Technical Program

Friday, June 01, 2018

Session 32: Heterogeneous Integration
1:30 PM - 5:10 PM
Committee: Advanced Packaging
Room: Harbor Island 2

Session Co-Chairs:

Luke England
GLOBALFOUNDRIES
T +1-518-222-1860
luke.england@globalfoundries.com
Kuldip Johal
Atotech
T +18033700669
kuldip.johal@atotech.com

Papers:

1. 1:30 PM - Air-Gap Redistribution Layer (A-RDL) in 3DIC
Wei-Heng Lin - Taiwan Semiconductor Manufacturing Company, TSMC
Wen-Lin Shih - Taiwan Semiconductor Manufacturing Company, TSMC
Chung-Jung Wu - Taiwan Semiconductor Manufacturing Company, TSMC
Tony Shao - Taiwan Semiconductor Manufacturing Company, TSMC
Chih-Hang Tung - Taiwan Semiconductor Manufacturing Company, TSMC
Douglas Yu - Taiwan Semiconductor Manufacturing Company, TSMC

2. 1:55 PM - Heterogeneous Integration Challenges within Wafer Level Fan-Out SiPs for Wearables and IoT
Alberto Martins - Amkor Technology, Inc.
Rui Pedro Silva - Amkor Technology, Inc.
Marcio Pinheiro - Amkor Technology, Inc.
Ana Filipa Ferreira - Amkor Technology, Inc.
Rodrigo Almeida - Amkor Technology, Inc.
Hugo Barros - Amkor Technology, Inc.
Cesar Oliveira - Amkor Technology, Inc.
Filipe Matos - Amkor Technology, Inc.
Joana Oliveira - Amkor Technology, Inc.

3. 2:20 PM - Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-Chip and 3D System Integration
Shuying Ma - Huantian Technology (Kunshan) Electronics Co., Ltd.
Jiao Wang - Huantian Technology (Kunshan) Electronics Co., Ltd.
Fengxia Zhen - Huantian Technology (Kunshan) Electronics Co., Ltd.
Zhiyi Xiao - Huantian Technology (Kunshan) Electronics Co., Ltd.
Teng Wang - Huantian Technology (Kunshan) Electronics Co., Ltd.
Daquan Yu - Huantian Technology (Kunshan) Electronics Co., Ltd.

4. 3:30 PM - “Hole-in-one TSV”, a new via last concept for high density 3DSOC interconnects.
Joeri De Vos - IMEC
Stefaan Van Huylenbroeck - IMEC
Anne Jourdain - IMEC
Nancy Heylen - IMEC
Lan Peng - IMEC
Geraldine Jamieson - IMEC
Nina Tutunjyan - IMEC
Stefano Sardo - IMEC
Andy Miller - IMEC
Eric Beyne - IMEC

5. 3:55 PM - Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based Interconnects
Amir Hanna - University of California Los Angeles
Tak Fukushima - University of California Los Angeles
Arsalan Alam - University of California Los Angeles
Steven Moran - University of California Los Angeles
William Whitehead - University of California Los Angeles
Siva Jangam - University of California Los Angeles
Adeel Bajwa - University of California Los Angeles
Subramanian Iyer - University of California Los Angeles

6. 4:20 PM - Heterogeneous Multi-Die Stitching Technology Enabled by Fine-Pitch Compressible MicroInterconnects (CMIs)
Paul Jo - Georgia Institute of Technology
Md Obaidul Hossen - Georgia Institute of Technology
Xuchen Zhang - Georgia Institute of Technology
Yang Zhang - Georgia Institute of Technology
Muhannad Bakir - Georgia Institute of Technology

7. 4:45 PM - Heterogeneous Integration Technology Demonstrations For Healthcare & IoT Computing Systems
John Knickerbocker - IBM
Paul Andry - IBM
Russell Budd - IBM
Qianwen Chen - IBM
Evan Colgan - IBM
Bing Dang - IBM
Jeff Gelorme - IBM
Li-wen Hung - IBM
Shriya Kumar - IBM
Paul Lauro - IBM