Technical Program

Friday, June 01, 2018

Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Harbor Island 3

Session Co-Chairs:

Praveen Pandojirao-S
Johnson & Johnson
T +1-904-443-1691
praveen@its.jnj.com
Qianwen Chen
IBM Research
T +1-914-945-1612
chenq@us.ibm.com

Papers: