Technical Program

Friday, June 01, 2018

Session 28: High Speed and High Bandwidth Packaging
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components
Room: Nautilus 1 & 2

Session Co-Chairs:

Rockwell Hsu
Cisco Systems, Inc.
T +1-480-612-1469
rohsu@cisco.com
Zhaoqing Chen
IBM Corporation
T +1-845-435-5595
zhaoqing@us.ibm.com

Papers:

1. 8:00 AM - Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon Interconnect Fabric
SivaChandra Jangam - University of California, Los Angeles
Adeel Ahmed Bajwa - University of California, Los Angeles
Kannan Kalappurakal Thankappan - University of California, Los Angeles
Premsagar Kittur - University of California, Los Angeles
Subramanian Srikantes Iyer - University of California, Los Angeles

2. 8:25 AM - Design and Performance Challenges of High Bandwidth Memory Interface on Organic Fan-Out Interposer
Vadim Heyfitch - Xilinx, Inc
Shen Dong - Xilinx, Inc
Nanju Na - Xilinx, Inc
Hong Shi - Xilix, Inc
Jaspreet Gandhi - Xilinx, Inc
Jane Xi - Xilinx, Inc
Susan Wu - Xilinx, Inc

3. 8:50 AM - Performance (SI/PI/Thermal) Analysis of Novel 2.5D TSV-Less Packages (RDL Interposer on Panel Level Process)
Se-Ho You - Samsung Electronics Company, Ltd.
Seonghwan Jeon - Samsung Electronics Company, Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Company, Ltd

4. 10:00 AM - FCBGA fundamental technology realizing 56 Gbps PAM-4 system with 50cm electric transmission
Kazuyuki Nakagawa - Renesas Electronics Corporation
Norio Chujo - Hitachi, Ltd.
Masayoshi Yagyu - Hitachi, Ltd.
Yutaka Uematsu - Hitachi, Ltd.
Keita Tsuchiya - Renesas Electronics Corporation
Shinji Katayama - Renesas Electronics Corporation
Yoshiaki Sato - Renesas Electronics Corporation
Hiroyuki Uchida - Renesas Electronics Corporation
Shinji Baba - Renesas Electronics Corporation

5. 10:25 AM - Desensitization Design and Analysis for Highly Integrated RFSoC and DRAM Stack-Die Design
Sheng Mou Lin - Mediatek, Inc.
Chih-Chun Hsu - Mediatek, Inc.
Yi-An Hsu - Mediatek, Inc.
Fu-Yi Han - Mediatek, Inc.
Duen-Yi Ho - Mediatek, Inc.
Wen-Chou Wu - Mediatek, Inc.
Nan-Cheng Chen - Mediatek, Inc.

6. 10:50 AM - Thermal stability of Cu/Co metaconductor and its millimeter wave applications
Timothy Clingenpeel - University of Florida
Seahee Hwangbo - University of Florida
Yong-Kyu Yoon - University of Florida

7. 11:15 AM - Comparative study on electrical performance of eWLB, M-series and Fan-out chip last
Chih-Yi Huang - ASE
Tsun-Lung Hsieh - ASE
Chen-Chao Wang - ASE
Sheng-Chi Hsieh - ASE
Ming-Fong Jhong - ASE