Technical Program

Friday, June 01, 2018

Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
joint with Advanced Packaging
Room: Harbor Island 2

Session Co-Chairs:

Jan Vardaman
Techsearch International
T
jan@techsearchinc.com
Andrew Kim
Intel Corporation
T +1-916-356-7176
hyoung.il.kim@intel.com

Papers:

1. 8:00 AM - Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)
zhaohui chen - Singapore

2. 8:25 AM - 300-mm Glass Cu MIM-based IPD Technology Development
JaeUng Lee - Amkor Technology, Inc.
Hee Nam - Amkor Technology, Inc.
JeongKyu Yang - Amkor Technology, Inc.
YoungKyu Song - Amkor Technology, Inc.

3. 8:50 AM - Board Level Reliability Enhancement of WLCSP with Large Chip Size
Pei-Haw Tsao - Taiwan Semiconductor Manufacturing Company
T. H. Lu - Taiwan Semiconductor Manufacturing Company
T. M. Chen - Taiwan Semiconductor Manufacturing Company
K. C. Chang - Taiwan Semiconductor Manufacturing Company
C. M. Kuo - Taiwan Semiconductor Manufacturing Company
M. J. Lii - Taiwan Semiconductor Manufacturing Company
L. H. Chu - Taiwan Semiconductor Manufacturing Company

4. 10:00 AM - Controlling Underfill Lateral Flow to Improve Component Density in Heterogeneously Integrated Packaging Systems
Christophe Faucher-Courchesne - Université de Sherbrooke
David Danovitch - Université de Sherbrooke
Lise Brault - IBM Corporation
Marie-Claude Paquet - IBM Corporation
Eric Turcotte - IBM Corporation

5. 10:25 AM - Dual-Carrier Process using Mechanical and Laser Release Technologies for Fan-Out Wafer-Level Packaging
Michelle Fowler - Brewer Science
Ram Trichur - Brewer Science
John Massey - Brewer Science
Matt Koch - Brewer Science

6. 10:50 AM - Optimization of Electrodeposited Copper for Sub 5 µm L/S RDL Lines by Plating Additives
Ralf Schmidt - Atotech Deutschland GmbH

7. 11:15 AM - UBM/RDL Deposition by PVD for FOWLP in high volume production
Chris Jones - SPTS Technologies Ltd
Stephen Burgess - SPTS Technologies Ltd