Technical Program

Friday, June 01, 2018

Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Harbor Island 3

Session Co-Chairs:

Praveen Pandojirao-S
Johnson & Johnson
T +1-904-443-1691
praveen@its.jnj.com
Qianwen Chen
IBM Research
T +1-914-945-1612
chenq@us.ibm.com

Papers:

1. 1:30 PM - Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications
Anne Jourdain - IMEC
Joeri De Vos - IMEC
Nouredine Rassoul - IMEC
Houman Zahedmanesh - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC
Edward Walsby - SPTS
Jash Patel - SPTS
Oliver Ansell - SPTS
Huma Ashraf - IMEC

2. 1:55 PM - Development of a Polyimide/SiC-Whisker/Nano-Particles Composite with High Thermal Conductivity and Low Coefficient of Thermal Expansion as Dielectric Layer for Interposer Application
Yunna Sun - Shanghai Jiao Tong University
Jiangbo Luo - Shanghai Jiao Tong University
Zhuoqing Yang - Shanghai Jiao Tong University
Yan Wang - Shanghai Jiao Tong University
Guifu Ding - Shanghai Jiao Tong University
Zhenqian Wang - Clemson University

3. 2:20 PM - An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages
Daichi Okamoto - Taiyo Ink
Yoko Shibasaki - Taiyo Ink
Daisuke Shibata - Taiyo Ink
Tadahiko Hanada - Taiyo Ink
Fuhan Liu - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

4. 3:30 PM - Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking
Shizu Fukuzumi - Hitachi Chemical Co.,Ltd.
Hitoshi Onozeki - Hitachi Chemical Co.,Ltd.
Naoya Suzuki - Hitachi Chemical Co.,Ltd.
Toshihisa Nonaka - Hitachi Chemical Co.,Ltd.

5. 3:55 PM - Reliability Studies of 5 ┬Ám Diameter Photo Vias with Daisy Chain Resistance Using Dry Film Photosensitive Dielectric Material
Atsushi Kubo - Tokyo Ohoka Kogyo Co., Ltd.
Chandrasekharan Nair - Georgia Institute of Technology
Bartlet DeProspo - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Tomoyuki Ando - Tokyo Ohoka Kogyo Co., Ltd.
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

6. 4:20 PM - Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration applications
Asisa Kumar Panigrahi - Koneru Lakshmaiah Education Foundation- Hyderabad
Hemanth Kumar Cheemalamarri - Indian Institute of Technology Hyderabad
Satish Bonam - Indian Institute of Technology Hyderabad
Brince Paul K - Indian Institute of Technology Hyderabad
Tamal Ghosh - Indian Institute of Technology Hyderabad
Nirupam Paul - Indian Institute of Technology Hyderabad
Siva Rama Krishna Vanjari - Indian Institute of Technology Hyderabad
Shiv Govind Singh - Indian Institute of Technology Hyderabad

7. 4:45 PM - Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Wagno Alves Braganca Junior - Electronics and Telecommunications Research Institute
Leeseul Jeong - Electronics and Telecommunications Research Institute
Keon-Soo Jang - Electronics and Telecommunications Research Institute
Seok Hwan Moon - Electronics and Telecommunications Research Institute
Hyun-Cheol Bae - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Min Kyo Cho - Beyond! Technology Innovator
Seung Il Chang - Beyond! Technology Innovator