Technical Program

Wednesday, May 30, 2018

Session 10: Innovative Design, Modeling and Predictions for Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Nautilus 1 & 2

Session Co-Chairs:

Tim Chaudhry
Amkor Technology, Inc.
T +1-949-981-2489
timchaudhry@gmail.com
Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com

Papers:

1. 1:30 PM - Die attach delamination analysis and modeling between thermal cycling and thermal shock for exposed pad leadframe packages
Madison Koziol - Texas Instruments, Inc.
Yutaka Suzuki - Texas Instruments, Inc.
Siva Gurrum - Texas Instruments, Inc.
Muhammad Khan - Texas Instruments, Inc.

2. 1:55 PM - A comparison study of Cu dissolution kinetics in solder joints under electromigration and extended reflow
Pilin Liu - Intel Corporation
Alan Overson - Intel Corporation
Deepak Goyal - Intel Corporation

3. 2:20 PM - Anand Parameters for Modeling Prolonged Storage On High Strain Rate Mechanical Properties Of SAC-Q Leadfree Solder at High Operating Temperature
Pradeep Lall - Auburn University
Vikas Yadav - Auburn University
Jeff Suhling - Auburn University
David Locker - US Army AMRDEC

4. 3:30 PM - Innovative design of crackstop wall for 14nm technology node and beyond
Mohamed Rabie - GLOBALFOUNDRIES
Nicholas Polomoff - GLOBALFOUNDRIES
Md Khaled Hassan - GLOBALFOUNDRIES
Victoria Calero-DdelC - GLOBALFOUNDRIES
Danielle Degraw - GLOBALFOUNDRIES
Michael Hecker - GLOBALFOUNDRIES
Michael Thiele - GLOBALFOUNDRIES
El Mehdi Bazizi - GLOBALFOUNDRIES

5. 3:55 PM - Enhanced Method for Measuring Crack Stop Fracture Toughness with Multi-Mode Double Cantilever Beam Technique
Max Cioban - IBM Corporation
Tuhin Sinha - IBM Corporation
Thomas Shaw - IBM Corporation

6. 4:20 PM - Study of the Long Term Reliability of 3D Memory IC under Near-Application Conditions
Omar Ahmed - University of Central Florida
Golareh Jalilvand - University of Central Florida
Jessica Dieguez - University of Central Florida
Paul Ho - The University of Texas, Austin
Peng Su - Juniper Networks
Tengfei Jiang - University of Central Florida

7. 4:45 PM - The Experimental and Numerical Study of Electromigration in 2.5D Packages
Jiefeng Xu - State University of New York at Binghamton
Yuling Niu - State University of New York at Binghamton
Stephen R. Cain - State University of New York at Binghamton
Scott McCann - Xilinx, Inc.
Hohyung Lee - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.
S.B. Park - State University of New York at Binghamton