Technical Program

Thursday, May 31, 2018

Session 14: Advanced Substrates and Flip Chip Applications
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Harbor Island 2

Session Co-Chairs:

Markus Leitgeb
T +43-676-8955-4087
Steffen Kroehnert
Amkor Technology Holding B.V., Germany
T +49-171-5639472


1. 8:00 AM - 2.5D Glass Fan-Out Packages with Better Performance, I/O Density, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages.
Siddharth Ravichandran - Georgia Institute of Technology
Shuhei Yamada - Murata Manufacturing Co., Ltd
Tailong Shi - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

2. 8:25 AM - Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)
Chen-Yu Huang - Siliconware Precision Industries Co., Ltd.
Yuan-Hung Hsu - Siliconware Precision Industries Co., Ltd.
Ying-Ju Lu - Siliconware Precision Industries Co., Ltd.
Kuo-Hua Yu - Siliconware Precision Industries Co., Ltd.
Wen-Shan Tsai - Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin - Siliconware Precision Industries Co., Ltd.
C. Key Chung - Siliconware Precision Industries Co., Ltd.

3. 8:50 AM - A Novel Application of Chemical Mechanical Polishing for Panel Level Organic and Glass Substrate
Shyh-Lian Cheng - Unimicron Technology Corp.
Wei-Chun Chen - Unimicron Technology Corp.
Yu Hua Chen - Unimicron Technology Corp.
Puru Lin - Unimicron Technology Corp.
Cheng-Ta Ko - Unimicron Technology Corp.

4. 10:00 AM - Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package
Chi-Yuan Chen - MediaTek, Inc.
Ian Hsu - MediaTek, Inc.
Stanley Lin - MediaTek, Inc.
KeonTaek Kang - STATS ChipPAC Pte. Ltd.
Ming-Che Hsieh - STATS ChipPAC Pte. Ltd.

5. 10:25 AM - The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 ┬Ám Fine-pitch Cu-pillar/SnAg Micro Bump Interconnection
SeYong Lee - KAIST
HanMin Lee - KAIST
JongHo Park - KAIST
Woojeong Kim - Doosan Corporation Electro-Materials BG
Taejin Choi - Doosan Corporation Electro-Materials BG
Kyung-Wook Paik - KAIST

6. 10:50 AM - Chip-Package Interaction Challenges for Large Die Applications
Samantha Donavan - GLOBALFOUNDRIES
Patrick Justison - GLOBALFOUNDRIES
Hugues Gagnon - IBM
Oswaldo Chacon - IBM
Thomas Wassick - IBM

7. 11:15 AM - Injection Molded Solder (IMS) technology for solder bumping on wafers, organic substrates, flexible circuits, and TSV filling from fine pitch to large pitch
Jae-Woong Nah - IBM TJ Watson Research Center
Li-Wen Hung - IBM TJ Watson Research Center
Paul Andry - IBM TJ Watson Research Center
John Knickerbocker - IBM TJ Watson Research Center