Technical Program

Friday, June 01, 2018

Session 31: Advanced Wirebond and Interconnect Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Harbor Island 1

Session Co-Chairs:

Li Li
Cisco Systems, Inc.
T +1-408-527-0801
Bernd Ebersberger
Intel Corporation
T +49-89-998853-23281


1. 1:30 PM - Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C Range
Michael Hook - University of Waterloo
Stevan Hunter - ON Semiconductor
Michael Mayer - University of Waterloo

2. 1:55 PM - Molecular Dynamics Simulation of Microwelds Formation and Breakage During Ultrasonic Copper Wire Bonding
Yangyang Long - Leibniz Universität Hannover
Bo He - Leibniz Universität Hannover
Weizhe Cui - Leibniz Universität Hannover
Xiaoying Zhuang - Leibniz Universität Hannover
Jens Twiefel - Leibniz Universität Hannover

3. 2:20 PM - Investigation for Highly Reliable Free Air Ball Formation for Silver Wire
Noritoshi Araki - Nippon Micrometal Corporation
Ryo Oishi - Nippon Micrometal Corporation
Takashi Yamada - Nippon Micrometal Corporation
Yasutomo Ichiyama - Nippon Steel & Sumikin Technology

4. 3:30 PM - Corrosion Mechanisms of Cu Wire Bonding on Al Pads
Wentao Qin - ON Semiconductor
Harold Anderson - ON Semiconductor
Tom Anderson - ON Semiconductor
George Chang - ON Semiconductor
Denise Barrientos - ON Semiconductor

5. 3:55 PM - Low Temperature Solder – A Breakthrough Technology for Surface Mounted Devices
Shubhada Sahasrabudhe - Intel Corporation
Scott Mokler - Intel Corporation
Mukul Renavikar - Intel Corporation
Sandeep Sane - Intel Corporation
Eric Brigham - Intel Corporation
Kevin Byrd - Intel Corporation
Owen Jin - Intel Corporation
Pubudu Goonetilleke - Intel Corporation
Nilesh Badwe - Intel Corporation
Satish Parupalli - Intel Corporation

6. 4:20 PM - Advances in Wire Bonding Technology to Overcome Resonance Conditions
Aashish Shah - Kulicke and Soffa Industries, Inc.
Gary Schulze - Kulicke and Soffa Industries, Inc.
Jon Brunner - Kulicke and Soffa Industries, Inc.
Ivy Qin - Kulicke and Soffa Industries, Inc.
Bob Chylak - Kulicke and Soffa Industries, Inc.
Nelson Wong - Kulicke and Soffa Industries, Inc.

7. 4:45 PM - 3-D Antenna-in-Package Design with Metallic Coating Technology
Chih-Chun Hsu - Mediatek, Inc.
Sheng Mou Lin - Mediatek, Inc.
Ying-Chih Chen - Mediatek, Inc.
Che-Ya Chou - Mediatek, Inc.
Wen-Chou Wu - Mediatek, Inc.
Gavin Kao - Advanced Semiconductor Engineering, Inc
Chen-Chao Wang - Advanced Semiconductor Engineering, Inc
Charles Nan-Cheng Chen - Mediatek, Inc.