Technical Program
Thursday, May 30, 2013
Session 13: 3D Processing and Technology
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Mont-Royal 1
Session Co-Chairs:
|
Christopher Bower Semprius, Inc. T +1-919-522-5022 chris.bower@semprius.com |
Erik Jung Fraunhofer IZM T +49-30-46403-230 erik.jung@izm.fraunhofer.de |
Papers:
1. 8:00 AM - TSV Last for Hybrid Pixel Detectors: Application to Particle Physics and Imaging Experiments
D. Henry - CEA-LETI
J. Alozy - CERN
A. Berthelot - CEA-LETI
R. Cuchet - CEA-LETI
C. Chantre - CEA-LETI
M. Campbell - CERN
2. 8:25 AM - Dielectric Stack Engineering for Via-Reveal Passivation
Kath Crook - SPTS Technologies
Mark Carruthers - SPTS Technologies
Daniel Archard - SPTS Technologies
Steve Burgess - SPTS Technologies
Keith Buchanan - SPTS Technologies
3. 8:50 AM - Low-Cost Micrometer-Scale Silicon Vias (SVs) Fabrication by Metal-Assisted Chemical Etching (MaCE) and Carbon Nanotubes (CNTs) Filling
Liyi Li - Georgia Institute of Technology
Yagang Yao - Georgia Institute of Technology
Ziyin Lin - Georgia Institute of Technology
Yan Liu - Georgia Institute of Technology
C.P. Wong - Georgia Institute of Technology, Chinese University of Hong Kong
4. 10:00 AM - Impact of Post-Plating Anneal and Through-Silicon Via Dimensions on Cu Pumping
Joke De Messemaeker - IMEC
Olalla Varela Pedreira - IMEC
Bart Vandevelde - IMEC
Harold Philipsen - IMEC
Ingrid De Wolf - IMEC
Eric Beyne - IMEC
Kristof Croes - IMEC
5. 10:25 AM - A Quick-Turn 3D Structured ASIC Platform for Cost-Sensitive Applications
John Teifel - Sandia National Laboratories
Richard S. Flores - Sandia National Laboratories
Robert Jarecki - Sandia National Laboratories
Todd Bauer - Sandia National Laboratories
Subhash L. Shinde - Sandia National Laboratories
6. 10:50 AM - TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies
Jian-Yu Shih - National Chiao Tung University
Yen-Chi Chen - TXC Corporation
Cheng-Hao Chiang - National Chiao Tung University
Chih-Hung Chiu - TXC Corporation
Yu- Chen Hu - National Chiao Tung University
Chung-Lun Lo - TXC Corporation
Chi-Chung Chang - TXC Corporation
Kuan-Neng Chen - National Chiao Tung University
7. 11:15 AM - Total Cost Effective Scallop Free Si Etching for 2.5D & 3D TSV Fabrication Technologies in 300mm Wafer
Yasuhiro Morikawa - ULVAC, Inc.
Takahide Murayama - ULVAC, Inc.
Yuu Nakamuta - ULVAC, Inc.
Toshiyuki Sakuishi - ULVAC, Inc.
Akiyoshi Suzuki - ULVAC, Inc.
Koukou Suu - ULVAC, Inc.
