Technical Program
Friday, May 31, 2013
Session 25: 3D Microbump Structures and Silicon to Silicon Bonding
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Mont-Royal 1
Session Co-Chairs:
|
Tom Gregorich Broadcom Corporation T +886-0975-591-310 avanza.microtek@gmail.com |
Li Li Cisco Systems, Inc. T +1-408-527-0801 LiLi2@cisco.com |
Papers:
1. 8:00 AM - Key Elements for Sub-50µm Pitch Micro Bump Processes
J. De Vos - IMEC
L. Bogaerts - IMEC
T. Buisson - IMEC
C. Gerets - IMEC
G. Jamieson - IMEC
K. Vandersmissen - IMEC
A. La Manna - IMEC
E. Beyne - IMEC
2. 8:25 AM - Microstructural and Morphological Characterization of SnAgCu Micro-Bumps for Integration in 3D Interconnects
J. Bertheau - STMicroelectronics
P. Bleuet - CEA-LETI
R. Pantel - STMicroelectronics
J. Charbonnier - CEA-LETI
F. Hodaj - SIMaP-UMR
P. Coudrain - STMicroelectronics
N. Hotellier - STMicroelectronics
3. 8:50 AM - Mechanism of Low Temperature Copper-to-Copper Direct Bonding for 3D TSV Package Interconnection
J. Cho - SUNY, Binghamton
S Yu - SUNY, Binghamton
M.P.C. Roma - SUNY, Binghamton
S. Maganty - SUNY, Binghamton
S. Park - SUNY, Binghamton
E. Bersch - SEMATECH
C. Kim - SEMATECH
B. Sapp - SEMATECH
4. 10:00 AM - Room-Temperature High-Density Interconnection Using Ultrasonic Bonding of Cone Bump for Heterogeneous Integration
Takanori Shuto - Kyushu University
Keiichiro Iwanabe - Kyushu University
Li Jing Qiu - Kyushu University
Tanemasa Asano - Kyushu University
5. 10:25 AM - Low Temperature (<180°C) Wafer-Level and Chip-Level In-to-Cu and Cu-to-Cu Bonding for 3D Integration
Y.S. Chien - National Chiao Tung University
Y.P. Huang - National Chiao Tung University
R.N. Tzeng - National Chiao Tung University
M.S. Shy - Advanced Semiconductor Engineering Group
T.H. Lin - Advanced Semiconductor Engineering Group
K.H. Chen - Advanced Semiconductor Engineering Group
C.T. Chuang - National Chiao Tung University
W. Hwang - National Chiao Tung University
J.C. Chiou - National Chiao Tung University
C.T. Chiu - Advanced Semiconductor Engineering Group
H.M. Tong - Advanced Semiconductor Engineering Group
K.N. Chen - National Chiao Tung University
6. 10:50 AM - Hybrid Au-Au Bonding Technology Using Planar Adhesive Structure for 3D Integration
Masatsugu Nimura - Waseda University
Jun Mizuno - Waseda University
Akitsu Shigetou - National Institute for Materials Science (NIMS)
Katsuyuki Sakuma - IBM Corporation
Hiroshi Ogino - Nissan Chemical Industries
Tomoyuki Enomoto - Nissan Chemical Industries
Shuichi Shoji - Waseda University
7. 11:15 AM - High Throughput Cu-Cu Bonding by Non-Thermocompression Method
Chuan Seng Tan - Nanyang Technological University
Gang Yih Chong - Nanyang Technological University
