Technical Program

Wednesday, May 30, 2018

Session 2: Advances in Wafer and Panel Level Fan-Out Packaging
8:00 AM - 11:40 AM
Committee: Packaging Technologies
Room: Harbor Island 2

Session Co-Chairs:

Beth Keser
Intel Corporation
T +49 (89) 9988532 0713
beth.keser@intel.com
Mike Ma
Amkor Technology Taiwan (ATT)
T +886-988-105685
mike.ma@amkor.com

Papers: