Technical Program

Friday, June 01, 2018

Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Harbor Island 3

Session Co-Chairs:

Praveen Pandojirao-S
Johnson & Johnson
T +1-904-443-1691
Yu-Hua Chen
T +886-3-5995899#2109


1. 1:30 PM - Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Anne Jourdain - IMEC
Joeri De Vos - IMEC
Nouredine Rassoul - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC
Edward Walsby - SPTS
Jash Patel - SPTS
Oliver Ansell - SPTS
Huma Ashraf - SPTS
Dave Thomas - SPTS
Andy Miller - IMEC

2. 1:55 PM - Development of a Polyimide/SiC-whisker/nano-particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application
Yunna Sun - Shanghai Jiao Tong University
Jiangbo Luo - Shanghai Jiao Tong University
Zhenqian Wang - Clemson University
Yan Wang - Shanghai Jiao Tong University
Zhuoqing Yang - Shanghai Jiao Tong University
Guifu Ding - Shanghai Jiao Tong University

3. 2:20 PM - An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages
Daichi Okamoto - Taiyo Ink
Yoko Shibasaki Daisuke Shibata Tadahiko Hanada Fuhan Liu Venky Sundaram Rao Tummala

4. 3:30 PM - Highly productive solder interconnect formation by bump stabbing for 3D-TSV die stacking
Shizu Fukuzumi - Hitachi Chemical Co.,Ltd
Hitoshi Onozeki - Hitachi Chemical Co.,Ltd
Naoya Suzuki - Hitachi Chemical Co.,Ltd
Toshihisa Nonaka - Hitachi Chemical Co.,Ltd

5. 3:55 PM - Reliability studies of 5 ┬Ám diameter photo vias with daisy chain resistance using dry film photosensitive dielectric material
Atsushi Kubo - Tokyo Ohoka Kogyo Co., LTD.
Chandrasekharan Nair - Georgia Institute of Technology
Bartlet DeProspo - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Tomoyuki Ando - Tokyo Ohoka Kogyo Co., LTD.
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

6. 4:20 PM - Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and Heterogeneous Integration applications
Asisa Kumar Panigrahi - Koneru Lakshmaiah Education Foundation- Hyderabad
Hemanth Kumar Cheemalamarri - Indian Institute of Technology Hyderabad
Satish Bonam - Indian Institute of Technology Hyderabad
Tamal Ghosh - Indian Institute of Technology Hyderabad
Nirupam Paul - Indian Institute of Technology Hyderabad
Siva Rama Krishna Vanjari - Indian Institute of Technology Hyderabad
Shiv Govind Singh - Indian Institute of Technology Hyderabad

7. 4:45 PM - Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
Kwang-Seong Choi - ETRI
leeseul Jeong - ETRI
Keon-Soo Jang - ETRI
Seok Hwan Moon - ETRI
Hyun-Cheol Bae - ETRI
Yong-Sung Eom - ETRI