Technical Program

Wednesday, May 30, 2018

Session 10: Innovative Design, Modeling and Predictions for Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Nautilus 1 & 2

Session Co-Chairs:

Tim Chaudhry
Amkor Technology, Inc.
T +1-949-981-2489
timchaudhry@gmail.com
Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com

Papers:

1. 1:30 PM - Die Attach Delamination Analysis and Modeling Between Temperature Cycling and Thermal Shock for Exposed Pad Lead Frame Devices
Madison Koziol - Texas Instruments, Inc.
Yutaka Suzuki - Texas Instruments, Inc.
Siva Gurrum - Texas Instruments, Inc.
Muhammad Khan - Texas Instruments, Inc.

2. 1:55 PM - A Comparison Study of Cu Dissolution Kinetics in Solder Joints Under Electromigration and Extended Reflow
Pilin Liu - Intel Corporation
Alan Overson - Intel Corporation
Deepak Goyal - Intel Corporation

3. 2:20 PM - Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature
Pradeep Lall - Auburn University
Vikas Yadav - Auburn University
Jeff Suhling - Auburn University
David Locker - US Army AMRDEC

4. 3:30 PM - Innovative Design of Crackstop Wall for 14nm Technology Node and Beyond
Mohamed Rabie - GLOBALFOUNDRIES
Nicholas Polomoff - GLOBALFOUNDRIES
Md Khaled Hassan - GLOBALFOUNDRIES
Victoria Calero-DdelC - GLOBALFOUNDRIES
Danielle Degraw - GLOBALFOUNDRIES
Michael Hecker - GLOBALFOUNDRIES
Michael Thiele - GLOBALFOUNDRIES
El Mehdi Bazizi - GLOBALFOUNDRIES

5. 3:55 PM - Back-end-of-line (BEOL) Mechanical Integrity Evaluation: A Mixed-Mode Double Cantilever Beam Test for Crackstop Strength Assessment
Tuhin Sinha - IBM Corporation
Max Cioban - IBM Corporation
Thomas Shaw - IBM Corporation

6. 4:20 PM - Study of the Long Term Reliability of 3D IC under Near-Application Conditions
Omar Ahmed - University of Central Florida
Golareh Jalilvand - University of Central Florida
Jessica Dieguez - University of Central Florida
Peng Su - Juniper Networks
Tengfei Jiang - University of Central Florida

7. 4:45 PM - The Experimental and Numerical Study of Electromigration in 2.5D Packages
Jiefeng Xu - Binghamton University
Yuling Niu - Binghamton University
Stephen R. Cain - Binghamton University
Scott McCann - Xilinx, Inc.
Hohyung Lee - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.
S.B. Park - Binghamton University