Technical Program

Thursday, May 31, 2018

Session 21: Materials and Process Trends for Fan-Out Wafer Level Packaging
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Harbor Island 3

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
Tanja Braun
Fraunhofer IZM
T +46 30 46403244


1. 1:30 PM - Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Package
Yosuke Oi - Nagase ChemteX Corporation
Yasuhito Fujii - Nagase ChemteX Corporation
Takashi Hiraoka - Nagase ChemteX Corporation
Yukio Yada - Nagase ChemteX Corporation
Katsushi Kan - Nagase ChemteX Corporation

2. 1:55 PM - Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Package and the Board Level Reliability Test Results
Kazuhiro Kikuchi - Lintec corporation
Yuusuke Nedzu - Lintec corporation
Takashi Sugino - Lintec corporation

3. 2:20 PM - The Impact of Thermal Shrinkage of Glass Carriers on Achieving Fine Pitch Wiring through Fan-Out WLP/PLP Process
Shuhei Nomura - Asahi Glass Co., Ltd.
Kazutaka Hayashi - Asahi Glass Co., Ltd.

4. 3:30 PM - Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up
Alain Phommahaxay - IMEC
Alice Guerrero - Brewer Science
Arnita Podpod - IMEC
John Slabbekoorn - IMEC
Dongshun Bai - Brewer Science
Kim Arnold - Brewer Science
Erik Sleeckx - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

5. 3:55 PM - Novel Microwave Process for RDL Photosensitive Dielectric Polymer Curing on FOWLP Reconstructed Wafer
Kazunori Yamamoto - Institute of Microelectronics
Chun-Mei Wang - Institute of Microelectronics
Xiang-Yu Wang - Institute of Microelectronics
Tuck-Foong Koh - Applied Materials
Felix Deng - Applied Materials

6. 4:20 PM - Fabrication of Fine Via and Line / Space in Low CTE Film for Panel Fan-Out Using a Dry Etching Technology
Muneyuki Sato - ULVAC, Inc.
Takahide Murayama - ULVAC, Inc.
Tetsushi Fujinaga - ULVAC, Inc.
Yasuhiro Morikawa - ULVAC, Inc.

7. 4:45 PM - Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL
Chandrasekharan Nair - Georgia Institute of Technology
Bartlet DeProspo - Georgia Institute of Technology
Habib Hichri - SUSS Microtec Photonic Systems Inc
Markus Arendt - SUSS Microtec Photonic Systems Inc
Fuhan Liu - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology