Technical Program

Friday, June 01, 2018

Session 27: Automotive and Power Electronics
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Harbor Island 3

Session Co-Chairs:

Young-Gon Kim
Integrated Device Technology, Inc.
T +1-408-360-1545
young.kim@idt.com
Subhash L. Shinde
Notre Dame University
T +1-574-631-1425
sshinde@nd.edu

Papers:

1. 8:00 AM - Embedded Components for High Temperature Automotive Applications
Stephanie Groß - Continental
Bernhard Schuch - Continental
Wolfgang Grübl - Continental

2. 8:25 AM - New Failure Mechanism in High Temperature Resin Materials
Michael Guyenot - Robert Bosch GmbH
D. Maas - Robert Bosch GmbH
Roumen Ratchev - Robert Bosch GmbH
Ali Khoshamouz - Schweizer Electronic AG
Thomas Gottwald - Schweizer Electronic AG
Sascha Kreuer - Isola Group

3. 8:50 AM - Next Generation of Automotive Radar with Leading-edge Advances in SiGe Devices and Glass Panel Fan-Out Packaging
Tailong Shi - Georgia Institute of Technology
Yunyi Gong - Georgia Institute of Technology
Chintan Buch - Georgia Institute of Technology
Siddharth Ravichandran - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
John D. Cressler - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

4. 10:00 AM - Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics
Kremena Vladimirova - CEA-LETI
Julie Widiez - CEA-LETI
Bastien Letowski - CEA-LETI
Pierre Perreau - CEA-LETI
Gregory Enyedi - CEA-LETI
Perceval Coudrain - CEA-LETI
Nicolas Rouger - CNRS-G2ELab
Jean-Christophe Crebier - CNRS-G2ELab

5. 10:25 AM - Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Bianca Boettge - Fraunhofer IMWS
Falk Naumann - Fraunhofer IMWS
Sandy Klengel - Fraunhofer IMWS
Stefan Behrendt - FuE-Zentrum FH Kiel GmbH
Stefan Kaessner - Robert Bosch GmbH
Markus Scheibel - Heraeus Deutschland GmbH & Co. KG
M. Petzold - Fraunhofer IMWS
K. G. Nickel - University of Tuebingen
G. Hejtmann - Robert Bosch GmbH
A.-Z. Miric - Heraeus Deutschland GmbH & Co. KG
R. Eisele - FuE-Zentrum FH Kiel GmbH

6. 10:50 AM - Mechanism of Ultrasonic-Assisted Sintering of Cu@Ag NPs Paste in Air for High-Temperature Power Device Packaging
Hongjun Ji - Harbin Institute of Technology (Shenzhen)
Mingyu Li - Harbin Institute of Technology (Shenzhen)

7. 11:15 AM - Design Consideration of a 3D Stacked Power Supply on Chip
Kota Ono - Kyushu Institute of Technology
Kengo Hiura - Kyushu Institute of Technology
Satoshi Matsumoto - Kyushu Institute of Technology