Technical Program

Wednesday, May 30, 2018

Session 2: Advances in Wafer and Panel Level Fan-Out Packaging
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Harbor Island 2

Session Co-Chairs:

Beth Keser
Intel Corporation
T +49 (89) 9988532 0713
beth.keser@intel.com
Mike Ma
Amkor Technology Taiwan (ATT)
T +886-988-105685
mike.ma@amkor.com

Papers:

1. 8:00 AM - A Novel Submicron Polymer Redistribution Layer Technology for Advanced InFO Packaging
Han-Ping Pu - Taiwan Semiconductor Manufacturing Company, Ltd.
H.J. Kuo - Taiwan Semiconductor Manufacturing Company, Ltd.
C.S. Liu - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

2. 8:25 AM - Fan-Out Panel Level Package with Fine Pitch Pattern
Jinyoung Kim - Samsung Electro-Mechanics Co., Ltd.
Ikjun Choi - Samsung Electro-Mechanics Co., Ltd.
JunHyeong Park - Samsung Electro-Mechanics Co., Ltd.
Jae-Ean Lee - Samsung Electro-Mechanics Co., Ltd.
TaeSung Jeong - Samsung Electro-Mechanics Co., Ltd.
Jungsoo Byun - Samsung Electro-Mechanics Co., Ltd.
YoungGwan Ko - Samsung Electro-Mechanics Co., Ltd.
Kangheon Hur - Samsung Electro-Mechanics Co., Ltd.
Dea-Woo Kim - Samsung Electronics
Kyung Suk Oh - Samsung Electronics

3. 8:50 AM - Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes
Richard Hollman - TEL NEXX, Inc.
Ognian Dimov - Fujifilm Electronic Materials U.S.A., Inc.
Sanjay Malik - SUSS Microtec Photonic Systems, Inc.
Habib Hichri - SUSS Microtec Photonic Systems, Inc.
Markus Arendt - Fujifilm Electronic Materials U.S.A., Inc.

4. 10:00 AM - Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications
Kyoung-Lim Suk - Samsung Electronics Co., Ltd.
Seok Hyun Lee - Samsung Electronics Co., Ltd.
Jong Youn Kim - Samsung Electronics Co., Ltd.
Seok Won Lee - Samsung Electronics Co., Ltd.
Hak Jin Kim - Samsung Electronics Co., Ltd.
Su Chang Lee - Samsung Electronics Co., Ltd.
Pyung Wan Kim - Samsung Electronics Co., Ltd.
Jung Soo Byun - Samsung Electro-Mechanics Co., Ltd.
Dae-Woo Kim - Samsung Electronics Co., Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Co., Ltd.

5. 10:25 AM - Panel Level Packaging - A View Along the Process Chain
Tanja Braun - Fraunhofer IZM
Karl-Friedrich Becker - Fraunhofer IZM
Ole Hoelck - Fraunhofer IZM
Ruben Kahle - Fraunhofer IZM
Markus Woehrmann - Fraunhofer IZM
Lars Boettcher - Fraunhofer IZM
Michael J. Toepper - Fraunhofer IZM
L. Stobbe - Fraunhofer IZM
H. Zedel - Fraunhofer IZM
Rolf Aschenbrenner - Technical University Berlin
Steve Voges - Technical University Berlin

6. 10:50 AM - Patterning High Resolution Features Through the Integration of an Advanced Lithography System with a Novel Nozzleless Spray Coating technology
Jack Mach - Rudolph Technologies, Inc.
Corey Shay - Rudolph Technologies, Inc.
Stuart Erickson - Ultrasonic Systems Inc.
Gary Smith - Sumitomo Chemical Advanced Technologies

7. 11:15 AM - Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations
Julien Bertheau - IMEC
Fumihiro Inoue - IMEC
Alain Phommahaxay - IMEC
Serena Iacovo - IMEC
Lan Peng - IMEC
Nouredine Rassoul - IMEC
Erik Sleeckx - IMEC
Kenneth June Rebibis - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC