Technical Program
Friday, June 01, 2012
Session 29: Novel Approaches in Wafer Level Manufacturing
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Nautilus 3
Session Co-Chairs:
|
Shichun Qu Fairchild Semiconductor T 408-822-2064 F shichun.qu@fairchildsemi.com |
Jie Xue Cisco Systems, Inc. T +1-408-853-0199 F jixue@cisco.com |
Papers:
1. 8:00 AM - Wafer Level Underfill for Area Array Cu Pillar Flip Chip Packaging of Ultra Low-k Chips on Organic Substrates
Jae-Woong Nah - IBM Corporation
Michael Gaynes - IBM Corporation
Eric Perfecto - IBM Corporation
Claudius Feger - IBM Corporation
2. 8:25 AM - Metrology for Characterization of Wafer Thickness Uniformity during 3DS-IC Processing
Tom Dunn - Corning, Inc.
Chris Lee - Corning, Inc.
Mark Tronolone - Corning, Inc.
Aric Shorey - Corning, Inc.
3. 8:50 AM - Novel Sidewall Interconnection using Perpendicular Circuit Die with Non-Solder Bumps for 3D Chip Stack
Sun-Rak Kim - KAIST
Il Kim - KAIST
Jae Hak Lee - KIMM
Seung S. Lee - KAIST
4. 10:00 AM - Advanced Low Profile PoP Solution with Embedded Wafer Level PoP (eWLB-PoP) Technology
Seung Wook Yoon - STATS ChipPAC, Ltd.
Jose Alvin Caparas - STATS ChipPAC, Ltd.
Yaojian Lin - STATS ChipPAC, Ltd.
Pandi C. Marimuthu - STATS ChipPAC, Ltd.
5. 10:25 AM - Temporary Wafer Bonding Defect Impact Assessment on Substrate Thinning: Process Enhancement through Systematic Defect Track Down
A. Phommahaxay - IMEC
G. Verbinnen - IMEC
S. Suhard - IMEC
P. Bex - IMEC
J. Pancken - IMEC
M. Lismont - IMEC
A. Van den Eede - IMEC
A. Jourdain - IMEC
T. Woitke - Suss MicroTec
P. Bisson - Suss MicroTec
W. Spiess - Suss MicroTec
B. Swinnen - IMEC
6. 10:50 AM - Novel Approaches of Wafer Level Packaging for MEMS Devices
Cheng-Hsiang Liu - Siliconware Precision Industries Co., Ltd.
Hong-Da Chang - Siliconware Precision Industries Co., Ltd.
Hsin-Yi Liao - Siliconware Precision Industries Co., Ltd.
Kuo-Hsiang Li - Siliconware Precision Industries Co., Ltd.
Chen-Han Lin - Siliconware Precision Industries Co., Ltd.
Wei-Yu Chen - Siliconware Precision Industries Co., Ltd.
Tse-Yuan Lin - Siliconware Precision Industries Co., Ltd.
7. 11:15 AM - Silicon-Based System in Packaging for Light Emitting Diodes
Bin Cao - Huazhong University of Science & Technology
Shan Yu - Huazhong University of Science & Technology
Huai Zheng - Huazhong University of Science & Technology
Sheng Liu - Huazhong University of Science & Technology
