Technical Program

Thursday, May 31, 2018

Session 15: Warpage Control in Assembly Processes
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Harbor Island 3

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Jin Yang
Intel Corporation
T +1-9712149041
jin1.yang@ieee.org

Papers:

1. 8:00 AM - Reduce the Wafer Warpage Introduced by Cu in RDL Through Adjusting the Cooling Temperatures
Gong Cheng - Shanghai Institute of Microsystem and Information Technology
Gaowei Xu - Shanghai Institute of Microsystem and Information Technology
Wei Gai - Shanghai Institute of Microsystem and Information Technology
Le Luo - Shanghai Institute of Microsystem and Information Technology

2. 8:25 AM - Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding Concept
Markus Woehrmann - Fraunhofer IZM
Tanja Braun - Fraunhofer IZM
Michael Toepper - Fraunhofer IZM
Klaus-Dieter Lang - Technical University Berlin

3. 8:50 AM - Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
Jisun Hong - Samsung Electronics Company, Ltd.
Kyoungsei Choi - Samsung Electronics Company, Ltd.
Dan Oh - Samsung Electronics Company, Ltd.
Seungbae Park - Binghamton University
Shuai Shao - Binghamton University
Huayan Wang - Binghamton University
Yuling Niu - Binghamton University
Van Lai Pham - Binghamton University

4. 10:00 AM - Stacking Yield Prediction of Package-on-Package Considering the Statistical Distributions of Top/Bottom Package Warpages and Solder Ball Heights
Hsiu-Ping Wei - University of Maryland
Bongtae Han - University of Maryland

5. 10:25 AM - Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding
Normand-Pierre Goodhue - Université de Sherbrooke
David Danovitch - Université de Sherbrooke
Jeff Moussodji Moussodji - Université de Sherbrooke
Benoit Papineau - IBM Corporation
Eric Duschesne - IBM Corporation

6. 10:50 AM - Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level and Fan-Out Packages
JongHo Park - Korea Advanced Institute of Science and Technology
HanMin Lee - Korea Advanced Institute of Science and Technology
SeYong Lee - Korea Advanced Institute of Science and Technology
Youjin Kyung - LG Chem R&D Center
Jung Hak Kim - LG Chem R&D Center
Kwangjoo Lee - LG Chem R&D Center
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

7. 11:15 AM - Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components through the Correlation with Scattering in Material Properties
Qiming Zhang - The Hong Kong University of Science & Technology
Jeffery C. C. Lo - The Hong Kong University of Science & Technology
S. W. Ricky Lee - The Hong Kong University of Science & Technology
Wei Xu - Huawei Technologies Co., Ltd.