Technical Program

Thursday, June 01, 2017

Session 16: 3D Materials and Processing
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Americas Seminar

Session Co-Chairs:

Myung Jin Yim
Intel Corporation
T +1-408-728-1393
Mikel Miller
Draper Laboratory
T +1-617-258-2844


1. 8:00 AM - High Productive 3D Stacking Process
Kazutaka Honda - Hitachi Chemical Co.,Ltd.
Hirokazu Noma - Hitachi Chemical Co.,Ltd.
Hitoshi Onozeki - Hitachi Chemical Co.,Ltd.
Shizu Fukuzumi - Hitachi Chemical Co.,Ltd.
Yoshinobu Ozaki - Hitachi Chemical Co.,Ltd.

2. 8:25 AM - Direct Bonding and Debonding Approach of Ultrathin Glass Substrates for High Temperature Devices
Messaoud Bedjaoui - CEA-Leti
Sylvain Poulet - CEA-Leti

3. 8:50 AM - Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding
Nan Wang - Institute of Microelectronics, A*STAR
Chengliang Sun - Institute of Microelectronics, A*STAR
Li Yan Siow - Institute of Microelectronics, A*STAR
Hongmiao Ji - Institute of Microelectronics, A*STAR
Darmayuda I Made - Institute of Microelectronics, A*STAR
Peter Chang - Institute of Microelectronics, A*STAR
Qingxin Zhang - Institute of Microelectronics, A*STAR
Yuandong Gu - Institute of Microelectronics, A*STAR
Lionel You Liang Wong - Institute of Microelectronics, A*STAR

4. 10:00 AM - Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer
Alain Phommahaxay - IMEC
Alice Guerrero - Brewer Science
Anne Jourdain - IMEC
Goedele Potoms - IMEC
Greet Verbinnen - IMEC
Dongshun Bai - Brewer Science
Kim Yess - Brewer Science
Kim Arnold - Brewer Science
Erik Sleeckx - IMEC
Eric Beyne - IMEC
Gerald Beyer - IMEC

5. 10:25 AM - Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature
Jinhui Li - Shenzhen Institutes of Advanced Technology
Qiang Liu - Shenzhen Institutes of Advanced Technology
Guoping Zhang - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Chingping Wong - Chinese University of Hong Kong
Bin Zhao - Shanghai Micro Electronics Equipment (Group)

6. 10:50 AM - Synchrotron X-ray Microdiffraction Investigation of Scaling Effects on Plasticity and the Correlation to TSV Extrusion
Laura Spinella - University of Texas, Austin
Tengfei Jiang - University of Central Florida
Jang-hi Im - University of Texas, Austin
Paul Ho - University of Texas, Austin
Nobumichi Tamura - Lawrence Berkeley National Laboratory

7. 11:15 AM - Development of High Frequency Device Using Glass or Fused Silica with 3D Integration
Shintarou Takahashi - Asahi Glass Co., Ltd.
Yoichiro Sato - Asahi Glass Co., Ltd.
Kohei Horiuchi - Asahi Glass Co., Ltd.
Motoshi Ono - Asahi Glass Co., Ltd.