Technical Program

Thursday, May 31, 2018

Session 24: Optical Module Integration
1:30 PM - 5:10 PM
Committee: Optoelectronics
Room: Nautilus 5

Session Co-Chairs:

Hiren Thacker
T +1-619-940-7803
Ajey Jacob


1. 1:30 PM - Direct Fabrication for Polymer Optical Waveguide in PMT Ferrule Using the Mosquito Method
Takaaki Ishigure - Keio University
Hikaru Masuda - Keio University
Kumi Date - Keio University
Chinami Marushima - Keio University
Tadayuki Enomoto - Keio University

2. 1:55 PM - Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
Alexander Janta - IBM Corporation
Elaine Cyr - IBM Corporation
Richard Langlois - IBM Corporation
Paul Fortier - IBM Corporation
Yoichi Taira - IBM Corporation
Nicolas Boyer - IBM Corporation
Tymon Barwicz - IBM Corporation

3. 2:20 PM - Low Reflectance and Reflowable Thermoplastic Optical Lens Without AR Coating
Sho Yakabe - Sumitomo Electric Industries, Ltd.
Takuro Watanabe - Sumitomo Electric Industries, Ltd.
Takayuki Shimazu - Sumitomo Electric Industries, Ltd.
Ryohei Hokari - National Institute of Advanced Industrial Science and Technology
Kazuma Kurihara - National Institute of Advanced Industrial Science and Technology
Shouhei Okabe - Sumitomo Electric Fine Polymer, Inc.,

4. 3:30 PM - Wide Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators
Simone Cardarelli - Technical University Eindhoven
Xiao Luo - Vtec
Nicola Calabretta - Technical University Eindhoven
Ripalta Stabile - Technical University Eindhoven
Jan Mink - Vtec
Kevin Williams - Technical University Eindhoven

5. 3:55 PM - Co-integration of High-Bandwidth Photonic and Electronic RDL on 2.5D Glass Interposers Using Low Optical Absorption Photoimageable Dielectric Polymer
Rui Zhang - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Michael Gallagher - The Dow Chemical Company
Ed Anzures - The Dow Chemical Company
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

6. 4:20 PM - Thin Glass Based Optical Sub-Assemblies For Embedding in Electronic Systems
Wojciech Lewoczko-Adamczyk - Fraunhofer Institute for Reliability and Microintegration
Gunnar Böttger - Fraunhofer Institute for Reliability and Microintegration
Henning Schröder - Fraunhofer Institute for Reliability and Microintegration
Martin Schneider-Ramelow - Technische Universität Berlin TUB
Klaus-Dieter Lang - Technische Universität Berlin TUB

7. 4:45 PM - Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling
Nivesh Mangal - Ghent University/IMEC
Jeroen Missinne - Ghent University/IMEC
Joris Van Campenhout - IMEC
Geert Van Steenberge - Ghent University/imec
Brad Snyder - IMEC