Technical Program

Thursday, May 31, 2018

Session 24: Optical Module Integration
1:30 PM - 5:10 PM
Committee: Optoelectronics
Room: Nautilus 5

Session Co-Chairs:

Hiren Thacker
Tech301
T +1-619-940-7803
hiren@tech301.com
Ajey Jacob
Globalfoundries
T
ajey.jacob@globalfoundries.com

Papers:

1. 1:30 PM - Direct fabrication for polymer optical waveguide in PMT ferrule using the Mosquito method
Takaaki Ishigure - Keio University
Hikaru Masuda - Keio University
Chinami Marushima - Keio University
Tadayuki Enomoto - Keio University

2. 1:55 PM - Solder-reflowable, high-throughput fiber assembly achieved by partitioning of adhesive functions
Alexander Janta - IBM Corporation
Elaine Cyr - IBM Corporation
Richard Langlois - IBM Corporation
Paul Fortier - IBM Corporation
Yoichi Taira - IBM Corporation
Nicolas Boyer - IBM Corporation
Tymon Barwicz - IBM Corporation

3. 2:20 PM - Low Reflectance and Reflowable Thermoplastic Optical Lens without AR Coating
Takuro Watanabe - SUMITOMO ELECTRIC INDUSTRIES, LTD.
Takayuki SHIMAZU - SUMITOMO ELECTRIC INDUSTRIES, LTD.
Ryohei Hokari - National Institute of Advanced Industrial Science and Techno
Kazuma KURIHARA - National Institute of Advanced Industrial Science and Techno
Shouhei Okabe - Sumitomo Electric Fine Polymer, Inc.,

4. 3:30 PM - Wide range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators
Simone Cardarelli - Technical University Eindhoven
Xiao Luo - Vtec
Nicola Calabretta - Technical University Eindhoven
Ripalta Stabile - Technical University Eindhoven
Jan Mink - Vtec
Kevin Williams - Technical University Eindhoven

5. 3:55 PM - Co-integration of High-Bandwidth Photonics and High-Speed Electronics on 2.5D Glass Interposers using low optical absorption photoimageable dielectric polymer
Rui Zhang - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Michael Gallagher - Dow Chemical Company
Ed Anzures - Dow Chemical Company
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

6. 4:20 PM - Thin glass based optical sub-assemblies for embedding in electronic systems
Wojciech Lewoczko-Adamczyk - Fraunhofer Institute for Reliability and Microintegration
Gunnar Böttger - Fraunhofer Institute for Reliability and Microintegration
Henning Schröder - Fraunhofer Institute for Reliability and Microintegration
Martin Schneider-Ramelow - Fraunhofer Institute for Reliability and Microintegration

7. 4:45 PM - Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling
Nivesh Mangal - Ghent University/imec
Jeroen Missinne - Ghent University/imec
Joris Van Campenhout - IMEC
Geert Van Steenberge - Ghent University/imec
Brad Snyder - IMEC