Technical Program

Friday, June 01, 2018

Session 34: Fan-Out Wafer Level Package Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Nautilus 1 & 2

Session Co-Chairs:

Darvin R. Edwards
Edwards Enterprise Consulting, LLC
T +1-972-571-7638
darvin.edwards1@gmail.com
Pilin Liu
Intel Corporation
T +1-480-552-3020
pilin.liu@intel.com

Papers: