Technical Program

Wednesday, May 30, 2018

Session 3: 3D Design, Assembly and Additive Manufacturing
8:00 AM - 11:40 AM
Committee: Emerging Technologies
joint with Advanced Packaging
Room: Harbor Island 3

Session Co-Chairs:

Benson Chan
Binghamton University
T +1-607-777-4349
chanb@binghamton.edu
John Knickerbocker
IBM Corporation
T +1-914-945-3306
knickerj@us.ibm.com

Papers:

1. 8:00 AM - Novel Failure Analysis Techniques for 1.8 µm pitch Wafer-to-Wafer Bonding
Christian Schmidt - Carl Zeiss SMT
Ingrid De Wolf - IMEC
Soon-Wook Kim - IMEC
Eric Beyne - IMEC
Lorenz Lechner - Carl Zeiss SMT

2. 8:25 AM - Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
Mark Schultz - IBM Corporation
Cyril Cabral - IBM Corporation
Cornelia Tsang Yang - Raytheon
Joana Maria - IBM Corporation
Paul Andry - IBM Corporation

3. 8:50 AM - Assembly Process Development of an Ultra Large-Scale 3D Stacking with Transmisson Circuits via TSV
Shunichi Kikuchi - Fujitsu Limited
Hidehiko Kira - Fujitsu Limited
Makoto Suwada - Fujitsu Limited
Tatsumi Nakada - Fujitsu Limited
Naoaki Nakamura - Fujitsu Advanced Technologies Limited
Norio Kainuma - Fujitsu Advanced Technologies Limited
Kazuhiro Kanai - Fujitsu Advanced Technologies Limited
Takumi Masuyama - Fujitsu Advanced Technologies Limited

4. 10:00 AM - The Principles of “Smart” Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar Applications
Bijan Tehrani - Georgia Institute of Technology
Ryan Bahr - Georgia Institute of Technology
Daniel Revier - Texas Instruments, Inc.
Benjamin Cook - Texas Instruments, Inc.
Manos Tentzeris - Georgia Institute of Technology

5. 10:25 AM - A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process
Gabrielle Aspar - CEA-LETI
Baptiste Goubault de Brugiere - CEA-LETI
Jean-Charles Souriau - CEA-LETI
Laetitia Castagne - CEA-LETI
Gilles Simon - CEA-LETI
Lea Di Cioccio - CEA-LETI
Yves Brechet - CEA

6. 10:50 AM - 3D Printed Substrate Integrated Waveguide RF Circuits
Vincens Gjokaj - Michigan State University
Premjeet Chahal - Michigan State University

7. 11:15 AM - Self-Powered, Inkjet Printed Electrochromic Films On Flexible and Stretchable Substrate for Wearable Electronics Applications
Ebraheem Azhar - Arizona State University
Hongbin Yu - Arizona State University