Technical Program
Thursday, May 31, 2012
Session 2: Next Generation Packaging Reliability
8:00 AM - 11:40 AM
Committee: Applied Reliability
Harbor Island I
Session Co-Chairs:
|
Sridhar Canumalla Microsoft Corporation T +1-425-538-4060 F scanuma@microsoft.com |
Jeffrey Suhling Auburn University T +1-334-844-3332 F jsuhling@eng.auburn.edu |
Papers:
1. 8:00 AM - Board Level Solder Joint Assembly and Reliability for Ultra Thin BGA Packages
Mohammad M. Hossain - Intel Corporation
Srinivasa R. Aravamudhan - Intel Corporation
Marilyn Nowakowski - Intel Corporation
Xiaoqing Ma - Intel Corporation
Satyajit S. Walwadkar - Intel Corporation
Vijay Kulkarni - Intel Corporation
Sriram Muthukumar - Intel Corporation
2. 8:25 AM - Safe Working Process Strain Limits for Large Area Array Packages: Observations from Spherical Bend Testing
John McMahon - Celestica
Brian Gray - Celestica
Brian P. Standing - Celestica
3. 8:50 AM - Board Level Drop Test Modeling
Masazumi Amagai - Texas Instruments
Jang Seungmin - Texas Instruments
4. 10:00 AM - Methods for Reliability Assessment of MEMS Devices -- Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
J. Hokka - Aalto University
J. Raami - Aalto University
H. Hyvönen - Aalto University
M. Broas - Aalto University
J. Makkonen - Aalto University
J. Li - Aalto University
T. Mattila - Aalto University
M. Paulasto-Kröckel - Aalto University
5. 10:25 AM - Stress Evolution in an Encapsulated MEMS Package Due to Viscoelasticity of Packaging Materials
Seungbae Park - SUNY Binghamton
Dapeng Liu - SUNY Binghamton
Yeonsung Kim - SUNY Binghamton
Hohyung Lee - SUNY Binghamton
Sam Zhang - Analog Devices, Inc.
6. 10:50 AM - Reliability Analyses on a TSV Structure for CMOS Image Sensor
Ben-Je Lwo - National Defense University
Chung-Yen Ni - National Defense University
7. 11:15 AM - Dynamic Bending Test Analysis of Inkjet-Printed Conductors on Flexible Substrates
Eerik Halonen - Tampere University of Technology
Aki Halme - Tampere University of Technology
Tapio Karinsalo - Tampere University of Technology
Pekka Iso-Ketola - Tampere University of Technology
Matti Mäntysalo - Tampere University of Technology
Riku Mäkinen - Tampere University of Technology
