Technical Program

Thursday, May 31, 2018

Session 16: Advanced Materials for High-Speed Electronics
8:00 AM - 11:40 AM
Committee: Materials & Processing

Session Co-Chairs:

Yoichi Taira
Keio University
T +81-3-3300-0489
Yu-Hua Chen
T +886-3-5995899#2109


1. 8:00 AM - Low-loss glass substrates formulated with a variety of dielectric characteristics for mm wave applications
Kazutaka Hayashi - AGC Inc.
Nobutaka Kidera - AGC Inc.
Yoichiro Sato - AGC Inc.

2. 8:25 AM - Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages
Shreya Dwarakanath - Packaging Research Center
Atsushi Kubo - Tokyo Ohka Kogyo Co
Daichi Okamaoto - Taiyo ink mfg. co
Fuhan Liu - Packaging Research Center
Pulugurtha Markondeya Raj - Packaging Research Center
Mohanalingam Kathaperumal Rao R Tummala

3. 8:50 AM - Attenuation of high frequency signals in structured metallization on glass: comparing different metallization techniques with 24GHz signals and higher frequencies.
Martin Letz - SCHOTT AG
Matthias Jost - Technische Universit├Ąt Darmstadt
Alex Bruderer - Varioprint AG
Manuel Martina - Schweizer Electronics AG
Tetsuya Onishi - Grand Joint Technology Ltd.
Masatoshi Takayama - KOTO Electric Co.
Siddharth Ravichandran - Packaging Research Center, Georgia Tech.
Brandon Gore - Samtec Microelectronics
Holger Maune - Technische Universit├Ąt Darmstadt
Matthias Jotz - SCHOTT AG

4. 10:00 AM - The highly effective EMI Shielding materials for magnetic and electric wave over the wide range of frequency in near field
Yoon-Hyun Kim - Ntrium Inc.
Seung Jae Lee - Ntrium Inc.
Kyu Jae Lee - Ntrium Inc.
Kisu Joo - Ntrium Inc.
Jung Woo Hwang - Ntrium Inc.
Se Young Jeong - Ntrium Inc.
Hyun Ho Park - University of Suwon

5. 10:25 AM - Low loss NCF material for high frequency device.
KAZUTAKA HONDA - Hitachi Chemical Co., Ltd.
KEIKO UENO - Hitachi Chemical Co., Ltd.
NOZOMI MATSUBARA - Hitachi Chemical Co., Ltd.
TSUYOSHI OGAWA - Hitachi Chemical Co., Ltd.
TOSHIHISA NONAKA - Hitachi Chemical Co., Ltd.

6. 10:50 AM - In-situ redox nanowelding of copper nanowires with surfacial oxide layer as solder for flexible transparent electromagnetic interference shielding
Xianwen Liang - Shenzhen Institutes of Advanced Technology
Jianwen Zhou - Shenzhen Institutes of Advanced Technology
Gang Li - Shenzhen Institutes of Advanced Technology
Tao Zhao - Shenzhen Institutes of Advanced Technology
Pengli Zhu - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Ching-Ping Wong - Georgia Institute of Technology

7. 11:15 AM - High Conductive Compartment EMI Shielding Material with Jet-Dispensing Technology
Xuan Hong - Henkel Corporation
Qizhuo Zhuo - Henkel Corporation
Xinpei Cao - Henkel Corporation
Dan Maslyk - Henkel Corporation
Juliet Sanchez - Henkel Corporation
Selene Hernandez - Henkel Corporation
Noah Ekstrom - Henkel Corporation
Jinu Choi - Henkel Corporation