Technical Program

Thursday, May 31, 2018

Session 23: RF and THz Module Components
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components
Room: Nautilus 3

Session Co-Chairs:

Craig Gaw
NXP Semiconductor
T +1-480-814-5142
c.a.gaw@ieee.org
Amit P. Agrawal
Microsemi Corporation
T +1-408-666-8452
amit.agrawal@microsemi.com

Papers: