Technical Program

Thursday, May 31, 2018

Session 14: Advanced Substrates and Flip Chip Applications
8:00 AM - 11:40 AM
Committee: Packaging Technologies
Room: Harbor Island 2

Session Co-Chairs:

Markus Leitgeb
AT&S
T +43-676-8955-4087
m.leitgeb@ats.net
Steffen Kroehnert
Amkor Technology Holding B.V., Germany
T +49-171-5639472
steffen.kroehnert@amkor.com

Papers: