Technical Program

Friday, June 01, 2018

Session 25: Fabrication and Characterization of TSV
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Harbor Island 1

Session Co-Chairs:

Dingyou Zhang
Qualcomm Technologies, Inc.
T +1 858-845-5905
zhangdingyou04@gmail.com
Wei-Chung Lo
ITRI
T +886-3-591-7024
lo@itri.org.tw

Papers:

1. 8:00 AM - Low-Cost, Self-Formed Vertical Nanowires with Aspect Ratio > 100x in Deep Si-Trenches for Future 3D-LSI/IC Applications
Murugesan Mariappan - Tohoku University
Takafumi Fukushima - Tohoku University
JiChel Bea - Tohoku University
Hiroyuki Hashimoto - Tohoku University
Mitsumasa Koyanagi - Tohoku University

2. 8:25 AM - First Demonstration of Silicon-Like >250 I/O per mm per layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization
Bartlet DeProspo - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Chandrasekharan Nair - Georgia Institute of Technology
Atsushi Kubo - Tokyo Ohka Kogyo Corporation
Frank Wei - Disco Corporation
Ye Chen - Disco Corporation
Venkatesh Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

3. 8:50 AM - Dielectric Quality of 3D Capacitor Embedded in Through-Silicon Via (TSV)
Ye Lin - Nanyang Technological University
Chuan Seng Tan - Nanyang Technological University

4. 10:00 AM - Experimental Assessment and Analysis of the Influence of Radiation on Through-Silicon Vias
Qinghua Zeng - Peking University
Jing Chen - Peking University
Yufeng Jin - Peking University

5. 10:25 AM - Co-Deposition of Nano-Size SiC particles in Micro-Via
Houya Wu - Central South University
Yan Wang - Central South University
Fuliang Wang - Central South University
Zhuo Chen - Central South University
Hu He - Central South University
Liancheng Wang - Central South University
Wenhui Zhu - Central South University

6. 10:50 AM - A Study of Crystal Orientation of Solder TSVs
Yuki Ohara - DENSO Corporation
Yuki Inagaki - DENSO Corporation
Atsushi Mizutani - DENSO Corporation
Kazushi Asami - DENSO Corporation

7. 11:15 AM - Characterization of Optical End-point Detection for Via Reveal Processing
Nouredine Rassoul - IMEC
Anne Jourdain - IMEC
Nina Tutunjyan - IMEC
Joeri DeVos - IMEC
Stefano Sardo - IMEC
Daniele Piumi - IMEC
Eric Beyne - IMEC
Edward Walsby - Orbotech
Huma Ashraf - Orbotech
Dave Thomas - Orbotech
Andy Miller - IMEC