Technical Program
Friday, May 31, 2013
Session 31: TSV Innovation and Implementation
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Mont-Royal 1
Session Co-Chairs:
|
Gilles Poupon CEA-LETI T +33-438-785-399 gilles.poupon@cea.fr |
Wei-Chung Lo ITRI T +886-3-591-7024 lo@itri.org.tw |
Papers:
1. 1:30 PM - Through Si Vias Using Liquid Metal Conductors for Reworkable 3D Electronics
George A. Hernandez - Auburn University
Daniel Martinez - Auburn university
Charles Ellis - Auburn University
Michael Palmer - Auburn University
Michael C. Hamilton - Auburn University
2. 1:55 PM - Backside TSV Protrusions Induced by Thermal Shock and Thermal Cycling
Dingyou Zhang - Rensselaer Polytechnic Institute
Klaus Hummler - SEMATECH
Larry Smith - SEMATECH
James Jian-Qiang Lu - Rensselaer Polytechnic Institute
3. 2:20 PM - Microstructure Investigation of TSV Copper Film
W.N. Putra - Institute of Microelectronics (A*STAR), Nanyang Technological University
H.Y. Li - Institute of Microelectronics (A*STAR)
A.D. Trigg - Institute of Microelectronics (A*STAR)
C.L. Gan - Nanyang Technological University
4. 3:30 PM - Via-Middle Through-Silicon Via with Integrated Airgap to Zero TSV-Induced Stress Impact on Device Performance
Yann Civale - IMEC
Stefaan Van Huylenbroeck - IMEC
Augusto Redolfi - IMEC
Wei Guo - IMEC
Khashayar Babaei - IMEC
Patrick Jaenen - IMEC
Antonio La Manna - IMEC
Gerald Beyer - IMEC
Bart Swinnen - IMEC
Eric Beyne - IMEC
5. 3:55 PM - Design and Fabrication of Ultra Low-Loss, High-Performance 3D Chip-Chip Air-Clad Interconnect Pathway
Erdal Uzunlar - Georgia Institute of Technology
Rohit Sharma - Indian Institute of Technology Ropar
Rajarshi Saha - Georgia Institute of Technology
Vachan Kumar - Georgia Institute of Technology
Rizwan Bashirullah - University of Florida
Azad Naeemi - Georgia Institute of Technology
Paul A. Kohl - Georgia Institute of Technology
6. 4:20 PM - Development of Ultra-Low Capacitance Through-Silicon-Vias (TSVs) with Air-Gap Liner
Qianwen Chen - Tsinghua University
Cui Huang - Tsinghua University
Zheyao Wang - Tsinghua University
7. 4:45 PM - TSV Development, Characterization and Modeling for 2.5-D Interposer Applications
J.R. Tenailleau - IPDIA
A. Brunet - CEA-LETI
S. Borel - CEA-LETI
F. Voiron - IPDIA
C. Bunel - IPDIA
