Technical Program

Thursday, May 31, 2018

Session 16: Advances in Interconnect Reliability and Techniques
8:00 AM - 11:40 AM
Committee: Applied Reliability
Room: Nautilus 1 & 2

Session Co-Chairs:

S. B. Park
Binghamton University
T +1-607-777-3415
sbpark@binghamton.edu
Tz-Cheng Chiu
National Cheng Kung University
T +886-6-2757575
tcchiu@mail.ncku.edu.tw

Papers:

1. 8:00 AM - Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment
Pradeep Lall - Auburn University
Shantanu Deshpande - Auburn University
Luu Nguyen - Texas Instruments, Inc.

2. 8:25 AM - Study of Interface Micro-Voids between Sputter Cu & Plating Cu: The Role of Photoresist
Y. H. Tsai - Taiwan Semiconductor Manufacturing Company
Y. B. Ou - Taiwan Semiconductor Manufacturing Company
Ting-Li Yang - Taiwan Semiconductor Manufacturing Company
W. C. Wu - Taiwan Semiconductor Manufacturing Company
B. T. Chen - Taiwan Semiconductor Manufacturing Company
K. Y. Lee - Taiwan Semiconductor Manufacturing Company
H. L. Huang - Taiwan Semiconductor Manufacturing Company
C. S. Liu - Taiwan Semiconductor Manufacturing Company
Ponder Pang - Taiwan Semiconductor Manufacturing Company
Edward Chen - Taiwan Semiconductor Manufacturing Company
K. C. Liu - Taiwan Semiconductor Manufacturing Company

3. 8:50 AM - Prediction of Statistical Distribution of Vibration-induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-rich Solder Alloys
Hsiu-Ping Wei - University of Maryland
Yu-Hsiang Yang - University of Maryland
Bulong Wu - University of Maryland
Bongtae Han - University of Maryland

4. 10:00 AM - Experimental Strain Energy Densities Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages Measurements
Jean-Baptiste Libot - Safran Electronics & Defense
Joël Alexis - University of Toulouse - INP/ENIT
Lionel Arnaud - University of Toulouse - INP/ENIT
Olivier Dalverny - University of Toulouse - INP/ENIT
Philippe Milési - Safran Electronics & Defense
Frédéric Dulondel - Safran Electronics & Defense

5. 10:25 AM - Understanding the Impact of PCB-changes in the Latest Published JEDEC Board Level Drop Test Method
Varun Thukral - NXP Semiconductors
Jeroen Zaal - NXP Semiconductors
Romuald Roucou - NXP Semiconductors
Jeroen Jalink - NXP Semiconductors
Rene Rongen - NXP Semiconductors

6. 10:50 AM - Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique
Chidinma Imediegwu - Georgia Institute of Technology
Vishnu Reddy - Georgia Institute of Technology
Charles Ume - Georgia Institute of Technology
Aaron Mebane - Georgia Institute of Technology
Kola Akinade - Cisco Systems, Inc
Amiya Chaudhuri - Cisco Systems, Inc
Bryan Rogers - Cisco Systems, Inc
Mark Hill - Cisco Systems, Inc
Cherif Guirguis - Cisco Systems, Inc
Tae-Kyu Lee - Portland State University

7. 11:15 AM - Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package
Kuei Hsiao Kuo - Siliconware Precision Industries Co. Ltd. (SPIL)
Austin Chen - Siliconware Precision Industries Co. Ltd. (SPIL)
Yen Neng Wang - Siliconware Precision Industries Co. Ltd. (SPIL)
Jiunn Jie Wang - Siliconware Precision Industries Co. Ltd. (SPIL)
Jovi Chang - Siliconware Precision Industries Co. Ltd. (SPIL)
Feng Lung Chien - Siliconware Precision Industries Co. Ltd. (SPIL)
Rick Lee - Siliconware Precision Industries Co. Ltd. (SPIL)