Technical Program

Friday, June 01, 2018

Session 28: High-Speed and High-Bandwidth Packaging
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components
Room: Nautilus 1 & 2

Session Co-Chairs:

Rockwell Hsu
Cisco Systems, Inc.
T +1-480-612-1469
rohsu@cisco.com
Zhaoqing Chen
IBM Corporation
T +1-845-435-5595
zhaoqing@us.ibm.com

Papers:

1. 8:00 AM - Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon Interconnect Fabric
SivaChandra Jangam - University of California, Los Angeles
Adeel Ahmed Bajwa - University of California, Los Angeles
Kannan Kalappurakal Thankappan - University of California, Los Angeles
Premsagar Kittur - University of California, Los Angeles
Subramanian Srikantes Iyer - University of California, Los Angeles

2. 8:25 AM - High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design
Vadim Heyfitch - Xilinx, Inc.
Shen Dong - Xilinx, Inc.
Nanju Na - Xilinx, Inc.
Hong Shi - Xilinx Inc.
Jaspreet Gandhi - Xilinx, Inc.
Jane Xi - Xilinx, Inc.
Susan Wu - Xilinx, Inc.

3. 8:50 AM - Advanced Fan-Out Package Performance (SI/PI/Thermal) Performance Analysis of Novel RDL Packages
Se-Ho You - Samsung Electronics Company, Ltd.
Seonghwan Jeon - Samsung Electronics Company, Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Company, Ltd.
Kilsoo Kim - Samsung Electronics Company, Ltd.
Jaechoon Kim - Samsung Electronics Company, Ltd.
Seung-Yong Cha - Samsung Electronics Company, Ltd.
Gyoungbum Kim - Samsung Electronics Company, Ltd.

4. 10:00 AM - FCBGA Fundamental Technology Realizing 56 Gbps PAM-4 System with 50 cm Electric Transmission
Kazuyuki Nakagawa - Renesas Electronics Corporation
Norio Chujo - Hitachi, Ltd.
Masayoshi Yagyu - Hitachi, Ltd.
Yutaka Uematsu - Hitachi, Ltd.
Keita Tsuchiya - Renesas Electronics Corporation
Shinji Katayama - Renesas Electronics Corporation
Yoshiaki Sato - Renesas Electronics Corporation
Hiroyuki Uchida - Renesas Electronics Corporation
Shinji Baba - Renesas Electronics Corporation

5. 10:25 AM - Desensitization Design and Analysis for Highly Integrated RFSoC and DRAM Stacked-Die Design
Sheng Mou Lin - Mediatek, Inc.
Chih-Chun Hsu - Mediatek, Inc.
Yi-An Hsu - Mediatek, Inc.
Fu-Yi Han - Mediatek, Inc.
Duen-Yi Ho - Mediatek, Inc.
Wen-Chou Wu - Mediatek, Inc.
Charles Nan-Cheng Chen - Mediatek, Inc.

6. 10:50 AM - Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications
Timothy Clingenpeel - University of Florida
Seahee Hwangbo - University of Florida
Nicolas Garraud - University of Florida
David Arnold - University of Florida
Yong-Kyu Yoon - University of Florida

7. 11:15 AM - Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last
Chih-Yi Huang - Advanced Semiconductor Engineering Inc.
Tsun-Lung Hsieh - Advanced Semiconductor Engineering Inc.
Po-Chih Pan - Advanced Semiconductor Engineering Inc.
Ming-Fong Jhong - Advanced Semiconductor Engineering Inc.
Chen-Chao Wang - Advanced Semiconductor Engineering Inc.
Sheng-Chi Hsieh - Advanced Semiconductor Engineering Inc.