Technical Program

Thursday, May 31, 2018

Session 21: Materials and Process Trends for Fan-Out Wafer Level Packaging
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Harbor Island 3

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Tanja Braun
Fraunhofer IZM
T +46 30 46403244
tanja.braun@izm.fraunhofer.de

Papers: