Technical Program

Friday, June 01, 2018

Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
joint with Packaging Technologies
Room: Harbor Island 2

Session Co-Chairs:

Jan Vardaman
Techsearch International
T
jan@techsearchinc.com
Andrew Kim
Intel Corporation
T +1-916-356-7176
hyoung.il.kim@intel.com

Papers: