Corporation T +1-949-926-7296 samk@broadcom.com |
Papers:
1. 8:00 AM - Reliability Studies on Micro-Bumps for 3-D TSV Integration
Ho-Young Son - SK Hynix Inc.
Sung-Kwon Noh - SK Hynix Inc.
Hyun-Hee Jung - SK Hynix Inc.
Woong-Sun Lee - SK Hynix Inc.
Jae-Sung Oh - SK Hynix Inc.
Nam-Seog Kim - SK Hynix Inc.
2. 8:25 AM - Reliability Evaluation of a CoWoS-Enabled 3D IC Package
Bahareh Banijamali - Xilinx, Inc.
Chien-Chia Chiu - Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chieh Hsieh - Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
Clark Hu - Taiwan Semiconductor Manufacturing Company, Ltd.
Shang-Yun Hou - Taiwan Semiconductor Manufacturing Company, Ltd.
Suresh Ramalingam - Xilinx, Inc.
Shin-Puu Jeng - Taiwan Semiconductor Manufacturing Company, Ltd.
Liam Madden - Xilinx, Inc.
Doug C.H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.
3. 8:50 AM - TSV and Cu-Cu Direct Bond Wafer and Package-Level Reliability
K. Hummler - SEMATECH
B. Sapp - SEMATECH
J.R. Lloyd - SUNY, Albany
S. Kruger - SEMATECH; SUNY, Albany
S. Olson - SEMATECH; SUNY, Albany
S.B. Park - SUNY, Binghamton
B. Murray - SUNY, Binghamton
D. Jung - SUNY, Binghamton
S. Cain - SUNY, Binghamton
A. Park - SUNY, Binghamton
D. Ferrone - SUNY, Binghamton
I. Ali - SEMATECH
4. 10:00 AM - Generic Rules to Achieve Bump Electromigration Immortality for 3D IC Integration
Hsiao-Yun Chen - Taiwan Semiconductor Manufacturing Company
Da-Yuan Shih - Taiwan Semiconductor Manufacturing Company
Cheng-Chang Wei - Taiwan Semiconductor Manufacturing Company
Chih-Hang Tung - Taiwan Semiconductor Manufacturing Company
Yi-Li Hsiao - Taiwan Semiconductor Manufacturing Company
Douglas Cheng-Hua Yu - Taiwan Semiconductor Manufacturing Company
Yu-Chun Liang - National Chiao Tung University
Chih Chen - National Chiao Tung University
5. 10:25 AM - 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding
T. Fukushima - Tohoku University
H. Hashiguchi - Tohoku University
J. Bea - Tohoku University
M. Murugesan - Tohoku University
K.W. Lee - Tohoku University
T. Tanaka - Tohoku University
M. Koyanagi - Tohoku University
6. 10:50 AM - Electrical Investigation and Reliability of 3D Integration Platform Using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
Yao Jen Chang - National Chiao Tung University
C.T. Ko - National Chiao Tung University, Industrial Technology Research Institute (ITRI)
Z.C. Hsiao - Industrial Technology Research Institute (ITRI)
C.H. Chiang - National Chiao Tung University
H.C. Fu - Industrial Technology Research Institute (ITRI)
T.H. Yu - National Chiao Tung University
C.H. Fan - National Chiao Tung University
W.C.. Lo - Industrial Technology Research Institute (ITRI)
K.N. Chen - National Chiao Tung University
7. 11:15 AM - Assembly of 3D Chip Stack with 30um-Pitch Micro Interconnects Using Novel Arrayed-Particles Anisotropic Conductive Film
Y.W. Huang - Industrial Technology Research Institute (ITRI)
Y.M. Lin - Industrial Technology Research Institute (ITRI)
C.J. Zhan - Industrial Technology Research Institute (ITRI)
S.T. Lu - Industrial Technology Research Institute (ITRI)
S.Y. Huang - Industrial Technology Research Institute (ITRI)
J.Y. Juang - Industrial Technology Research Institute (ITRI)
C.W. Fan - Industrial Technology Research Institute (ITRI)
S.C. Chung - Industrial Technology Research Institute (ITRI)
J.S. Peng - Industrial Technology Research Institute (ITRI)
S.M. Chen - Industrial Technology Research Institute (ITRI)
Y.L. Lu - Industrial Technology Research Institute (ITRI)
P.C. Chang - Industrial Technology Research Institute (ITRI)
