Technical Program
Friday, May 31, 2013
Session 34: New Developments in Wirebond Technology
1:30 PM - 5:10 PM
Committee: Assembly & Manufacturing Technology
Room: Nolita 2
Session Co-Chairs:
|
Jie Xue Cisco Systems, Inc. T +1-408-853-0199 jixue@cisco.com |
Changqing Liu Loughborough University T +44-1509-227681 C.Liu@lboro.ac.uk |
Papers:
1. 1:30 PM - Investigation of Charge Induced Bond Pad Corrosion
Pei-Haw Tsao - Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Yu Chiu - Taiwan Semiconductor Manufacturing Company, Ltd.
H.C. Liao - Taiwan Semiconductor Manufacturing Company, Ltd.
K.C. Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
M.C. Sung - Taiwan Semiconductor Manufacturing Company, Ltd.
Worth Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
Antai Xu - Taiwan Semiconductor Manufacturing Company, Ltd.
2. 1:55 PM - Effects of Bond Pad Probing for Cu Wire Bond Packages
John D. Beleran - United Test and Assembly Center, Ltd. (UTAC)
Gaurav Mehta - United Test and Assembly Center, Ltd. (UTAC)
Ninoy Milanes II - United Test and Assembly Center, Ltd. (UTAC)
Nathapong Suthiwongsunthorn - United Test and Assembly Center, Ltd. (UTAC)
Eu Jin Lee - GobalFoundries
3. 2:20 PM - A Study of Free Air Ball Formation in Palladium-Coated Copper and Bare Copper Bonding Wire
Noritoshi Araki - Nippon Micrometal Corporation
Yasutomo Ichiyama - Nippon Steel Technoresearch Corporation
Ryo Oishi - Nippon Micrometal Corporation
Takashi Yamada - Nippon Micrometal Corporation
4. 3:30 PM - Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and Prototyping
Brian J. Lewis - Engent, Inc.
Daniel F. Baldwin - Engent, Inc.
Paul N. Houston - Engent, Inc.
Fei Xie - Engent, Inc.
Le Hang La - Engent, Inc.
5. 3:55 PM - Low Cost Silver Alloy Wire Bonding with Excellent Reliability Performance
C.H. Cheng - Elite Semiconductor Memory Technology, Inc.
H.L. Hsiao - Tunghai University
S.I. Chu - Elite Semiconductor Memory Technology, Inc.
Y.Y. Shieh - Elite Semiconductor Memory Technology, Inc.
C.Y. Sun - Elite Semiconductor Memory Technology, Inc.
C. Peng - Elite Semiconductor Memory Technology, Inc.
6. 4:20 PM - Corrosion of the Cu/Al Interface in Cu-Wire-Bonded Integrated Circuits
John Osenbach - LSI Corporation
B.Q. Wang - LSI Corporation
Sue Emerich - LSI Corporation
John DeLucca - LSI Corporation
Dongmei Meng - LSI Corporation
7. 4:45 PM - Molded Reliability Study for Different Cu Wire Bonding Configurations
I. Qin - Kulicke and Soffa Industries, Inc.
H. Xu - Kulicke and Soffa Industries, Inc.
B. Milton - Kulicke and Soffa Industries, Inc.
H. Clauberg - Kulicke and Soffa Industries, Inc.
B. Chylak - Kulicke and Soffa Industries, Inc.
H. Abe - Hitachi Chemical Company, Ltd.
D. Kang - Hitachi Chemical Company, Ltd.
Y. Endo - Hitachi Chemical Company, Ltd.
M. Osaka - Hitachi Chemical Company, Ltd.
S Nakamura - Hitachi Chemical Company, Ltd.
