Technical Program

Wednesday, May 30, 2018

Session 3: 3D Design, Assembly and Additive Manufacturing
8:00 AM - 11:40 AM
Committee: Emerging Technologies
joint with Packaging Technologies
Room: Harbor Island 3

Session Co-Chairs:

Benson Chan
Binghamton University
T +1-607-777-4349
chanb@binghamton.edu
John Knickerbocker
IBM Corporation
T +1-914-945-3306
knickerj@us.ibm.com

Papers: